Global Committee Meeting Minutes

SEMI International Standards
Technical Committee Meeting Minutes


Committee Information

Global Committee: 3D Packaging and Integration
Region Meeting Was Held: Japan
Regional Meeting Name: 3D Packaging and Integration


Meeting Information
Meeting Date: 12/14/2022Meeting End Date: 12/14/2022
Meeting Event: SEMICON JapanMeeting Location: Tokyo Big Sight - Tokyo_Japan


Minutes Information
Author: Mami Nakajo
Minutes Written In English?: Yes

English Minutes:20221214_3DPI-Japan_MeetingMinutes_approved.pdf20221214_3DPI-Japan_MeetingMinutes_approved.pdf
Attachments:221214_3DPI_JA_Min_Attachment.zip221214_3DPI_JA_Min_Attachment.zip