SEMI International Standards
Standards Locale: Japan |
Committee: Traceability |
Place of Meeting: Tokyo Big Sight |
Date of Meeting: 12/05/2014 |
Meeting End Date: 12/05/2014 |
|
Recording SEMI Standards Staff: Chie Yanagisawa |
CER Posted to Web: 12/18/2014 |
Leadership Changes
None.
Committee Structure Changes
None.
Ballot Results
Passed ballots and line items will be submitted to the ISC Audit & Review Subcommittee for procedural review.
Failed ballots and line items were returned to the originating task forces for re-work and re-balloting.
Document # | Document Title | Committee Action | A&R Forms for Approved Ballots |
5752 | Revision of SEMI T7-0303 (Reapproved 0709), Specification for Back Surface Marking of Double-Side Polished Wafers with a Two-Dimensional Matrix Code Symbol | Passed with editorial changes | 5752_BallotReviewSheet_0.4.pdf |
Ratification Ballot Results
None.
Activities Approved by the GCS between meetings of TC Chapter meeting
None.
Authorized Activities
None.
Authorized Ballots
None.
SNARF(s) Granted a One-Year Extension
None.
SNARF(s) Cancelled
None.
Standard(s) to receive Inactive Status
None.
Special Announcements of the Committee (Workshops, Programs, etc.)
Although the proposal of new SNARF for Line Item Revision to SEMI T7-XXXX (Doc. 5752: Revision of SEMI T7-0303 (Reapproved 0709), Specification for Back Surface Marking of Double-Side Polished Wafers with a Two-Dimensional Matrix Code Symbol) was made, the TC Chapter decided to rewrite the SNARF and reflect other issues. The reason why the SNARF should be rewrite was as following:
Due to insufficient specification for special relationship between SEMI T7 code and 300mm non silicon or non SEMI M1 wafers or larger, either the scope or Table 1 need to be changed. There is also a discussion that SEMI T7 should not include the special relationship in the first place. The Fiducial Mark Interoperability TF needs more time to decide how to resolve this issue of the current SEMI T7 and concluded the SNARF approval should be postponed.
Next Meeting
TBD
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