SEMI International Standards
Standards Locale: Japan |
Committee: Assembly & Packaging |
Place of Meeting: SEMI Japan, Tokyo, Japan |
Date of Meeting: 01/20/2015 |
Meeting End Date: 01/20/2015 |
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Recording SEMI Standards Staff: Naoko Tejima |
CER Posted to Web: 01/28/2015 |
Leadership Changes
Group | Previous Leader | New Leader |
Thin Die Bending Strength Measurement Method Task Force was disbanded. | Haruo Shimamoto (AIST) | None |
DFM Study Group was disbanded | Ichiro Anjo (Jpartners) | None |
Thin Chip Handling Task Force | Kazuhiko Nakamura (Consultant) | Haruo Shimamoto (AIST) |
Committee Structure Changes
None.
Ballot Results
Ratification Ballot Results
None.
Activities Approved by the GCS between meetings of TC Chapter meeting
None.
Authorized Activities
# | Type | SC/TF/WG | Details |
- | SNARF | Thin Chip Handling Task Force | New Standard: Specification for adhesive tray used for 3D-IC manufacturing and shipping
(Endorsed by Japan Chapter. Will be approved officially by the GCS after 2weeks review by TC members.) |
- | SNARF | Thin Chip Handling Task Force | New Standard: Test Method for Adhesive Strength for Adhesive Tray Used for 3D-IC Manufacturing and Shipping
(Endorsed by Japan Chapter. Will be approved officially by the GCS after 2weeks review by TC members.) |
- | SNARF | Packaging 5 Year Review Task Force | Revision to SEMI G20-96 Specification for Lead Finishes for Plastic Packages
(Endorsed by Japan Chapter. Will be approved officially by the GCS after 2weeks review by TC members.) |
- | SNARF | Packaging 5 Year Review Task Force | Revision to SEMI G21-94, Specification for Plating Integrated Circuit Leadframes
(Endorsed by Japan Chapter. Will be approved officially by the GCS after 2weeks review by TC members.) |
- | SNARF | Packaging 5 Year Review Task Force | Revision to SEMI G41-87, Specification for Dual Strip Soic Leadframe
(Endorsed by Japan Chapter. Will be approved officially by the GCS after 2weeks review by TC members.) |
- | SNARF | Packaging 5 Year Review Task Force | Revision of SEMI G52-90 (Reapproved 1104), Standard Test Method for Measurement of Ionic Contamination on Semiconductor Leadframes (Proposed)
(Endorsed by Japan Chapter. Will be approved officially by the GCS after 2weeks review by TC members.) |
- | SNARF | Packaging 5 Year Review Task Force | Reapploval of SEMI G57-0302, Guide for Standardization of Leadframe Terminology |
- | SNARF | Packaging 5 Year Review Task Force | Revision to SEMI G82-0301, Provisional Specification for 300 mm Tool Port for Frame Cassettes in Backend Process
(Endorsed by Japan Chapter. Will be approved officially by the GCS after 2weeks review by TC members.) |
Authorized Ballots
# | When | SC/TF/WG | Details |
- | C3-15 | Packaging 5 Year Review Task Force | Revision to SEMI G21-94, Specification for Plating Integrated Circuit Leadframes |
- | C3-15 | Packaging 5 Year Review Task Force | Revision to SEMI G41-87, Specification for Dual Strip Soic Leadframe |
- | C3-15 | Packaging 5 Year Review Task Force | Revision of SEMI G52-90 (Reapproved 1104), Standard Test Method for Measurement of Ionic Contamination on Semiconductor Leadframes (Proposed) |
- | C3-15 | Packaging 5 Year Review Task Force | Reapploval of SEMI G57-0302, Guide for Standardization of Leadframe Terminology |
- | C3-15 | Packaging 5 Year Review Task Force | Revision to SEMI G82-0301, Provisional Specification for 300 mm Tool Port for Frame Cassettes in Backend Process |
SNARF(s) Granted a One-Year Extension
None.
SNARF(s) Cancelled
None.
Standard(s) to receive Inactive Status
None.
Special Announcements of the Committee (Workshops, Programs, etc.)
None.
Next Meeting
SEMI Japan Standards Japan Spring 2015 Meetings
Monday, May 11, 2015, 15:00-17:00, SEMI Japan, Tokyo, Japan
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