SEMI International Standards
| Standards Locale: North America |
| Committee: EHS |
| Place of Meeting: San Francisco Marriott Marquis Hotel in San Francisco, California |
| Date of Meeting: 07/16/2015 |
| Meeting End Date: 07/16/2015 |
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| Recording SEMI Standards Staff: Paul Trio |
| CER Posted to Web: 07/28/2015 |
Leadership Changes
Group | Previous Leader | New Leader |
| S10 Task Force | | Mark Fessler (Tokyo Electron) and Eric Sklar (Safety Guru, LLC) have been appointed as TF co-leaders. |
| S1 Revision Task Force disbanded. | Lauren Crane (KLA-Tencor) and Edward Karl (Applied Materials) stepped down as TF leaders. | |
Committee Structure Changes
None.
Ballot Results
Passed ballots and line items will be submitted to the ISC Audit & Review Subcommittee for procedural review.
Failed ballots and line items were returned to the originating task forces for re-work and re-balloting.
Document # | Document Title | Committee Action | A&R Forms for Approved Ballots |
| Cycle 4, 2015 Ballots | | |
4316L | Line Item Revision to SEMI S2-0715, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment, and SEMI S22-0715, Safety Guideline for the Electrical Design of Semiconductor Manufacturing Equipment. Delayed Revision related to Fail-to-safe Equipment Control Systems (FECS) and PM Alignment | |  4316LProceduralReview.docx |
Line Item 1 | Clarification/Improvement of the FECS criteria | Failed, to be reballoted | |
Line Item 2 | Removing the list of sections from 2.2 of SEMI S22 and inserting a table of contents to replace it | Passed with editorial changes | |
| Cycle 5, 2015 Ballots | | |
4449E | Line Item Revisions to SEMI S2, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment. Delayed Revisions related to Work at Elevated Locations and Design Criteria for Platforms, Steps, and Ladders | |  4449E-LI1 Ballot Review FAILED.docx |
Line Item 1 | Addition of a Delayed Revisions Section Related to Work at Elevated Locations and Design Criteria for Platforms, Steps, and Ladders | Failed, to be reballoted | |
4683F | Line Item Revision to SEMI S2-0715, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment. Delayed Revisions Related to Chemical Exposure | |  4683F-LI1 Ballot Review FAILED.docx |
Line Item 1 | Delayed Revisions Related to Chemical Exposure Criteria | Failed, to be reballoted | |
5009D | Line Item Revisions to SEMI S8-0712a, Safety Guidelines for Ergonomics Engineering of Semiconductor Manufacturing Equipment with title change to: Safety Guideline for Ergonomics Engineering of Semiconductor Manufacturing Equipment | |  5009DProceduralReview.docx |
Line Item 1 | Change the Word “Guidelines” to “Guideline” in the Document Title | Passed as balloted | |
Line Item 2 | Ergonomics Clearances Considerations | Passed as balloted. Superclean | |
Line Item 3 | Changes to Appendix 1, Section 6: Handle Design Criteria, addition of an Appendix providing handle assessment criteria, and addition of several documents to §8 Related documents | Passed with editorial changes | |
Line Item 4 | Changes to Appendix 1, Section 7: New Whole Body Clearance Criteria, Movement (within Appendix 1) of Select Criteria to a New Maintenance and Service Section, and addition of documents to §8 Related Documents | Passed with editorial changes | |
5761 | New Standard: Safety Guideline for Use of Energetic Materials in Semiconductor R&D and Manufacturing Processes | Failed, to be reballoted |  5761 Ballot Review FAILED.docx |
Approved Editorial Changes Outside of the Balloting Process
Document # | Document Title | A&R Forms for Approved Editorial Changes |
SEMI S12 | Environmental, Health and Safety Guideline for Manufacturing Equipment Decontamination |  S12EditorialChangeProceduralReview.docx |
Editorial Change | Add a comma (,) between “Health” and “and” in the title of S12.
From:
Environmental, Health and Safety Guideline for Manufacturing Equipment Decontamination
To:
Environmental, Health, and Safety Guideline for Manufacturing Equipment Decontamination |
Ratification Ballot Results
None.
Activities Approved by the GCS between meetings of TC Chapter meeting
None.
Authorized Activities
# | Type | SC/TF/WG | Details |
| TBA | SNARF | S23 Global TF | Revision to SEMI S23, Guide for Conservation of Energy, Utilities and Materials Used by Semiconductor Manufacturing Equipment. New scope and small changes.
To be submitted for GCS approval after two-week global EHS technical committee review and comment. |
| TBA | SNARF | S8 Ergonomics TF | Line Item Revisions to SEMI S8, Safety Guidelines for Ergonomics Engineering of Semiconductor Manufacturing Equipment. Addition of reference to a manual material-handling guide in SEMI-S8, Appendix 2, Lifting, Strength, and Materials Handling |
TBA – to be announced
Note: SNARFs and TFOFs are available for review on the SEMI Web site at:
http://downloads.semi.org/web/wstdsbal.nsf/TFOFSNARF
Authorized Ballots
# | When | SC/TF/WG | Details |
| 5761A | Cycle 7, 2015 | Energetic Materials EHS TF | New Standard: Safety Guideline for Use of Energetic Materials in Semiconductor R&D and Manufacturing Processes |
| 4449F | Cycle 7, 2015 | S2 Ladders & Steps TF | Line Item Revisions to SEMI S2, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment.
Delayed Revisions related to Work at Elevated Locations and Design Criteria for Platforms, Steps, and Ladders |
| 4316M | Cycle 7, 2015 | S22 TF | Line Item Revision to SEMI S2, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment, and SEMI S22-0715, Safety Guideline for the Electrical Design of Semiconductor Manufacturing Equipment.
