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SEMI International Standards
Standards Locale: Europe
Committee: Silicon Wafer
Place of Meeting: Grenoble, France
Date of Meeting: 10/08/2014
Meeting End Date: 10/08/2014
Recording SEMI Standards Staff: James Amano
CER Posted to Web: 10/19/2014


Leadership Changes
None.

Committee Structure Changes
None.

Ballot Results

Document #
Document Title
Committee Action
A&R Forms for Approved Ballots
5403
Withdrawal of SEMI MF534-0707, TEST METHOD FOR BOW OF SILICON WAFERSPassed as balloted
5604
Line Item Revision to SEMI M1-0414 SPECIFICATIONS FOR POLISHED SINGLE CRYSTAL SILICON WAFERS and SEMI M20-1110 PRACTICE FOR ESTABLISHING A WAFER COORDINATE SYSTEMPassed as balloted
5702
Line Item Revision to SEMI M68-1109, PRACTICE FOR DETERMINING WAFER NEAR-EDGE GEOMETRY FROM A MEASURED HEIGHT DATA ARRAY USING A CURVATURE METRIC, ZDDPassed with editorial changes



Ratification Ballot Results
None.

Activities Approved by the GCS between meetings of TC Chapter meeting
None.

Authorized Activities

#
Type
SC/TF/WG
Details
5794
SNARFInternational 450 mm Wafer Task ForceNew Standard: Specification Of Developmental 450mm Diameter Polished Single Crystal Notchless Silicon Wafers With Back Surface Fiducial Marks


Authorized Ballots

#
When
SC/TF/WG
Details
5736
Cycle 7-2014International SOI Wafers Task ForceLine Item Revision to M41-1213 Specification of Silicon-on-Insulator (SOI) for Power Device/ICs


SNARF(s) Granted a One-Year Extension
None.

SNARF(s) Cancelled
None.

Standard(s) to receive Inactive Status
None.

Special Announcements of the Committee (Workshops, Programs, etc.)
None.

Next Meeting
October, 2015, during SEMICON Europa in Dresden, Germany











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