Global Committee Meeting Minutes

SEMI International Standards
Technical Committee Meeting Minutes


Committee Information

Global Committee: 3D Packaging and Integration
Region Meeting Was Held: North America
Regional Meeting Name: 3D Packaging and Integration


Meeting Information
Meeting Date: 12/08/2021Meeting End Date: 12/08/2021
Meeting Event: SEMICON WestMeeting Location: Moscone Center, San Francisco, CA/USA, OVTCCM


Minutes Information
Author: Laura Nguyen
Minutes Written In English?: Yes

English Minutes:[2021Dec] 3DP&I NA TC Chapter Meeting Minutes FINAL.pdf[2021Dec] 3DP&I NA TC Chapter Meeting Minutes FINAL.pdf
Attachments:[2021West] 3DP&I NA Attachments.zip[2021West] 3DP&I NA Attachments.zip