SEMI International Standards
Standards Locale: North America
Committee: 3DS-IC
Place of Meeting: SEMI Headquarters in San Jose, California
Date of Meeting: 03/31/2015
Meeting End Date: 03/31/2015
Recording SEMI Standards Staff: Paul Trio
CER Posted to Web: 04/08/2015


Leadership Changes
None.

Committee Structure Changes
None.

Ballot Results
None.

Ratification Ballot Results
None.

Activities Approved by the GCS between meetings of TC Chapter meeting
None.

Authorized Activities

#
Type
SC/TF/WG
Details
5713
Updated SNARFBonded Wafer Stacks TFNew Standard: Specification for Glass Interposer Base Material without or with Through-Glass or Blind Via Openings
From: New Standard: Specification of Glass Interposers

Updated Rationale: In the past, interposers were made from silicon. Glass can be used as an alternative material with its specific physical and thermal properties. However, no specification or description of requirements for such glass interposers exists. This document will include specifications for procuring glass base material intended for use as an interposer. The glass base material may be in the form of a wafer or a panel. This document will also include specifications for procuring glass base material with TGV or Blind Via openings.

Updated Scope: This specification describes dimensional and thermal characteristics of glass with openings and glass for interposers. This specification applies to glass substrates in shape of a wafer (round) or a panel (square or rectangular). The glass and its openings are intended to be further processed with metal fillings in order to be used as glass interposers. The glass substrate will be permanently integrated in a stack. Methods of measurements suitable for determining the characteristics in the specification are indicated.
To be submitted for GCS approval after two-week global 3DS-IC technical committee review and comment.
NOTE: SNARFs and TFOFs are available for review on the SEMI Web site at:
http://downloads.semi.org/web/wstdsbal.nsf/TFOFSNARF

Authorized Ballots
Listing of documents approved by the committee for letter ballot.
#
When
SC/TF/WG
Details
5823
Cycle 4 or 5, 2015Bonded Wafer Stacks TFRevision to SEMI 3D2, Specification for Glass Carrier Wafers for 3DS-IC Applications


SNARF(s) Granted a One-Year Extension
None.

SNARF(s) Cancelled
None.

Standard(s) to receive Inactive Status
None.

Special Announcements of the Committee (Workshops, Programs, etc.)
Bonded Wafer Stacks TF SNARFs # 5174 and 5692 Discontinued
At the North America 3DS-IC Committee meeting held March 31, in conjunction with the NA Standards Spring 2015 Meetings, the following activities under the Bonded Wafer Stacks Task Force were discontinued:
  • New Standard: Specification for Identification and Marking for Bonded Wafer Stacks [SNARF # 5174]
  • New Standard: Guide for Describing Glass Wafers for Use as 300 mm Carrier Wafers in a 3DS-IC Temporary Bond-Debond (TBDB) Process [SNARF # 5692]

Bonded Wafer Stacks TF SNARF # 5173 Continuing
The NA 3DS-IC committee found the Bonded Wafer Stacks TF activity, New Standard: Guide for Describing Silicon Wafers for Use in a 300 mm 3DS-IC Wafer Stack (SNARF # 5173), to be continuing in accordance with section 8.3.2 of the SEMI Standards Regulations. Thus, the development of this activity was granted a one-year extension by the NA 3DS-IC TC Chapter.

SEMI 3DS-IC Google Site
This site contains information on 3DS-IC task forces, recent meeting information, upcoming meeting schedule, and other pertinent information:
https://sites.google.com/a/semi.org/3dsic/

Next Meeting
SEMICON West 2015 Meetings
July 13-16, 2015
San Francisco Marriott Marquis Hotel
780 Mission Street
San Francisco, California 94103
U.S.A.

Tuesday, July 14
  • Inspection & Metrology TF (8:00 AM to 10:00 AM, U.S. Pacific Time)
  • Bonded Wafer Stacks TF (10:00 AM to 12:00 Noon)
  • NA 3DS-IC Committee (1:00 PM to 3:00 PM)

For more information, please visit: http://www.semi.org/standards