Global Committee Meeting Minutes

SEMI International Standards
Technical Committee Meeting Minutes

Committee Information

Global Committee: 3D Packaging and Integration
Region Meeting Was Held: Japan
Regional Meeting Name: 3D Packaging and Integration

Meeting Information
Meeting Date: 01/18/2021Meeting End Date:
Meeting Event: Japan Winter MeetingsMeeting Location: Web Conference

Minutes Information
Author: Mami Nakajo
Minutes Written In English?: Yes

English Minutes:20210118_3DPI-Japan_MeetingMinutes_final.pdf20210118_3DPI-Japan_MeetingMinutes_final.pdf
Attachments:20210118_3DP&I Japan TC Chapter Meeting Attachment.zip20210118_3DP&I Japan TC Chapter Meeting