SEMI International Standards
Standards Locale: North America |
Committee: Silicon Wafer |
Place of Meeting: Intel, Santa Clara, California |
Date of Meeting: 10/29/2013 |
Meeting End Date: 10/29/2013 |
|
Recording SEMI Standards Staff: Kevin Nguyen |
CER Posted to Web: 11/04/2013 |
Leadership Changes
None.
Committee Structure Changes
None.
Ballot Results
Document # | Document Title | Committee Action | A&R Forms for Approved Ballots |
5558 | Revision of SEMI MF928-0305 (Reapproved 0211), Test Methods for Edge Contour of Circular Wafers and Rigid Disk Substrates | Passed as balloted | |
5606 | New Auxiliary Information: Interlaboratory Evaluation of Method 1 of SEMI MF673, Measuring Resistivity of Semiconductor Slices of Sheet Resistance of Semiconductor Films with a Noncontact Eddy-Current Gage | Approved | |
Ratification Ballot Results
None.
Activities Approved by the GCS between meetings of TC Chapter meeting
None.
Authorized Activities
# | Type | SC/TF/WG | Details |
5540 | SNARF | Int'l AWG TF | SNARF was revised from
New Auxiliary Information, Illustration of Flatness and Shape Metrics for Silicon Wafers
To:
Line Item Revision to SEMI M1-1013, Specification for Polished Single Crystal Silicon Wafers (Re: Addition of Related Information: Illustration of Flatness and Shape Metrics for Silicon Wafers) |
5662 | SNARF | Int'l ASI TF | Revision of SEMI M35-1107, Guide for Developing Specifications for Silicon Wafer Surface Features Detected by Automated Inspection |
5663 | SNARF | Int'l ASI TF | Reapproval of SEMI M58-1109, Test Method for Evaluating DMA Based Particle Deposition Systems and Processes |
5664 | SNARF | Int'l Terminology TF | Line Item Revision to SEMI M59-0211, Terminology for Silicon Technology |
5665 | SNARF | Int'l Test Methods TF | Line Item Revision to SEMI MF26-0305 (Reapproved 0211), Test Method for Determining the Orientation of a Semiconductive Single Crystal to correct an error |
5666 | SNARF | Int'l Test Methods TF | Revision of SEMI MF928, Test Methods for Edge Contour of Circular Wafers and Rigid Disk Substrates |
Authorized Ballots
# | When | SC/TF/WG | Details |
5607 | Cycle 1 for review at West | Int'l Test Methods TF | Revision of SEMI MF673-0305 (Reapproved 0611), Measuring Resistivity of Semiconductor Slices of Sheet Resistance of Semiconductor Films with a Noncontact Eddy-Current Gage |
5663 | Cycle 1 for review at NA Spring | Int'l ASI TF | Reapproval of SEMI M58-1109, Test Method for Evaluating DMA Based Particle Deposition Systems and Processes |
5664 | Cycle 1 for review at West | Int'l Terminology TF | Line Item Revision to SEMI M59-0211, Terminology for Silicon Technology |
5665 | Cycle 1 for review at NA Spring | Int'l Test Methods TF | Line Item Revision to SEMI MF26-0305 (Reapproved 0211), Test Method for Determining the Orientation of a Semiconductive Single Crystal to correct an error |
5666 | Cycle 1 for review at West | Int'l Test Methods TF | Revision of SEMI MF928-0305 (Reapproved 0211), Test Methods for Edge Contour of Circular Wafers and Rigid Disk Substrates |
SNARF(s) Granted a One-Year Extension
None.
SNARF(s) Cancelled
None.
Standard(s) to receive Inactive Status
None.
Special Announcements of the Committee (Workshops, Programs, etc.)
None.
Next Meeting
The next meeting will be in conjunction with NA Spring Standards Meetings in San Jose, California at SEMI HQ. The committee will meet on Tuesday, April 1, 2014. Check www.semi.org/standards on calendar of event for the latest schedule and meeting location.
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