SEMI International Standards
Standards Locale: North America
Committee: Silicon Wafer
Place of Meeting: KLA-Tencor, Milpitas, California
Date of Meeting: 04/04/2017
Meeting End Date: 04/04/2017
Recording SEMI Standards Staff: James Amano
CER Posted to Web: 04/12/2017


Leadership Changes
None.

Committee Structure Changes
None.

Ballot Results
None.

Ratification Ballot Results
None.

Activities Approved by the GCS between meetings of TC Chapter meeting
None.

Authorized Activities

#
SC/TF/WG
Details
5915Int’l Advanced Wafer Geometry TFLine Item Revision to SEMI M1-1016, Addition to Related Information: Illustration of Flatness Metrics for Silicon Wafers SNARF REVISED to remove “shape” from title, rationale, and scope
6168Int’l Advanced Wafer Geometry TFLine Item revision to add new Related Information about area (sector) exclusions for the ERO-related standards M67-1015: Test Method For Determining Wafer Near-Edge Geometry From A Measured Thickness Data Array Using The ESFQR, ESFQD AND ESBIR Metrics and M68-1015 Test Method For Determining Wafer Near-Edge Geometry From A Measured Height Data Array Using A Curvature Metric, ZDD
6169Int’l Advanced Wafer Geometry TFLine Item Revision to MF1390-1014: Test Method For Measuring Bow And Warp On Silicon Wafer By Automated Noncontact Scanning to add Bow Bestfit metric
6170Int’l Advanced Wafer Geometry TFLine item Revision to SEMI M49 “Guide For Specifying Geometry Measurement Systems For Silicon Wafers For The 130 nm TO 16 nm Technology Generations


Authorized Ballots

#
When
TF
Details
5915Cycle 5-2017Int’l Advanced Wafer Geometry TFLine Item Revision to SEMI M1-1016, Addition to Related Information: Illustration of Flatness Metrics for Silicon Wafers
6019ACycle 5-2017International Polished Wafers Task ForceLine item revision of SEMI M1-0416, Specification for Polished Single Crystal Silicon Wafers
6041Cycle 5-2017International Advanced Wafer Geometry Task ForceLine Item revision of M21-1110 Guide For Assigning Addresses To Rectangular Elements In A Cartesian Array
6042ACycle 5-2017International Test Methods Task ForceLine Item Revision to SEMI MF1763-0706 (Reapproved 1111)Test Methods for Measuring Contrast of a Linear Polarizer
(Title correction for conformance)
6096Cycle 5-2017International Automated Advanced Surface Inspection Task ForceLine Item Revision to SEMI M53-0216 Practice for Calibrating Scanning Surface Inspection Systems Using Certified Depositions of Monodispere Reference Spheres on Unpatterned Semiconductor Wafer Surfaces (Addition of a related information section to SEMI M53 regarding the relationship of calibrated sizes assigned to defects by surface inspection systems to their actual physical size)
6169Cycle 5-2017Int’l Advanced Wafer Geometry TFLine Item Revision to MF1390-1014: Test Method For Measuring Bow And Warp On Silicon Wafer By Automated Noncontact Scanning to add Bow Bestfit metric


SNARF(s) Granted a One-Year Extension
None.

SNARF(s) Cancelled
None.

Standard(s) to receive Inactive Status
None

Special Announcements of the Committee (Workshops, Programs, etc.)
None.

Next Meeting
SEMICON West 2017. Check http://www.semi.org/en/standards-events for details.