SEMI International Standards
Standards Locale: North America |
Committee: 3DS-IC |
Place of Meeting: San Francisco Marriott Marquis Hotel in San Francisco, California |
Date of Meeting: 07/08/2014 |
Meeting End Date: 07/08/2014 |
|
Recording SEMI Standards Staff: Paul Trio |
CER Posted to Web: 07/25/2014 |
Leadership Changes
None.
Committee Structure Changes
None.
Ballot Results
Passed ballots and line items will be submitted to the ISC Audit & Review Subcommittee for procedural review.
Failed ballots and line items were returned to the originating task forces for re-work and re-balloting.
Document # | Document Title | Committee Action | A&R Forms for Approved Ballots |
5173E | New Standard: Guide for Describing Silicon Wafers for Use in a 300 mm 3DS-IC Wafer Stack | Failed, to be reballoted | |
5447A | New Standard: Terminology for Through Glass Via and Blind Via in Glass Geometrical Metrology | Passed as balloted. Superclean | |
5506 | New Standard: Guide for Measuring Warp, Bow and TTV on Low Stiffness Wafers | Failed, to be reballoted | |
Ratification Ballot Results
None.
Activities Approved by the GCS between meetings of TC Chapter meeting
None.
Authorized Activities
None.
Authorized Ballots
# | When | SC/TF/WG | Details |
5270 | Cycle 5 or 6, 2014 | Inspection & Metrology TF | New Standard: Guide for Measuring Voids in Bonded Wafer Stacks |
5506A | Cycle 5 or 6, 2014 | Inspection & Metrology TF | New Standard: Guide for Measuring Warp, Bow and TTV on Low Stiffness Wafers |
SNARF(s) Granted a One-Year Extension
None.
SNARF(s) Cancelled
None.
Standard(s) to receive Inactive Status
None.
Special Announcements of the Committee (Workshops, Programs, etc.)
Submission for 3DS-IC GCS Approval
The following items will be submitted to the 3DS-IC Global Coordinating Subcommittee (GCS) for review and approval:
Document 5173E Reballot
Additional discussion will be needed on how to best structure the 5173F (New Standard: Guide for Describing Silicon Wafers for Use in a 300 mm 3DS-IC Wafer Stack) document since it will require SEMI M1 to implement. The intent is that requirements/values unique to Document 5173 will be provided; otherwise, users will be referred to M1. Once the appropriate approach has been identified, GCS approval will requested accordingly.
Auxiliary Information related to SNARF #5270
The Inspection & Metrology TF intends to develop an auxiliary document related to the SNARF # 5270 (New Standard: Guide for Measuring Voids in Bonded Wafer Stacks) activity. The TF will prepare a SNARF for the Auxiliary Information to submit for GCS approval.
SNARF #5616 Revision
The Inspection & Metrology TF intends to update the #5616 SNARF from a line item revision of SEMI 3D4 (Guide for Metrology for Measuring Thickness, Total Thickness Variation (TTV), Bow, Warp/Sori, and Flatness of Bonded Wafer Stacks) to a major revision of SEMI 3D4. The TF will prepare a SNARF for the Auxiliary Information to submit for GCS approval.
SEMI 3DS-IC Google Site
This site contains information on 3DS-IC task forces, recent meeting information, upcoming meeting schedule, and other pertinent information:
https://sites.google.com/a/semi.org/3dsic/
Next Meeting
North America Standards Fall 2014 Meetings
November 3-6, 2014
SEMI Headquarters
3081 Zanker Road
San Jose, California 95134
U.S.A.
Tuesday, November 4
- Inspection & Metrology TF (8:00 AM to 10:00 AM, U.S. Pacific Time)
- Bonded Wafer Stacks TF (10:00 AM to 12:00 Noon)
- Thin Wafer Handling TF (1:00 PM to 3:00 PM)
- NA 3DS-IC Committee (3:00 PM to 5:00 PM)
For more information, please visit: http://www.semi.org/en/node/50511
Copyright ©2024 Semiconductor Equipment and Materials International (SEMI®). All rights reserved.