SEMI International Standards
Standards Locale: Japan
Committee: Assembly & Packaging
Place of Meeting: SEMI Japan office
Date of Meeting: 06/10/2016
Meeting End Date: 06/10/2016
Recording SEMI Standards Staff: Chie Yanagisawa
CER Posted to Web: 06/14/2016


Leadership Changes

Group
Previous Leader
New Leader
Electromagnetic Characterization Study GroupMikio Kiyono (AET)The study group was discharged.
3D-IC Study GroupMasahiro Tsuriya (iNEMI)
Haruo Shimamoto (AIST)
The study group was discharged.
Japan 450mm Assembly & Test Die Preparation Task ForceKenichi Watanabe (Lintec)
Kiyofumi Tanaka (Shin-Etsu Polymer)
Sumio Masuchi (DISCO) and Akihito Kawai (DISCO) remain.


Committee Structure Changes
None.

Ballot Results
None.

Ratification Ballot Results
None.

Activities Approved by the GCS between meetings of TC Chapter meeting
None.

Authorized Activities
Task Force /Study Group Activities update
#
Type
SC/TF/WG
Details
--SG DischargeElectromagnetic Characterization Study GroupThe study group was discharged.
--SG Discharge3D-IC Study GroupThe study group was discharged.
5878SNARF Withdrawal5 Year Review TFLine Item Revision to SEMI G20-96: Specification for Lead Finishes for Plastic Packages (Active Devices Only)
5879SNARF Withdrawal 5 Year Review TFLine Item Revision to SEMI G21-94: Specification for Plating Integrated Circuit Leadframes
5880SNARF Withdrawal 5 Year Review TFLine Item Revision to SEMI G41-87: Specification for Dual Strip SOIC Leadframe
TBDSNARF5 Year Review TFMajor Revision to SEMI G20-96: Specification for Lead Finishes for Plastic Packages (Active Devices Only)
*Some parts are changed according to Section 3.2 of Procedure Manuals.
TBDSNARF5 Year Review TFMajor Revision to SEMI G21-94: Specification for Plating Integrated Circuit Leadframes
*Some parts are changed according to Section 3.2 of Procedure Manuals.
TBDSNARF5 Year Review TFMajor Revision to SEMI G41-87: Specification for Dual Strip SOIC Leadframe
*Some parts are changed according to Section 3.2 of Procedure Manuals.
TBDSNARF5 Year Review TFLine Item Revision to SEMI G86-0303 (Reapproved 0811): Test Method for Measurement of Chip (Die) Strength by Mean of 3-Point Bending
TBDSNARF5 Year Review TFReapproval of SEMI G88-0211: Specification for Tape Frame for 450 mm Wafer
TBDSNARFThin Chip Handling TFLine Item Revision to SEMI G97-0116: Specification for Adhesive Tray Used for Thin Chip Handling
Note: SNARFs and TFOFs are available for review on the SEMI Web site at:
http://downloads.semi.org/web/wstdsbal.nsf/TFOFSNARF

Authorized Ballots
Listing of documents approved by the committee for letter ballot.
#
When
SC/TF/WG
Details
TBDCycle 6-16Thin Chip Handling TFLine Item Revision to SEMI G97-0116: Specification for Adhesive Tray Used for Thin Chip Handling
5881Cycle 6-165 Year Review TFReapproval of SEMI G83-0912: Specification for Bar Code Marking of Product Packages
TBDCycle 6-165 Year Review TFRevision to SEMI G20-96: Specification for Lead Finishes for Plastic Packages (Active Devices Only)
TBDCycle 6-165 Year Review TFRevision to SEMI G21-94: Specification for Plating Integrated Circuit Leadframes
TBDCycle 6-165 Year Review TFRevision to SEMI G41-87: Specification for Dual Strip SOIC Leadframe
TBDCycle 6-165 Year Review TFLine Item Revision to SEMI G86-0303 (Reapproved 0811): Test Method for Measurement of Chip (Die) Strength by Mean of 3-Point Bending
TBDCycle 6-165 Year Review TFReapproval of SEMI G88-0211: Specification for Tape Frame for 450 mm Wafer


SNARF(s) Granted a One-Year Extension
None.

SNARF(s) Cancelled
None.

Standard(s) to receive Inactive Status
None.

Special Announcements of the Committee (Workshops, Programs, etc.)
Draft SNARF for Revision to SEMI G44-94: Specification for Lead Finishes for Glass to Metal Seal Ceramic Packages (Active Devices Only) was distributed to the global TC members for two weeks review. However, the TC Chapter agreed to get this Standard inactive at this meeting.

Next Meeting
Next meeting to be held on Tuesday, October 4, 2016, 14:30-17:30 at SEMI Japan office in conjunction with Japan Standards Fall Meetings.