• ABOUT
• SMART INITIATIVES
• MARKET DATA
• EVENTS
• STANDARDS
• STORE
• PRESS

Standards Locale: North America

Committee: 3D Packaging and Integration

Place of Meeting: OVTCCM

Date of Meeting: 03/23/2021

Meeting End Date:

Recording SEMI Standards Staff: Laura Nguyen

CER Posted to Web: 03/30/2021

The following Letter Ballot Reviews were approved by GCS to be transferred to the Japan 3D Packaging & Integration TC Chapter and adjudicated on July 10, 2020.

Document #	Document Title	Committee Action	A&R Forms for Approved Ballots
6591	Revision to SEMI 3D20 0719, Specification for Panel Characteristics for Panel Level Packaging (PLP) Applications	Failed	6591_Ballot Report.pdf
6631	Line Item Revision to SEMI 3D12-0315, Guide for Measuring Flatness and Shape of Low Stiffness Wafers		6631_Ballot Line-Item report_r2.pdf
L1	Clarify the Purpose statement in ¶1.3.	Passed, with editorial change(s)
L2	Add definition of precise monofilament and revise definitions in Terminology §5 for clarity.	Passed, as balloted

The following Letter Ballot Reviews were adjudicated by the 3D Packaging & Integration NA TC Chapter.

Document #	Document Title	Committee Action	A&R Forms for Approved Ballots
6591A	Revision to SEMI 3D20-0719, Specification for Panel Characteristics for Panel Level Packaging (PLP) Applications	Passed, with editorial change(s)	6591A_ProceduralReview.pdf
6641	Revision to SEMI 3D8-0514, Guide for Describing Silicon Wafers for Use as 300 mm Carrier Wafers in a 3DS-IC Temporary Bond-Debond (TBDB) Process	Passed, with technical changes, Ratification Ballot to be issued	6641_ProceduralReview.pdf

Note 1: Passed ballots and line items will be submitted to the ISC Audit & Review Subcommittee for procedural review.

Note 2: Failed ballots and line items were returned to the originating task forces for re-work and re-balloting or abandoning.

Ratification Ballot Results
None.

Activities Approved by the GCS between meetings of TC Chapter meeting

#	Type	SC/TF/WG	Details
6641	SNARF	Bonded Wafer Stacks TF	Revision to SEMI 3D8-0514, Guide for Describing Silicon Wafers for Use as 300 mm Carrier Wafers in a 3DS-IC Temporary Bond-Debond (TBDB) Process –– TC Member Review took place between 03/02/2020–03/15/2020 –– Approved by GCS on 03/27/2020
--	Adjudication Locale Transfer	3DP&I NA TC	Transfer responsibilities for Letter Ballot review from the North America Chapter to the Japan Chapter for NA Ballots 6591 & 6631 –– Approved by GCS on 06/30/2020 –– Adjudicated at Japan Summer Meetings
6591A	Ballot Authorization for Cycle 6 or 7-2020	PLP Panel TF	Revision to SEMI 3D20 0719, Specification for Panel Characteristics for Panel Level Packaging (PLP) Applications –– Approved by GCS on 08/12/2020
6641	Ballot Authorization for Cycle 6 or 7-2020	Bonded Wafer Stacks TF	Revision to SEMI 3D8-0514, Guide for Describing Silicon Wafers for Use as 300 mm Carrier Wafers in a 3DS-IC Temporary Bond-Debond (TBDB) Process –– Approved by GCS on 08/12/2020
--	Special online ballot for OVTCCM	3DP&I GTC	Authorizing the special online ballot for adoption of OVTCCM. –– Approved by GCS on 11/25/2020

Authorized Activities
Listing of all revised or new SNARF(s) approved by the Originating TC Chapter.

#	Type	SC/TF/WG	Details
6810	SNARF	Inspection & Metrology TF	Reapproval of SEMI 3D13-0715, Guide for Measuring Voids in Bonded Wafer Stacks
6812	SNARF	Inspection & Metrology TF	Reapproval of SEMI 3D4-0915, Guide for Metrology for Measuring Thickness, Total Thickness Variation (TTV), Bow, Warp/Sori, and Flatness of Bonded Wafer Stacks
6811	SNARF	Bonded Wafer Stacks TF	Reapproval of SEMI 3D2-0216, Specification for Glass Carrier Wafers for 3DS-IC Applications

Note 1: SNARFs and TFOFs are available for review on the SEMI Web site at:

http://downloads.semi.org/web/wstdsbal.nsf/TFOFSNARF

Authorized Ballots
Listing of documents authorized by the Originating TC Chapter for Letter Ballot.

#	When	TF	Details
R6641	Cycle 4-2021	Bonded Wafer Stacks TF	Revision to SEMI 3D8-0514, Guide for Describing Silicon Wafers for Use as 300 mm Carrier Wafers in a 3DS-IC Temporary Bond-Debond (TBDB) Process
6810	Cycle 4 or 5-2021	Inspection & Metrology TF	Reapproval of SEMI 3D13-0715, Guide for Measuring Voids in Bonded Wafer Stacks
6812	Cycle 4 or 5-2021	Inspection & Metrology TF	Reapproval of SEMI 3D4-0915, Guide for Metrology for Measuring Thickness, Total Thickness Variation (TTV), Bow, Warp/Sori, and Flatness of Bonded Wafer Stacks
6811	Cycle 4 or 5-2021	Bonded Wafer Stacks TF	Reapproval of SEMI 3D2-0216, Specification for Glass Carrier Wafers for 3DS-IC Applications

SNARF(s) Granted a One-Year Extension
None.

SNARF(s) Cancelled
None.

Standard(s) to receive Inactive Status
None.

Special Announcements of the Committee (Workshops, Programs, etc.)
None.

Next Meeting

The next meeting is tentatively scheduled for Tuesday, June 8, 2021 at 11:00-13:00 Pacific. For more information, please visit the Standards Calendar at http://www.semi.org/standards.