SEMI International Standards
Standards Region: Japan
Committee: 3D Packaging and Integration
Place of Meeting: SEMI Japan office, Tokyo
Date of Meeting: 03/06/2020
Recording SEMI Standards Staff: Chie Yanagisawa
CER Posted to Web: 03/10/2020


Leadership Changes
None.

Committee Structure Changes
None.

Ballot Results
None.


Activities Approved by the GCS between meetings of TC Chapter meeting
None.

Authorized Activities
Listing of all revised or new SNARF(s) approved by the Originating TC Chapter.
#
Type
SC/TF/WG
Details
TBDNew SNARF3D Packaging & Integration 5 Year Review TFNew SNARF for Revision to SEMI G52-1115, “Test Method for Measurement of Ionic Contamination on Semiconductor Leadframes”
TBDNew SNARF450 mm Assembly & Test Die Preparation (ATDP) TFNew SNARF for Reapproval of SEMI G74-0699 (Reapproved 0215), “Specification for Tape Frame for 300 mm Wafers”
TBDNew SNARF450 mm Assembly & Test Die Preparation (ATDP) TFNew SNARF for Reapproval of SEMI G77-0699 (Reapproved 0215), “Specification for Frame Cassette for 300 mm Wafers”
TBDNew SNARF450 mm Assembly & Test Die Preparation (ATDP) TFNew SNARF for Reapproval of SEMI G82-1115, “Specification for 300 mm Load Port for Frame Cassettes in Backend Process”
TBDNew SNARF450 mm Assembly & Test Die Preparation (ATDP) TFNew SNARF for Reapproval of SEMI G87-1108 (Reapproved 0215), “Specification for Plastic Tape Frame for 300 mm Wafer”
TBDNew SNARF450 mm Assembly & Test Die Preparation (ATDP) TFNew SNARF for Reapproval of SEMI G92-0315, “Specification for Tape Frame Cassette for 450 mm Wafer”
Note 1: SNARFs and TFOFs are available for review on the SEMI Web site at:

http://downloads.semi.org/web/wstdsbal.nsf/TFOFSNARF

Authorized Ballots
Listing of documents authorized by the Originating TC Chapter for Letter Ballot.
#
When
TF
Details
TBDCycle 4-20203D Packaging & Integration 5 Year Review TFRevision to SEMI G52-1115, “Test Method for Measurement of Ionic Contamination on Semiconductor Leadframes”
TBDCycle 4-2020450 mm Assembly & Test Die Preparation (ATDP) TFReapproval of SEMI G74-0699 (Reapproved 0215), “Specification for Tape Frame for 300 mm Wafers”
TBDCycle 4-2020450 mm Assembly & Test Die Preparation (ATDP) TFReapproval of SEMI G77-0699 (Reapproved 0215), “Specification for Frame Cassette for 300 mm Wafers”
TBDCycle 4-2020450 mm Assembly & Test Die Preparation (ATDP) TFReapproval of SEMI G82-1115, “Specification for 300 mm Load Port for Frame Cassettes in Backend Process”
TBDCycle 4-2020450 mm Assembly & Test Die Preparation (ATDP) TFReapproval of SEMI G87-1108 (Reapproved 0215), “Specification for Plastic Tape Frame for 300 mm Wafer”
TBDCycle 4-2020450 mm Assembly & Test Die Preparation (ATDP) TFReapproval of SEMI G92-0315, “Specification for Tape Frame Cassette for 450 mm Wafer”



SNARF(s) Granted a One-Year Extension
None.

SNARF(s) Abolished
None.

Standard(s) to receive Inactive Status
None.

Special Announcements of the Committee (Workshops, Programs, etc.)
The PLP Standardization related program hosted by the 3DP&I Japan TC Chapter to be held during SEMICON Japan 2020.


Next Meeting
The next TC Chapter meeting will be held as follows.
Friday, July 10, 2020
14:30-17:30
SEMI Japan office, Tokyo, Japan