SEMI International Standards
Standards Locale: Japan |
Committee: 3D Packaging and Integration |
Place of Meeting: Web Conference |
Date of Meeting: 01/18/2021 |
Meeting End Date: 01/18/2021 |
|
Recording SEMI Standards Staff: Mami Nakajo |
CER Posted to Web: 01/21/2021 |
Leadership Changes
None.
Committee Structure Changes
None.
Ballot Results
Ratification Ballot Results
None.
Activities Approved by the GCS between meetings of TC Chapter meeting
None.
Authorized Activities
# | Type | SC/TF/WG | Details |
6703 | SNARF | 3D Packaging & Integration 5 Year Review TF | SNARF for: Revision to SEMI G63-95 (Reapproved 0811) “Test Method for Measurement of Die Shear Strength” |
6706 | SNARF | Encapsulation Characteristics for Wafer Level Package and Panel Level Packaging Panel TF | SNARF for: New Standard: Specification for CTE and Tg Measurement Methodology for PLP/WLP Encapsulation Materials |
6707 | SNARF | Encapsulation Characteristics for Wafer Level Package and Panel Level Packaging Panel TF | SNARF for New Standard: Specification for Flowability Measurement Methodology for PLP/WLP Encapsulation materials |
6708 | SNARF | Encapsulation Characteristics for Wafer Level Package and Panel Level Packaging Panel TF | SNARF for: New Standard: Specification for Gel Time Measurement Methodology for PLP/WLP Encapsulation materials |
6709 | SNARF | Encapsulation Characteristics for Wafer Level Package and Panel Level Packaging Panel TF | SNARF for: New Standard: Specification for Modulus Measurement Methodology for PLP/WLP Encapsulation materials |
6710 | SNARF | Encapsulation Characteristics for Wafer Level Package and Panel Level Packaging Panel TF | SNARF for: New Standard: Specification for Shear Strength Measurement Methodology for PLP/WLP Encapsulation Materials |
6711 | SNARF | Encapsulation Characteristics for Wafer Level Package and Panel Level Packaging Panel TF | SNARF for: New Standard: Specification for Viscosity Measurement Methodology for PLP/WLP Encapsulation materials |
6712 | SNARF | Encapsulation Characteristics for Wafer Level Package and Panel Level Packaging Panel TF | SNARF for: New Standard: Specification for Wettability Measurement Methodology for PLP/WLP Encapsulation materials |
Authorized Ballots
# | When | TF | Details |
6703 | Cycle 3-2021 | 3D Packaging & Integration 5 Year Review TF | SNARF for: Revision to SEMI G63-95 (Reapproved 0811) “Test Method for Measurement of Die Shear Strength” |
6706 | CycleX-2021 | Encapsulation Characteristics for Wafer Level Package and Panel Level Packaging Panel TF | SNARF for: New Standard: Specification for CTE and Tg Measurement Methodology for PLP/WLP Encapsulation Materials |
6707 | CycleX-2021 | Encapsulation Characteristics for Wafer Level Package and Panel Level Packaging Panel TF | SNARF for New Standard: Specification for Flowability Measurement Methodology for PLP/WLP Encapsulation materials |
6708 | CycleX-2021 | Encapsulation Characteristics for Wafer Level Package and Panel Level Packaging Panel TF | SNARF for: New Standard: Specification for Gel Time Measurement Methodology for PLP/WLP Encapsulation materials |
6709 | CycleX-2021 | Encapsulation Characteristics for Wafer Level Package and Panel Level Packaging Panel TF | SNARF for: New Standard: Specification for Modulus Measurement Methodology for PLP/WLP Encapsulation materials |
6710 | CycleX-2021 | Encapsulation Characteristics for Wafer Level Package and Panel Level Packaging Panel TF | SNARF for: New Standard: Specification for Shear Strength Measurement Methodology for PLP/WLP Encapsulation Materials |
6711 | CycleX-2021 | Encapsulation Characteristics for Wafer Level Package and Panel Level Packaging Panel TF | SNARF for: New Standard: Specification for Viscosity Measurement Methodology for PLP/WLP Encapsulation materials |
6712 | CycleX-2021 | Encapsulation Characteristics for Wafer Level Package and Panel Level Packaging Panel TF | SNARF for: New Standard: Specification for Wettability Measurement Methodology for PLP/WLP Encapsulation materials |
SNARF(s) Granted a One-Year Extension
None.
SNARF(s) Cancelled
None.
Standard(s) to receive Inactive Status
None.
Special Announcements of the Committee (Workshops, Programs, etc.)
None.
Next Meeting
The next meeting is scheduled for Friday, May 28,2021,14:00-17:00 at SEMI Japan office /WEB
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