SEMI International Standards
Standards Locale: North America
Committee: Silicon Wafer
Place of Meeting: Intel, Santa Clara, California
Date of Meeting: 10/29/2013
Meeting End Date: 10/29/2013
Recording SEMI Standards Staff: Kevin Nguyen
CER Posted to Web: 11/04/2013


Leadership Changes
None.

Committee Structure Changes
None.

Ballot Results

Document #
Document Title
Committee Action
A&R Forms for Approved Ballots
5558
Revision of SEMI MF928-0305 (Reapproved 0211), Test Methods for Edge Contour of Circular Wafers and Rigid Disk SubstratesPassed as balloted5558ProceduralReview.doc
5606
New Auxiliary Information: Interlaboratory Evaluation of Method 1 of SEMI MF673, Measuring Resistivity of Semiconductor Slices of Sheet Resistance of Semiconductor Films with a Noncontact Eddy-Current GageApproved5606ProceduralReview.doc


Ratification Ballot Results
None.

Activities Approved by the GCS between meetings of TC Chapter meeting
None.

Authorized Activities


#
Type
SC/TF/WG
Details
5540
SNARFInt'l AWG TFSNARF was revised from
New Auxiliary Information, Illustration of Flatness and Shape Metrics for Silicon Wafers
To:
Line Item Revision to SEMI M1-1013, Specification for Polished Single Crystal Silicon Wafers (Re: Addition of Related Information: Illustration of Flatness and Shape Metrics for Silicon Wafers)
5662
SNARFInt'l ASI TFRevision of SEMI M35-1107, Guide for Developing Specifications for Silicon Wafer Surface Features Detected by Automated Inspection
5663
SNARFInt'l ASI TFReapproval of SEMI M58-1109, Test Method for Evaluating DMA Based Particle Deposition Systems and Processes
5664
SNARFInt'l Terminology TFLine Item Revision to SEMI M59-0211, Terminology for Silicon Technology
5665
SNARFInt'l Test Methods TFLine Item Revision to SEMI MF26-0305 (Reapproved 0211), Test Method for Determining the Orientation of a Semiconductive Single Crystal to correct an error
5666
SNARFInt'l Test Methods TFRevision of SEMI MF928, Test Methods for Edge Contour of Circular Wafers and Rigid Disk Substrates



Authorized Ballots

#
When
SC/TF/WG
Details
5607
Cycle 1 for review at WestInt'l Test Methods TFRevision of SEMI MF673-0305 (Reapproved 0611), Measuring Resistivity of Semiconductor Slices of Sheet Resistance of Semiconductor Films with a Noncontact Eddy-Current Gage
5663
Cycle 1 for review at NA SpringInt'l ASI TFReapproval of SEMI M58-1109, Test Method for Evaluating DMA Based Particle Deposition Systems and Processes
5664
Cycle 1 for review at WestInt'l Terminology TFLine Item Revision to SEMI M59-0211, Terminology for Silicon Technology
5665
Cycle 1 for review at NA SpringInt'l Test Methods TFLine Item Revision to SEMI MF26-0305 (Reapproved 0211), Test Method for Determining the Orientation of a Semiconductive Single Crystal to correct an error
5666
Cycle 1 for review at WestInt'l Test Methods TFRevision of SEMI MF928-0305 (Reapproved 0211), Test Methods for Edge Contour of Circular Wafers and Rigid Disk Substrates


SNARF(s) Granted a One-Year Extension
None.

SNARF(s) Cancelled
None.

Standard(s) to receive Inactive Status
None.

Special Announcements of the Committee (Workshops, Programs, etc.)
None.

Next Meeting
The next meeting will be in conjunction with NA Spring Standards Meetings in San Jose, California at SEMI HQ. The committee will meet on Tuesday, April 1, 2014. Check www.semi.org/standards on calendar of event for the latest schedule and meeting location.