Global Committee Meeting Minutes

SEMI International Standards
Technical Committee Meeting Minutes


Committee Information

Global Committee: 3D Packaging and Integration
Region Meeting Was Held: Japan
Regional Meeting Name: 3D Packaging and Integration


Meeting Information
Meeting Date: 10/11/2019Meeting End Date:
Meeting Event: Japan Autumn MeetingsMeeting Location: SEMI Japan Office - Tokyo_Japan


Minutes Information
Author: Chie Yanagisawa
Minutes Written In English?: Yes

English Minutes: 20191011_3DPI-Japan_MeetingMinutes_Draft.pdf20191011_3DPI-Japan_MeetingMinutes_Draft.pdf
Attachments:20191011_3DPI-Japan_Minutes_Attachment.zip20191011_3DPI-Japan_Minutes_Attachment.zip