Global Committee Meeting Minutes

SEMI International Standards
Technical Committee Meeting Minutes

Committee Information

Global Committee: 3D Packaging and Integration
Region Meeting Was Held: Japan
Regional Meeting Name: 3D Packaging and Integration

Meeting Information
Meeting Date: 01/18/2022Meeting End Date: 01/18/2022
Meeting Event: Japan Winter MeetingsMeeting Location: OVTCCM

Minutes Information
Author: Mami Nakajo
Minutes Written In English?: Yes

English Minutes:20220118_3DPI-Japan_MeetingMinutes_approved.pdf20220118_3DPI-Japan_MeetingMinutes_approved.pdf