SEMI International Standards
Standards Locale: Japan
Committee: Assembly & Packaging
Place of Meeting: SEMI Japan, Tokyo, Japan
Date of Meeting: 05/08/2014
Meeting End Date: 05/08/2014
Recording SEMI Standards Staff: Naoko Tejima
CER Posted to Web: 05/13/2014


Leadership Changes
None.

Committee Structure Changes
None.

Ballot Results

Document #Document TitleCommittee ActionA&R Forms for Approved Ballots
5691New Standard: Test Method for Measurement of Chip (Die) Strength by Mean of Cantilever BendingPassed as balloted5691_Ballot_Report.pdf5691_Ballot_Report.pdf


Ratification Ballot Results
None.

Activities Approved by the GCS between meetings of TC Chapter meeting
None.

Authorized Activities
None.

Authorized Ballots
None.

SNARF(s) Granted a One-Year Extension
None.

SNARF(s) Cancelled
None.

Standard(s) to receive Inactive Status
None.

Special Announcements of the Committee (Workshops, Programs, etc.)
None.

Next Meeting
SEMI Japan Standards Summer 2014 Meetings
Monday, July 14, 2014, 15:15-17:00, SEMI Japan, Tokyo, Japan