SEMI International Standards
Standards Locale: North America
Committee: 3DS-IC
Place of Meeting: SEMI Headquarters, San Jose, CA
Date of Meeting: 11/08/2016
Meeting End Date: 11/08/2016
Recording SEMI Standards Staff: Laura Nguyen
CER Posted to Web: 11/14/2016


Leadership Changes
None.

Committee Structure Changes
None.

Ballot Results
None.

Ratification Ballot Results
None.

Activities Approved by the GCS between meetings of TC Chapter meeting
None.

Authorized Activities

#
Type
SC/TF/WG
Details
6076Revised SNARFBonded Wafer Stack TFNew Standard: Specification for Identification and Marking on Wafers and Wafer Stacks for 3DS-IC Applications – Revised SNARF to complete the two-week member review and approval by GCS
Note: SNARFs and TFOFs are available for review on the SEMI Web site at:
http://downloads.semi.org/web/wstdsbal.nsf/TFOFSNARF

Authorized Ballots

#
When
SC/TF/WG
Details
5822Cycle 9 or Cycle 1Inspection and Metrology TFNew Standard: Specification for Reference Material for Bonded Wafer Stack Void Metrology


SNARF(s) Granted a One-Year Extension
None.

SNARF(s) Cancelled
None.

Standard(s) to receive Inactive Status
None.

Special Announcements of the Committee (Workshops, Programs, etc.)
The next meeting of the 3DS-IC NA TC Chapter committee is scheduled for Tuesday, April 4, 2017 at the NA Standards Spring 2017 Meetings at SEMI Headquarters.
For more information, please visit: http://www.semi.org/en/standards

Next Meeting
None.