SEMI International Standards
Standards Locale: Taiwan |
Committee: 3DS-IC |
Place of Meeting: SEMI Taiwan office |
Date of Meeting: 06/29/2017 |
Meeting End Date: 06/29/2017 |
|
Recording SEMI Standards Staff: Dean Chang |
CER Posted to Web: 07/18/2017 |
Leadership Changes
None.
Committee Structure Changes
None.
Ballot Results
None.
Ratification Ballot Results
None.
Activities Approved by the GCS between meetings of TC Chapter meeting
None.
Authorized Activities
None.
Authorized Ballots
# | When | TF | Details |
5800 | Cycle 6 | Middle End Process | NEW STANDARD: Guide for Wafer Edge Trimming for 3DS-IC Process |
.
SNARF(s) Granted a One-Year Extension
None.
SNARF(s) Cancelled
None.
Standard(s) to receive Inactive Status
None.
Special Announcements of the Committee (Workshops, Programs, etc.)
SEMICON Taiwan will be held from Sept 13 to Sept.15
(1) Advanced Packaging Technology Symposium will be held on Sept 13; 8:30am to 5:00pm
(2) Advanced Packaging Tutorials-Bumping Technology will be held on Sept; 8:30am to 12:00am
(3) Advanced Packaging Tutorials-Dicing & Attach Technology will be held on Sept 14; 8:30am to 12:00am
(4) Advanced Packaging Tutorials-Encapsulation Technology will be held on Sept 15; 8:30am to 12:00am
Next Meeting
September 26, 2017; 14:30~16:30, SEMI Taiwan office
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