SEMI International Standards
Standards Locale: Japan
Committee: Assembly & Packaging
Place of Meeting: SEMI Japan office, Tokyo
Date of Meeting: 10/18/2016
Meeting End Date: 10/18/2016
Recording SEMI Standards Staff: Chie Yanagisawa
CER Posted to Web: 11/01/2016


Leadership Changes
None.

Committee Structure Changes
None.

Ballot Results

Document #
Document Title
Committee Action
A&R Forms for Approved Ballots
6031Revision to SEMI G21-94: SPECIFICATION FOR PLATING INTEGRATED CIRCUIT LEADFRAMESPassed as balloted
Superclean		#6031_LetterBallotReviewSheet_G21.pdf#6031_LetterBallotReviewSheet_G21.pdf
6032Revision to SEMI G41-87: SPECIFICATION FOR DUAL STRIP SOIC LEADFRAMEPassed as balloted
Superclean		#6032_LetterBallotReviewSheet_G41.pdf#6032_LetterBallotReviewSheet_G41.pdf
6027Line Item Revision to SEMI G86-0303 (Reapproved 0811):
TEST METHOD FOR MEASUREMENT OF CHIP (DIE) STRENGTH BY MEAN OF 3-POINT BENDING
--
#6027_LineItemLetterBallotReviewSheet_G86.pdf#6027_LineItemLetterBallotReviewSheet_G86.pdf
Line Item 1Add SEMI G96 to § 3 as a referenced StandardPassed as balloted
Superclean
--
Line Item 2Add a note to ¶ 8.2 in order to clarify the conditions of the procedurePassed as balloted
Superclean
--
6029Reapproval of SEMI G88-0211: SPECIFICATION FOR TAPE FRAME FOR 450 mm WAFERPassed as balloted#6029_LetterBallotReviewSheet_disco_G88.pdf#6029_LetterBallotReviewSheet_disco_G88.pdf
6028Line Item Revision to SEMI G97-0116: SPECIFICATION FOR ADHESIVE TRAY USED FOR THIN CHIP HANDLING
--
#6028_LineItemLetterBallotReviewSheet_G97.pdf#6028_LineItemLetterBallotReviewSheet_G97.pdf
Line Item 1Modify the Figure 3, Figure 9 and Table 2 in order to clarify the original drawingsPassed as balloted
Superclean
--
Note 1:
Passed ballots and line items will be submitted to the ISC Audit & Review Subcommittee for procedural review.
Failed ballots and line items were returned to the originating task forces for re-work and re-balloting.

Ratification Ballot Results
None.

Activities Approved by the GCS between meetings of TC Chapter meeting
None.

Authorized Activities
New Task Force Activities
#
Type
SC/TF/WG
Details
6093SNARF5 Year Review TFRevision to SEMI G31-0997: TEST METHOD FOR DETERMINING THE ABRASIVE CHARACTERISTICS OF MOLDING COMPOUNDS
6094SNARF5 Year Review TFRevision to SEMI G45-93: RECOMMENDED PRACTICE FOR FLASH CHARACTERISTICS OF THERMOSETTING MOLDING COMPOUNDS, with title change to PRACTICE FOR FLASH CHARACTERISTICS OF THERMOSETTING MOLDING COMPOUNDS
6095SNARF5 Year Review TFRevision to SEMI G49-93: SPECIFICATION FOR PLASTIC MOLDING PREFORMS
Note 2: SNARFs and TFOFs are available for review on the SEMI Web site at:
http://downloads.semi.org/web/wstdsbal.nsf/TFOFSNARF

Authorized Ballots
Listing of documents approved by the committee for letter ballot.
#
When
SC/TF/WG
Details
6093Cycle 1-20175 Year Review TFRevision to SEMI G31-0997: TEST METHOD FOR DETERMINING THE ABRASIVE CHARACTERISTICS OF MOLDING COMPOUNDS
6094Cycle 1-20175 Year Review TFRevision to SEMI G45-93: RECOMMENDED PRACTICE FOR FLASH CHARACTERISTICS OF THERMOSETTING MOLDING COMPOUNDS, with title change to PRACTICE FOR FLASH CHARACTERISTICS OF THERMOSETTING MOLDING COMPOUNDS
6095Cycle 1-20175 Year Review TFRevision to SEMI G49-93: SPECIFICATION FOR PLASTIC MOLDING PREFORMS


SNARF(s) Granted a One-Year Extension
None.

SNARF(s) Cancelled
None.

Standard(s) to receive Inactive Status
None.

Special Announcements of the Committee (Workshops, Programs, etc.)
SEMI G76-0299 (Reapproved 0706): SPECIFICATION FOR POLYIMIDE-BASED ADHESIVE TAPE USED IN TAPE CARRIER PACKAGES (TCP)
SNARF for Reapproval of SEMI G76-0299 (Reapproved 0706) and the ballot submission for Cycle 7-2016 were approved by the GCS on July 28, 2016. However, the TC Chapter agreed to get this Standard inactive at this meeting.

Next Meeting
The next meeting of Assembly & Packaging Japan TC Chapter will be held on Monday, March 13, 2017, 15:00-17:00 at SEMI Japan office in conjunction with Japan Standards Spring Meetings.