SEMI International Standards
Standards Locale: Japan |
Committee: Assembly & Packaging |
Place of Meeting: SEMI Japan office |
Date of Meeting: 06/10/2016 |
Meeting End Date: 06/10/2016 |
|
Recording SEMI Standards Staff: Chie Yanagisawa |
CER Posted to Web: 06/14/2016 |
Leadership Changes
Group | Previous Leader | New Leader |
Electromagnetic Characterization Study Group | Mikio Kiyono (AET) | The study group was discharged. |
3D-IC Study Group | Masahiro Tsuriya (iNEMI)
Haruo Shimamoto (AIST) | The study group was discharged. |
Japan 450mm Assembly & Test Die Preparation Task Force | Kenichi Watanabe (Lintec)
Kiyofumi Tanaka (Shin-Etsu Polymer) | Sumio Masuchi (DISCO) and Akihito Kawai (DISCO) remain. |
Committee Structure Changes
None.
Ballot Results
None.
Ratification Ballot Results
None.
Activities Approved by the GCS between meetings of TC Chapter meeting
None.
Authorized Activities
Task Force /Study Group Activities update
# | Type | SC/TF/WG | Details |
-- | SG Discharge | Electromagnetic Characterization Study Group | The study group was discharged. |
-- | SG Discharge | 3D-IC Study Group | The study group was discharged. |
5878 | SNARF Withdrawal | 5 Year Review TF | Line Item Revision to SEMI G20-96: Specification for Lead Finishes for Plastic Packages (Active Devices Only) |
5879 | SNARF Withdrawal | 5 Year Review TF | Line Item Revision to SEMI G21-94: Specification for Plating Integrated Circuit Leadframes |
5880 | SNARF Withdrawal | 5 Year Review TF | Line Item Revision to SEMI G41-87: Specification for Dual Strip SOIC Leadframe |
TBD | SNARF | 5 Year Review TF | Major Revision to SEMI G20-96: Specification for Lead Finishes for Plastic Packages (Active Devices Only)
*Some parts are changed according to Section 3.2 of Procedure Manuals. |
TBD | SNARF | 5 Year Review TF | Major Revision to SEMI G21-94: Specification for Plating Integrated Circuit Leadframes
*Some parts are changed according to Section 3.2 of Procedure Manuals. |
TBD | SNARF | 5 Year Review TF | Major Revision to SEMI G41-87: Specification for Dual Strip SOIC Leadframe
*Some parts are changed according to Section 3.2 of Procedure Manuals. |
TBD | SNARF | 5 Year Review TF | Line Item Revision to SEMI G86-0303 (Reapproved 0811): Test Method for Measurement of Chip (Die) Strength by Mean of 3-Point Bending |
TBD | SNARF | 5 Year Review TF | Reapproval of SEMI G88-0211: Specification for Tape Frame for 450 mm Wafer |
TBD | SNARF | Thin Chip Handling TF | Line Item Revision to SEMI G97-0116: Specification for Adhesive Tray Used for Thin Chip Handling |
Note: SNARFs and TFOFs are available for review on the SEMI Web site at:
http://downloads.semi.org/web/wstdsbal.nsf/TFOFSNARF
Authorized Ballots
Listing of documents approved by the committee for letter ballot.
# | When | SC/TF/WG | Details |
TBD | Cycle 6-16 | Thin Chip Handling TF | Line Item Revision to SEMI G97-0116: Specification for Adhesive Tray Used for Thin Chip Handling |
5881 | Cycle 6-16 | 5 Year Review TF | Reapproval of SEMI G83-0912: Specification for Bar Code Marking of Product Packages |
TBD | Cycle 6-16 | 5 Year Review TF | Revision to SEMI G20-96: Specification for Lead Finishes for Plastic Packages (Active Devices Only) |
TBD | Cycle 6-16 | 5 Year Review TF | Revision to SEMI G21-94: Specification for Plating Integrated Circuit Leadframes |
TBD | Cycle 6-16 | 5 Year Review TF | Revision to SEMI G41-87: Specification for Dual Strip SOIC Leadframe |
TBD | Cycle 6-16 | 5 Year Review TF | Line Item Revision to SEMI G86-0303 (Reapproved 0811): Test Method for Measurement of Chip (Die) Strength by Mean of 3-Point Bending |
TBD | Cycle 6-16 | 5 Year Review TF | Reapproval of SEMI G88-0211: Specification for Tape Frame for 450 mm Wafer |
SNARF(s) Granted a One-Year Extension
None.
SNARF(s) Cancelled
None.
Standard(s) to receive Inactive Status
None.
Special Announcements of the Committee (Workshops, Programs, etc.)
Draft SNARF for Revision to SEMI G44-94: Specification for Lead Finishes for Glass to Metal Seal Ceramic Packages (Active Devices Only) was distributed to the global TC members for two weeks review. However, the TC Chapter agreed to get this Standard inactive at this meeting.
Next Meeting
Next meeting to be held on Tuesday, October 4, 2016, 14:30-17:30 at SEMI Japan office in conjunction with Japan Standards Fall Meetings.
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