SEMI International Standards
Standards Locale: Japan
Committee: Assembly & Packaging
Place of Meeting: SEMI Japan office, Tokyo
Date of Meeting: 03/13/2017
Meeting End Date: 03/13/2017
Recording SEMI Standards Staff: Chie Yanagisawa
CER Posted to Web: 03/27/2017


Leadership Changes
None.

Committee Structure Changes
None.

Ballot Results
None.

Ratification Ballot Results
None.

Activities Approved by the GCS between meetings of TC Chapter meeting
None.

Authorized Activities

#
SC/TF/WG
Details
6154Packaging 5 Year Review Task ForceLine Item Revision to SEMI G10-96 (Reapproved 0811): “Standard Method for Mechanical Measurement of Plastic Package Leadframes” with non-conforming title change to “Test Method for Mechanical Measurement of Plastic Package Leadframes”
6148Packaging 5 Year Review Task ForceLine Item Revision to SEMI G18-96 (Reapproved 0811) “Standard for Integrated Circuit Leadframe Material Used in the Production of Etched Leadframes” with non-conforming title change to “Specification for Integrated Circuit Leadframe Material Used in the Production of Etched Leadframes”
6149Packaging 5 Year Review Task ForceLine Item Revision to SEMI G38-0996 (Reapproved 0811) “Test Method for Still- and Forced-Air Junction-to-Ambient Thermal Resistance Measurements of Integrated Circuit Packages”
6150Packaging 5 Year Review Task ForceLine Item Revision to SEMI G56-93 (Reapproved 0811) “Test Method for Measurement of Silver Plating Thickness”
6155Packaging 5 Year Review Task ForceLine Item Revision to SEMI G62-95 (Reapproved 0811) “Test Method for Silver Plating Quality”
6151Packaging 5 Year Review Task ForceLine Item Revision to SEMI G65-96 (Reapproved 0811) “Test Method for Evaluation of Leadframe Materials Used for L-Leaded (Gull Wing Type) Packages”
6156Packaging 5 Year Review Task ForceLine Item Revision to SEMI G70-0996 (Reapproved 0811) “Standard for Equipment and Leadframe Fixtures for Measurement of Plastic Package Leadframes” with non-conforming title change to “Specification for Equipment and Leadframe Fixtures for Measurement of Plastic Package Leadframes”
6167Packaging 5 Year Review Task ForceLine Item Revision to SEMI G73-0997 (Reapproved 0811) “Test Method for Pull Strength for Wire Bonding”
6152Packaging 5 Year Review Task ForceLine Item Revision to SEMI G93-0412: “Measurement Method for Solder Sphere Size for Ball Grid Array Package” with non-conforming title change to “Test Method for Solder Sphere Size for Ball Grid Array Package”
6157Packaging 5 Year Review Task ForceReapproval of SEMI G23-0996 (Reapproved 0811): Test Method of Inductance for Internal Traces of Semiconductor Packages
6158Packaging 5 Year Review Task ForceReapproval of SEMI G42-0996 (Reapproved 0811): Specification for Thermal Test Board Standardization for Measuring Junction-to-Ambient Thermal Resistance of Semiconductor Packages
6159Packaging 5 Year Review Task ForceReapproval of SEMI G59-94 (Reapproved 0811): Test Method for Measurement of Ionic Contamination on Leadframe Interleafing and the Contamination Transferred from the Interleafing to the Leadframes
6160Packaging 5 Year Review Task ForceReapproval of SEMI G60-94 (Reapproved 0811): Test Method for the Measurement of Electrostatic Properties of Semiconductor Leadframe Interleafing Materials
6161Packaging 5 Year Review Task ForceReapproval of SEMI G66-96 (Reapproved 0811): Test Method for the Measurement of Water Absorption Characteristics for Semiconductor Plastic Molding Compounds
6162Packaging 5 Year Review Task ForceReapproval of SEMI G67-0996 (Reapproved 0811): Test Method for the Measurement of Particle Generation from Sheet Materials
6163Packaging 5 Year Review Task ForceReapproval of SEMI G68-0996 (Reapproved 0811): Test Method for Junction-to-Case Thermal Resistance Measurements in Air Environment for Semiconductor Packages
6164Packaging 5 Year Review Task ForceReapproval of SEMI G69-0996 (Reapproved 0811): Test Method for Measurement of Adhesive Strength Between Leadframes and Molding Compounds
6165Packaging 5 Year Review Task ForceReapproval of SEMI G71-0996 (Reapproved 0811): Specification for Barcode Marking of Intermediate Containers for Packaging Materials
6166Packaging 5 Year Review Task ForceReapproval of SEMI G89-0211: Specification for Leadframe Strip Size
6153Packaging 5 Year Review Task ForceReapproval of SEMI G90-0811: Specification for 300 mm Wafer Coin-Stack Type Shipping Container Used for Test and Packaging Processes