Delayed Revision related to Fail-to-safe Equipment Control Systems (FECS) |
| 5892 | Cycle 7, 2015 | Flow Limitation (S5 Revision) TF | Line Item Revisions to SEMI S5, Safety Guideline for Sizing and Identifying Flow Limiting Devices for Gas Cylinder Valves |
| 4683G | Cycle 7, 2015 | S2 Chemical Exposure TF | Line Item Revision to SEMI S2, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment.
Delayed Revisions Related to Chemical Exposure |
SNARF(s) Granted a One-Year Extension
None.
SNARF(s) Cancelled
None.
Standard(s) to receive Inactive Status
None.
Special Announcements of the Committee (Workshops, Programs, etc.)
S23 Major Revision Activity
At the North America (NA) EHS Technical Committee (TC) Chapter meeting held July 16, in conjunction with SEMICON West 2015, the committee approved a new SNARF to revise SEMI S23, Guide for Conservation of Energy, Utilities and Materials Used by Semiconductor Manufacturing Equipment. This is a major revision of S23.
Rationale: 1) The TF has come to understand that equipment efficiency improvements may be more practicable than overall equipment energy reduction and would like to provide guidance for this topic in S23, and are advised by Japan TC that providing efficiency guidance requires a scope change because ‘energy efficiency’ is not quite the same a ‘energy conservation’. 2) The TF has prepared guidance on energy efficiency improvements for S23 section 12 and would like to ballot that guidance. 3) Efforts in the ESEC TF to create a subsystem ‘sleep mode’ communications protocol drive a need to better define and describe subsystems in S23.
Scope:
1) The scope of S23 will be modified to include ‘energy efficiency’ (meaning a concept of energy used per unit of achieved work and which implies a conservation of energy), and related changes will be made throughout the document where ‘conservation’ is currently used, as needed.
2) Guidance will be provided related to the point that if the productive efficiency of a tool is increased at a greater ratio than the related rise in energy consumption, it can be beneficial to the overall energy conservation goal.
3) Some definitions related to subsystems and text explain how subsystems relate to main equipment.
Since the SNARF had not been issued for TC Member review in accordance with § 8.2.1 of the SEMI Standards Regulations, it will be sent for TC Member review, a request to the GCS for final approval of the SNARF.
Finally, the NA EHS TC Chapter requests for the Japan EHS TC Chapter to publish the S23 revision ballot and adjudicate the ballot in Japan.
S2 Ladders & Steps TF SNARF # 4449 Continuing
At the NA EHS TC Chapter meeting held July 16, in conjunction with SEMICON West 2015, the committee found the S2 Ladders & Steps TF activity – Line Item Revisions to SEMI S2, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment. Delayed Revisions related to Work at Elevated Locations and Design Criteria for Platforms, Steps, and Ladders – to be continuing in accordance with § 8.3.2 of the SEMI Standards Regulations and granted a one-year extension.
S6 Revision TF SNARF # 4975 Continuing
At the NA EHS TC Chapter meeting held July 16, in conjunction with SEMICON West 2015, the committee found the S6 Revision TF activity – Revision to SEMI S6, EHS Guideline for Exhaust Ventilation of Semiconductor Manufacturing Equipment. Line item revisions for addressing gas detectors and other concerns – to be continuing in accordance with § 8.3.2 of the SEMI Standards Regulations and granted a one-year extension.
S22 TF SNARF # 4316 Continuing
At the NA EHS TC Chapter meeting held July 16, in conjunction with SEMICON West 2015, the committee found the S22 TF activity – Line Item Revision to SEMI S2, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment, and SEMI S22, Safety Guideline for the Electrical Design of Semiconductor Manufacturing Equipment. Delayed Revision related to Fail-to-safe Equipment Control Systems (FECS) – to be continuing in accordance with § 8.3.2 of the SEMI Standards Regulations and granted a one-year extension.
Next Meeting
NA Standards Fall 2015 Meetings
November 2-5, 2015
SEMI Headquarters
3081 Zanker Road
San Jose, California 95134
U.S.A.
Monday, November 2
- S22 (Electrical Safety) TF (9:00 AM to 10:30 AM)
- S27 (Report Contents) Revision TF (10:30 AM to 11:30 AM)
- S2 Non-Ionizing Radiation TF (11:30 AM to 12:00 Noon)
- EHS Process Meeting (1:00 PM to 2:00 PM)
- S2 Chemical Exposure TF (2:00 PM to 3:30 PM)
- Flow Limitation (S5 Revision) TF (3:30 PM to 5:00 PM)
- NA Seismic Liaison TF (5:00 PM to 6:00 PM)
Tuesday, November 3
- S10 TF (10:00 AM to 11:00 AM)
- S6 Revision TF (11:00 AM to 12:00 Noon)
- Energetic Materials EHS TF (1:00 PM to 2:30 PM)
- S2 Ladders & Steps TF (2:30 PM to 4:00 PM)
- S8 Ergonomics TF (4:00 PM to 5:00 PM)
- S23 Revision Global TF (5:00 PM to 6:00 PM)
Wednesday, November 4
- {International Compliance and Regulatory Committee [ICRC] (8:00 AM to 12:00 Noon)}
- EHS Leadership Meeting (12:00 Noon to 1:00 PM)
- Hazardous Energy Control Isolation Devices TF (1:00 PM to 2:30 PM)
- Manufacturing Equipment Safety Subcommittee [MESSC] (2:30 PM to 4:00 PM)
- Fire Protection TF (4:00 PM to 5:00 PM)
Thursday, November 5
- EHS Committee (9:00 AM to 6:00 PM)
For more information, please visit: http://www.semi.org/standards
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