SEMI International Standards
Standards Locale: Japan |
Committee: Silicon Wafer |
Place of Meeting: Tokyo Big Sight / OVTCCM |
Date of Meeting: 12/14/2022 |
Meeting End Date: 12/14/2022 |
|
Recording SEMI Standards Staff: Mami Nakajo |
CER Posted to Web: 12/28/2022 |
Leadership Changes
None.
Committee Structure Changes
None.
Ballot Results
Document # | Document Title | Committee Action | A&R Forms for Approved Ballots |
6860 | Revision of SEMI M41- 0615, Specification of Silicon-on-Insulator (SOI) for Power Device/ICs | Passed with editorial change | 6860 A&R final.pdf |
6570A | New Standard: Guide for Measuring Bulk Micro Defect Density and Denuded Zone Width in Annealed Silicon Wafers by a Laser-Scattering Tomography Technique | Failed and returned to TF for rework | |
Ratification Ballot Results
None.
Activities Approved by the GCS between meetings of TC Chapter meeting
None.
Authorized Activities
None.
Authorized Ballots
None.
SNARF(s) Granted a One-Year Extension
# | TF | Title | Expiration Date |
6570 | International Test Methods Task Force | New Standard: Guide for Measuring Bulk Micro Defect Density and Denuded Zone Width in Annealed Silicon Wafers by a Laser-Scattering Tomography Technique | 2024/04/19 |
SNARF(s) Cancelled
None.
Standard(s) to receive Inactive Status
None.
Special Announcements of the Committee (Workshops, Programs, etc.)
None.
Next Meeting
The next meeting is scheduled for Thursday, April 13th, 10:00am-12:00[JST](Hybrid)
Please check www.semi.org/standards for updates.
Copyright ©2024 Semiconductor Equipment and Materials International (SEMI®). All rights reserved.