Authorized Ballots

#
When
TF
Details
6154Cycle 4Packaging 5 Year Review Task ForceLine Item Revision to SEMI G10-96 (Reapproved 0811): “Standard Method for Mechanical Measurement of Plastic Package Leadframes” with non-conforming title change to “Test Method for Mechanical Measurement of Plastic Package Leadframes”
6148Cycle 4Packaging 5 Year Review Task ForceLine Item Revision to SEMI G18-96 (Reapproved 0811) “Standard for Integrated Circuit Leadframe Material Used in the Production of Etched Leadframes” with non-conforming title change to “Specification for Integrated Circuit Leadframe Material Used in the Production of Etched Leadframes”
6149Cycle 4Packaging 5 Year Review Task ForceLine Item Revision to SEMI G38-0996 (Reapproved 0811) “Test Method for Still- and Forced-Air Junction-to-Ambient Thermal Resistance Measurements of Integrated Circuit Packages”
6150Cycle 4Packaging 5 Year Review Task ForceLine Item Revision to SEMI G56-93 (Reapproved 0811) “Test Method for Measurement of Silver Plating Thickness”
6155Cycle 4Packaging 5 Year Review Task ForceLine Item Revision to SEMI G62-95 (Reapproved 0811) “Test Method for Silver Plating Quality”
6151Cycle 4Packaging 5 Year Review Task ForceLine Item Revision to SEMI G65-96 (Reapproved 0811) “Test Method for Evaluation of Leadframe Materials Used for L-Leaded (Gull Wing Type) Packages”
6156Cycle 4Packaging 5 Year Review Task ForceLine Item Revision to SEMI G70-0996 (Reapproved 0811) “Standard for Equipment and Leadframe Fixtures for Measurement of Plastic Package Leadframes” with non-conforming title change to “Specification for Equipment and Leadframe Fixtures for Measurement of Plastic Package Leadframes”
6167Cycle 4Packaging 5 Year Review Task ForceLine Item Revision to SEMI G73-0997 (Reapproved 0811) “Test Method for Pull Strength for Wire Bonding”
6152Cycle 4Packaging 5 Year Review Task ForceLine Item Revision to SEMI G93-0412: “Measurement Method for Solder Sphere Size for Ball Grid Array Package” with non-conforming title change to “Test Method for Solder Sphere Size for Ball Grid Array Package”
6157Cycle 4Packaging 5 Year Review Task ForceReapproval of SEMI G23-0996 (Reapproved 0811): Test Method of Inductance for Internal Traces of Semiconductor Packages
6158Cycle 4Packaging 5 Year Review Task ForceReapproval of SEMI G42-0996 (Reapproved 0811): Specification for Thermal Test Board Standardization for Measuring Junction-to-Ambient Thermal Resistance of Semiconductor Packages
6159Cycle 4Packaging 5 Year Review Task ForceReapproval of SEMI G59-94 (Reapproved 0811): Test Method for Measurement of Ionic Contamination on Leadframe Interleafing and the Contamination Transferred from the Interleafing to the Leadframes
6160Cycle 4Packaging 5 Year Review Task ForceReapproval of SEMI G60-94 (Reapproved 0811): Test Method for the Measurement of Electrostatic Properties of Semiconductor Leadframe Interleafing Materials
6161Cycle 4Packaging 5 Year Review Task ForceReapproval of SEMI G66-96 (Reapproved 0811): Test Method for the Measurement of Water Absorption Characteristics for Semiconductor Plastic Molding Compounds
6162Cycle 4Packaging 5 Year Review Task ForceReapproval of SEMI G67-0996 (Reapproved 0811): Test Method for the Measurement of Particle Generation from Sheet Materials
6163Cycle 4Packaging 5 Year Review Task ForceReapproval of SEMI G68-0996 (Reapproved 0811): Test Method for Junction-to-Case Thermal Resistance Measurements in Air Environment for Semiconductor Packages
6164Cycle 4Packaging 5 Year Review Task ForceReapproval of SEMI G69-0996 (Reapproved 0811): Test Method for Measurement of Adhesive Strength Between Leadframes and Molding Compounds
6165Cycle 4Packaging 5 Year Review Task ForceReapproval of SEMI G71-0996 (Reapproved 0811): Specification for Barcode Marking of Intermediate Containers for Packaging Materials
6166Cycle 4Packaging 5 Year Review Task ForceReapproval of SEMI G89-0211: Specification for Leadframe Strip Size
6153Cycle 4Packaging 5 Year Review Task ForceReapproval of SEMI G90-0811: Specification for 300 mm Wafer Coin-Stack Type Shipping Container Used for Test and Packaging Processes


SNARF(s) Granted a One-Year Extension
None.

SNARF(s) Cancelled
None.

Standard(s) to receive Inactive Status

Standard Designation
Title
SEMI G8-94 (Reapproved 0811)Test Method for Gold Plating
SEMI G19-0997 (Reapproved 0811)Specification for Dip Leadframes Produced by Etching
SEMI G30-88 (Reapproved 0811)Test Method for Junction-to-Case Thermal Resistance Measurements of Ceramic Packages
SEMI G32-94 (Reapproved 0811)Guideline for Unencapsulated Thermal Test Chip
SEMI G58-94 (Reapproved 0811)Specification for Cerquad Package Constructions


Special Announcements of the Committee (Workshops, Programs, etc.)
The discharge of Fiducial Mark Interoperability Task Force under the Assembly & Packaging Japan TC Chapter is agreed at this TC Chapter meeting.
The TF is under the Japan TC Chapters of Assembly & Packaging, I&C, PIC, Silicon Wafers and Traceability TCs. The TF’s discharge under the Silicon Wafers Japan TC Chapter was agreed at the TC Chapter meeting held on March 10, 2017. If the Japan TC Chapters of I&C, PIC and Traceability agree the discharge respectively, then the TF is finally discharged.

Next Meeting
The next TC Chapter meeting will be held as follows.
Date: July 24
Time 14:00-17:00
Location: SEMI Japan office, Tokyo, Japan