SEMI International Standards
Standards Locale: North America |
Committee: 3DS-IC |
Place of Meeting: SEMI Headquarters, San Jose, CA |
Date of Meeting: 11/08/2016 |
Meeting End Date: 11/08/2016 |
|
Recording SEMI Standards Staff: Laura Nguyen |
CER Posted to Web: 11/14/2016 |
Leadership Changes
None.
Committee Structure Changes
None.
Ballot Results
None.
Ratification Ballot Results
None.
Activities Approved by the GCS between meetings of TC Chapter meeting
None.
Authorized Activities
# | Type | SC/TF/WG | Details |
6076 | Revised SNARF | Bonded Wafer Stack TF | New Standard: Specification for Identification and Marking on Wafers and Wafer Stacks for 3DS-IC Applications – Revised SNARF to complete the two-week member review and approval by GCS |
Note: SNARFs and TFOFs are available for review on the SEMI Web site at:
http://downloads.semi.org/web/wstdsbal.nsf/TFOFSNARF
Authorized Ballots
# | When | SC/TF/WG | Details |
5822 | Cycle 9 or Cycle 1 | Inspection and Metrology TF | New Standard: Specification for Reference Material for Bonded Wafer Stack Void Metrology |
SNARF(s) Granted a One-Year Extension
None.
SNARF(s) Cancelled
None.
Standard(s) to receive Inactive Status
None.
Special Announcements of the Committee (Workshops, Programs, etc.)
The next meeting of the 3DS-IC NA TC Chapter committee is scheduled for Tuesday, April 4, 2017 at the NA Standards Spring 2017 Meetings at SEMI Headquarters.
For more information, please visit: http://www.semi.org/en/standards
Next Meeting
None.
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