# | SC/TF/WG | Details |
6154 | Packaging 5 Year Review Task Force | Line Item Revision to SEMI G10-96 (Reapproved 0811): “Standard Method for Mechanical Measurement of Plastic Package Leadframes” with non-conforming title change to “Test Method for Mechanical Measurement of Plastic Package Leadframes” |
6148 | Packaging 5 Year Review Task Force | Line Item Revision to SEMI G18-96 (Reapproved 0811) “Standard for Integrated Circuit Leadframe Material Used in the Production of Etched Leadframes” with non-conforming title change to “Specification for Integrated Circuit Leadframe Material Used in the Production of Etched Leadframes” |
6149 | Packaging 5 Year Review Task Force | Line Item Revision to SEMI G38-0996 (Reapproved 0811) “Test Method for Still- and Forced-Air Junction-to-Ambient Thermal Resistance Measurements of Integrated Circuit Packages” |
6150 | Packaging 5 Year Review Task Force | Line Item Revision to SEMI G56-93 (Reapproved 0811) “Test Method for Measurement of Silver Plating Thickness” |
6155 | Packaging 5 Year Review Task Force | Line Item Revision to SEMI G62-95 (Reapproved 0811) “Test Method for Silver Plating Quality” |
6151 | Packaging 5 Year Review Task Force | Line Item Revision to SEMI G65-96 (Reapproved 0811) “Test Method for Evaluation of Leadframe Materials Used for L-Leaded (Gull Wing Type) Packages” |
6156 | Packaging 5 Year Review Task Force | Line Item Revision to SEMI G70-0996 (Reapproved 0811) “Standard for Equipment and Leadframe Fixtures for Measurement of Plastic Package Leadframes” with non-conforming title change to “Specification for Equipment and Leadframe Fixtures for Measurement of Plastic Package Leadframes” |
6167 | Packaging 5 Year Review Task Force | Line Item Revision to SEMI G73-0997 (Reapproved 0811) “Test Method for Pull Strength for Wire Bonding” |
6152 | Packaging 5 Year Review Task Force | Line Item Revision to SEMI G93-0412: “Measurement Method for Solder Sphere Size for Ball Grid Array Package” with non-conforming title change to “Test Method for Solder Sphere Size for Ball Grid Array Package” |
6157 | Packaging 5 Year Review Task Force | Reapproval of SEMI G23-0996 (Reapproved 0811): Test Method of Inductance for Internal Traces of Semiconductor Packages |
6158 | Packaging 5 Year Review Task Force | Reapproval of SEMI G42-0996 (Reapproved 0811): Specification for Thermal Test Board Standardization for Measuring Junction-to-Ambient Thermal Resistance of Semiconductor Packages |
6159 | Packaging 5 Year Review Task Force | Reapproval of SEMI G59-94 (Reapproved 0811): Test Method for Measurement of Ionic Contamination on Leadframe Interleafing and the Contamination Transferred from the Interleafing to the Leadframes |
6160 | Packaging 5 Year Review Task Force | Reapproval of SEMI G60-94 (Reapproved 0811): Test Method for the Measurement of Electrostatic Properties of Semiconductor Leadframe Interleafing Materials |
6161 | Packaging 5 Year Review Task Force | Reapproval of SEMI G66-96 (Reapproved 0811): Test Method for the Measurement of Water Absorption Characteristics for Semiconductor Plastic Molding Compounds |
6162 | Packaging 5 Year Review Task Force | Reapproval of SEMI G67-0996 (Reapproved 0811): Test Method for the Measurement of Particle Generation from Sheet Materials |
6163 | Packaging 5 Year Review Task Force | Reapproval of SEMI G68-0996 (Reapproved 0811): Test Method for Junction-to-Case Thermal Resistance Measurements in Air Environment for Semiconductor Packages |
6164 | Packaging 5 Year Review Task Force | Reapproval of SEMI G69-0996 (Reapproved 0811): Test Method for Measurement of Adhesive Strength Between Leadframes and Molding Compounds |
6165 | Packaging 5 Year Review Task Force | Reapproval of SEMI G71-0996 (Reapproved 0811): Specification for Barcode Marking of Intermediate Containers for Packaging Materials |
6166 | Packaging 5 Year Review Task Force | Reapproval of SEMI G89-0211: Specification for Leadframe Strip Size |
6153 | Packaging 5 Year Review Task Force | Reapproval of SEMI G90-0811: Specification for 300 mm Wafer Coin-Stack Type Shipping Container Used for Test and Packaging Processes |
# | When | TF | Details |
6154 | Cycle 4 | Packaging 5 Year Review Task Force | Line Item Revision to SEMI G10-96 (Reapproved 0811): “Standard Method for Mechanical Measurement of Plastic Package Leadframes” with non-conforming title change to “Test Method for Mechanical Measurement of Plastic Package Leadframes” |
