Global Committee Meeting Minutes

SEMI International Standards
Technical Committee Meeting Minutes

Committee Information

Global Committee: 3D Packaging and Integration
Region Meeting Was Held: Japan
Regional Meeting Name: 3D Packaging and Integration

Meeting Information
Meeting Date: 02/05/2018Meeting End Date:
Meeting Event: Japan Winter MeetingsMeeting Location: SEMI Japan Office - Tokyo_Japan

Minutes Information
Author: Chie Yanagisawa
Minutes Written In English?: Yes

English Minutes:20180205_3DP&I-Japan_Minutes_Draft_v2.1.pdf20180205_3DP&I-Japan_Minutes_Draft_v2.1.pdf