SEMI International Standards
Standards Locale: Japan
Committee: Assembly & Packaging
Place of Meeting: SEMI Japan, Tokyo, Japan
Date of Meeting: 01/20/2015
Meeting End Date: 01/20/2015
Recording SEMI Standards Staff: Naoko Tejima
CER Posted to Web: 01/28/2015


Leadership Changes

Group
Previous Leader
New Leader
Thin Die Bending Strength Measurement Method Task Force was disbanded.Haruo Shimamoto (AIST)None
DFM Study Group was disbandedIchiro Anjo (Jpartners)None
Thin Chip Handling Task ForceKazuhiko Nakamura (Consultant)Haruo Shimamoto (AIST)


Committee Structure Changes
None.

Ballot Results

Document #
Document Title
CommitteeAction
A&R Forms forApproved Ballots
5780Reapproval of G75-0698 (Reapproved 0706) Standard Test Method of the Properties of Leadframe TapePassedas balloted5780_Ballot_Report.pdf5780_Ballot_Report.pdf
5781Reapproval of G75.1-0698 (Reapproved 0706)Test Method for Measurement of Ionic Impurities in Leadframe TapePassedas balloted5781_Ballot_Report.pdf5781_Ballot_Report.pdf
5782Reapproval of G75.2-0698 (Reapproved 0706)Test Method for Measurment of Adhesive Strength of Leadframe TapePassedas balloted5782_Ballot_Report.pdf5782_Ballot_Report.pdf
5783Reapproval of G75.3-0698 (Reapproved 0706) Test Method for Measurment of The Peel Strength of Protective Film on Leadframe TapePassedas balloted5783_Ballot_Report.pdf5783_Ballot_Report.pdf
5784Reapproval of G75.4-0698 (Reapproved 0706) Test Method for Measurment of Water Absorption of Leadframe TapePassedas balloted5784_Ballot_Report.pdf5784_Ballot_Report.pdf
5785Reapproval of G75.5-0698 (Reapproved 0706) Test Method for Measurment of Weight Loss of Leadframe TapePassedas balloted5785_Ballot_Report.pdf5785_Ballot_Report.pdf
5786Reapproval of G75.6-0698 (Reapproved 0706) Test Method for Measurment of the Shrinkage Factor of Leadframe TapePassedas balloted5786_Ballot_Report.pdf5786_Ballot_Report.pdf
5787Reapproval of G75.7-0698 (Reapproved 0706) Test Method for Measurment of Thermal Decomposition Temperature of Leadframe Tape and AehesivePassedas balloted5787_Ballot_Report.pdf5787_Ballot_Report.pdf
5788Reapproval of G75.8-0698 (Reapproved 0706) Test Method for Measurment of the Coefficient of Thermal Expansion and Glass Transition Temperature of Leadframe TapePassedas balloted5788_Ballot_Report.pdf5788_Ballot_Report.pdf
5789Reapproval of G75.9-0698 (Reapproved 0706) Test Method for Measurment of Tensile StrengthPassedas balloted5789_Ballot_Report.pdf5789_Ballot_Report.pdf
5790Reapproval of G75.10-0698 (Reapproved 0706) Test Method for Measurment of Volume and Surface Resistivity of the Leadframe TapePassedas balloted5790_Ballot_Report.pdf5790_Ballot_Report.pdf
5791Reapproval of G75.11-0698 (Reapproved 0706) Test Method for Measurment of the Dielectric Constant and Dissipation Factor of the Leadframe TapePassedas balloted5791_Ballot_Report.pdf5791_Ballot_Report.pdf
5792Reapproval of G75.12-0698 (Reapproved 0706) Test Method for Measurment of Breakdown Strength of Leadframe TapePassedas balloted5792_Ballot_Report.pdf5792_Ballot_Report.pdf
5793Reapproval of G75.13-0698 (Reapproved 0706) Test Method for Measurment of the Leakage Current in Leadframe TapePassedas balloted5793_Ballot_Report.pdf5793_Ballot_Report.pdf



Ratification Ballot Results
None.

Activities Approved by the GCS between meetings of TC Chapter meeting
None.

Authorized Activities

#
Type
SC/TF/WG
Details
-
SNARF
Thin Chip Handling Task ForceNew Standard: Specification for adhesive tray used for 3D-IC manufacturing and shipping
(Endorsed by Japan Chapter. Will be approved officially by the GCS after 2weeks review by TC members.)
-
SNARF
Thin Chip Handling Task ForceNew Standard: Test Method for Adhesive Strength for Adhesive Tray Used for 3D-IC Manufacturing and Shipping
(Endorsed by Japan Chapter. Will be approved officially by the GCS after 2weeks review by TC members.)
-
SNARF
Packaging 5 Year Review Task ForceRevision to SEMI G20-96 Specification for Lead Finishes for Plastic Packages
(Endorsed by Japan Chapter. Will be approved officially by the GCS after 2weeks review by TC members.)
-
SNARF
Packaging 5 Year Review Task ForceRevision to SEMI G21-94, Specification for Plating Integrated Circuit Leadframes
(Endorsed by Japan Chapter. Will be approved officially by the GCS after 2weeks review by TC members.)
-
SNARF
Packaging 5 Year Review Task ForceRevision to SEMI G41-87, Specification for Dual Strip Soic Leadframe
(Endorsed by Japan Chapter. Will be approved officially by the GCS after 2weeks review by TC members.)
-
SNARF
Packaging 5 Year Review Task ForceRevision of SEMI G52-90 (Reapproved 1104), Standard Test Method for Measurement of Ionic Contamination on Semiconductor Leadframes (Proposed)
(Endorsed by Japan Chapter. Will be approved officially by the GCS after 2weeks review by TC members.)
-
SNARF
Packaging 5 Year Review Task ForceReapploval of SEMI G57-0302, Guide for Standardization of Leadframe Terminology
-
SNARF
Packaging 5 Year Review Task ForceRevision to SEMI G82-0301, Provisional Specification for 300 mm Tool Port for Frame Cassettes in Backend Process
(Endorsed by Japan Chapter. Will be approved officially by the GCS after 2weeks review by TC members.)


Authorized Ballots

#
When
SC/TF/WG
Details
-
C3-15
Packaging 5 Year Review Task ForceRevision to SEMI G21-94, Specification for Plating Integrated Circuit Leadframes
-
C3-15
Packaging 5 Year Review Task ForceRevision to SEMI G41-87, Specification for Dual Strip Soic Leadframe
-
C3-15
Packaging 5 Year Review Task ForceRevision of SEMI G52-90 (Reapproved 1104), Standard Test Method for Measurement of Ionic Contamination on Semiconductor Leadframes (Proposed)
-
C3-15
Packaging 5 Year Review Task ForceReapploval of SEMI G57-0302, Guide for Standardization of Leadframe Terminology
-
C3-15
Packaging 5 Year Review Task ForceRevision to SEMI G82-0301, Provisional Specification for 300 mm Tool Port for Frame Cassettes in Backend Process


SNARF(s) Granted a One-Year Extension
None.

SNARF(s) Cancelled
None.

Standard(s) to receive Inactive Status
None.

Special Announcements of the Committee (Workshops, Programs, etc.)
None.

Next Meeting
SEMI Japan Standards Japan Spring 2015 Meetings
Monday, May 11, 2015, 15:00-17:00, SEMI Japan, Tokyo, Japan