6148 | Cycle 4 | Packaging 5 Year Review Task Force | Line Item Revision to SEMI G18-96 (Reapproved 0811) “Standard for Integrated Circuit Leadframe Material Used in the Production of Etched Leadframes” with non-conforming title change to “Specification for Integrated Circuit Leadframe Material Used in the Production of Etched Leadframes” |
6149 | Cycle 4 | Packaging 5 Year Review Task Force | Line Item Revision to SEMI G38-0996 (Reapproved 0811) “Test Method for Still- and Forced-Air Junction-to-Ambient Thermal Resistance Measurements of Integrated Circuit Packages” |
6150 | Cycle 4 | Packaging 5 Year Review Task Force | Line Item Revision to SEMI G56-93 (Reapproved 0811) “Test Method for Measurement of Silver Plating Thickness” |
6155 | Cycle 4 | Packaging 5 Year Review Task Force | Line Item Revision to SEMI G62-95 (Reapproved 0811) “Test Method for Silver Plating Quality” |
6151 | Cycle 4 | Packaging 5 Year Review Task Force | Line Item Revision to SEMI G65-96 (Reapproved 0811) “Test Method for Evaluation of Leadframe Materials Used for L-Leaded (Gull Wing Type) Packages” |
6156 | Cycle 4 | Packaging 5 Year Review Task Force | Line Item Revision to SEMI G70-0996 (Reapproved 0811) “Standard for Equipment and Leadframe Fixtures for Measurement of Plastic Package Leadframes” with non-conforming title change to “Specification for Equipment and Leadframe Fixtures for Measurement of Plastic Package Leadframes” |
6167 | Cycle 4 | Packaging 5 Year Review Task Force | Line Item Revision to SEMI G73-0997 (Reapproved 0811) “Test Method for Pull Strength for Wire Bonding” |
6152 | Cycle 4 | Packaging 5 Year Review Task Force | Line Item Revision to SEMI G93-0412: “Measurement Method for Solder Sphere Size for Ball Grid Array Package” with non-conforming title change to “Test Method for Solder Sphere Size for Ball Grid Array Package” |
6157 | Cycle 4 | Packaging 5 Year Review Task Force | Reapproval of SEMI G23-0996 (Reapproved 0811): Test Method of Inductance for Internal Traces of Semiconductor Packages |
6158 | Cycle 4 | Packaging 5 Year Review Task Force | Reapproval of SEMI G42-0996 (Reapproved 0811): Specification for Thermal Test Board Standardization for Measuring Junction-to-Ambient Thermal Resistance of Semiconductor Packages |
6159 | Cycle 4 | Packaging 5 Year Review Task Force | Reapproval of SEMI G59-94 (Reapproved 0811): Test Method for Measurement of Ionic Contamination on Leadframe Interleafing and the Contamination Transferred from the Interleafing to the Leadframes |
6160 | Cycle 4 | Packaging 5 Year Review Task Force | Reapproval of SEMI G60-94 (Reapproved 0811): Test Method for the Measurement of Electrostatic Properties of Semiconductor Leadframe Interleafing Materials |
6161 | Cycle 4 | Packaging 5 Year Review Task Force | Reapproval of SEMI G66-96 (Reapproved 0811): Test Method for the Measurement of Water Absorption Characteristics for Semiconductor Plastic Molding Compounds |
6162 | Cycle 4 | Packaging 5 Year Review Task Force | Reapproval of SEMI G67-0996 (Reapproved 0811): Test Method for the Measurement of Particle Generation from Sheet Materials |
6163 | Cycle 4 | Packaging 5 Year Review Task Force | Reapproval of SEMI G68-0996 (Reapproved 0811): Test Method for Junction-to-Case Thermal Resistance Measurements in Air Environment for Semiconductor Packages |
6164 | Cycle 4 | Packaging 5 Year Review Task Force | Reapproval of SEMI G69-0996 (Reapproved 0811): Test Method for Measurement of Adhesive Strength Between Leadframes and Molding Compounds |
6165 | Cycle 4 | Packaging 5 Year Review Task Force | Reapproval of SEMI G71-0996 (Reapproved 0811): Specification for Barcode Marking of Intermediate Containers for Packaging Materials |
6166 | Cycle 4 | Packaging 5 Year Review Task Force | Reapproval of SEMI G89-0211: Specification for Leadframe Strip Size |
6153 | Cycle 4 | Packaging 5 Year Review Task Force | Reapproval of SEMI G90-0811: Specification for 300 mm Wafer Coin-Stack Type Shipping Container Used for Test and Packaging Processes |
Standard Designation | Title |
SEMI G8-94 (Reapproved 0811) | Test Method for Gold Plating |
SEMI G19-0997 (Reapproved 0811) | Specification for Dip Leadframes Produced by Etching |
SEMI G30-88 (Reapproved 0811) | Test Method for Junction-to-Case Thermal Resistance Measurements of Ceramic Packages |
SEMI G32-94 (Reapproved 0811) | Guideline for Unencapsulated Thermal Test Chip |
SEMI G58-94 (Reapproved 0811) | Specification for Cerquad Package Constructions |