Global Committee Meeting Minutes

SEMI International Standards
Technical Committee Meeting Minutes


Committee Information

Global Committee: 3D Packaging and Integration
Region Meeting Was Held: Japan
Regional Meeting Name: 3D Packaging and Integration


Meeting Information
Meeting Date: 02/22/2019Meeting End Date:
Meeting Event: Japan Winter MeetingsMeeting Location: SEMI Japan Office - Tokyo_Japan


Minutes Information
Author: Chie Yanagisawa
Minutes Written In English?: Yes

English Minutes:20190222_3DPI-Japan_MeetingMinutes_Final.pdf20190222_3DPI-Japan_MeetingMinutes_Final.pdf
Attachments:20190222_3DPI-Japan_MeetingMinutes_Attachment.zip20190222_3DPI-Japan_MeetingMinutes_Attachment.zip