SEMI International Standards
| Standards Locale: Japan |
| Committee: 3D Packaging and Integration |
| Place of Meeting: OVTCCM |
| Date of Meeting: 03/15/2023 |
| Meeting End Date: 03/15/2023 |
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| Recording SEMI Standards Staff: Mami Nakajo |
| CER Posted to Web: 03/30/2023 |
Leadership Changes
None.
Committee Structure Changes
Previous WG/TF/SC Name | New WG/TF/SC Name or Status Change |
| Encapsulation Characteristics for Wafer Level Package and Panel Level Packaging Task Force | Disbanded |
Ballot Results
None.
Ratification Ballot Results
None.
Activities Approved by the GCS between meetings of TC Chapter meeting
None.
Authorized Activities
# | Type | SC/TF/WG | Details |
| 7020 | SNARF | 3D Packaging & Integration 5-Year Review TF | Reapproval of SEMI G94-0113 (Reapproved 1118) Specification for Coin-Stack Type Tape Frame Shipping Container for 300 mm Wafer |
| 7019 | SNARF | 3D Packaging & Integration 5-Year Review TF | Reapproval of SEMI G64-1118,Specification for Full-Plated Integrated Circuit Leadframes (Au, Ag, Cu, Ni, Pd/Ni, Pd) |
Authorized Ballots
# | When | SC/TF/WG | Details |
| 7020 | Cycle 5-2023 | 3D Packaging & Integration 5-Year Review TF | Reapproval of G94-0113 (Reapproved 1118) Specification for Coin-Stack Type Tape Frame Shipping Container for 300 mm Wafer |
| 7019 | Cycle 5-2023 | 3D Packaging & Integration 5-Year Review TF | Reapproval of G64-1118,Specification for Full-Plated Integrated Circuit Leadframes (Au, Ag, Cu, Ni, Pd/Ni, Pd) |
SNARF(s) Granted a One-Year Extension
None.
SNARF(s) Cancelled
None.
Standard(s) to receive Inactive Status
None.
Special Announcements of the Committee (Workshops, Programs, etc.)
None.
Next Meeting
The next meeting is scheduled for Wednesday, June 21,2023,13:30-16:00 [JST] @ OVTCCM
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