Global Committee Meeting Minutes

SEMI International Standards
Technical Committee Meeting Minutes


Committee Information

Global Committee: 3D Packaging and Integration
Region Meeting Was Held: Japan
Regional Meeting Name: 3D Packaging and Integration


Meeting Information
Meeting Date: 03/15/2023Meeting End Date: 03/15/2023
Meeting Event: Japan Spring MeetingsMeeting Location: Official Virtual TC Chapter Meeting


Minutes Information
Author: Mami Nakajo
Minutes Written In English?: Yes

English Minutes:20230315_3DPI-Japan_MeetingMinutes_final.pdf20230315_3DPI-Japan_MeetingMinutes_final.pdf
Attachments:Attachments_JA 3DPI&I_20230315.zipAttachments_JA 3DPI&I_20230315.zip