ABOUT
SMART INITIATIVES
MARKET DATA
EVENTS
STANDARDS
STORE
PRESS
Global Committee Meeting Minutes
SEMI International Standards
Technical Committee Meeting Minutes
Committee Information
Global Committee:
3D Packaging and Integration
Region Meeting Was Held:
Japan
Regional Meeting Name:
3D Packaging and Integration
Meeting Information
Meeting Date:
10/22/2021
Meeting End Date:
10/22/2021
Meeting Event:
Japan Autumn Meetings
Meeting Location:
WEB
Minutes Information
Author:
Mami Nakajo
Minutes Written In English?:
Yes
English Minutes:
20211022_3DPI-Japan_MeetingMinutes_final.pdf
Attachments:
211022_3D_Japan_Min_Attachment.zip
Back to Previous Page
Copyright ©2024 Semiconductor Equipment and Materials International (SEMI®). All rights reserved.