SEMI International Standards
| Standards Locale: North America |
| Committee: 3DS-IC |
| Place of Meeting: San Jose, CA |
| Date of Meeting: 11/03/2015 |
| Meeting End Date: 11/03/2015 |
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| Recording SEMI Standards Staff: Laura Nguyen |
| CER Posted to Web: 11/16/2015 |
Leadership Changes
None.
Committee Structure Changes
None.
Ballot Results
Document # | Document Title | Committee Action | A&R Forms for Approved Ballots |
| 5823A | Revision to SEMI 3D2-1113, Specification for Glass Carrier Wafers for 3DS-IC Applications | Passed |  5823AProceduralReview.docx |
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Ratification Ballot Results
None.
Activities Approved by the GCS between meetings of TC Chapter meeting
None.
Authorized Activities
# | Type | SC/TF/WG | Details |
| 5713 | SNARF | Bonded Wafer Stacks TF | New Standard: Specification for Glass Base Material for Semiconductor Packaging to go out for cycle 1 |
| SNARF | Inspection and Metrology TF | New Standard: Terminology for 3DS-IC Technology
to go out for 2 week review |
Authorized Ballots
# | When | SC/TF/WG | Details |
| 5713 | Cycle 1 - 2016 | Bonded Wafer Stacks TF | New Standard: Specification for Glass Base Material for Semiconductor Packaging |
SNARF(s) Granted a One-Year Extension
None.
SNARF(s) Cancelled
None.
Standard(s) to receive Inactive Status
None.
Special Announcements of the Committee (Workshops, Programs, etc.)
None.
Next Meeting
NA Spring Meeting 2016
For more information, please visit: http://www.semi.org/standards
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