SEMI International Standards
Standards Locale: Japan |
Committee: Physical Interfaces & Carriers |
Place of Meeting: SEMI Japan office, Tokyo |
Date of Meeting: 04/26/2018 |
Meeting End Date: 04/26/2018 |
|
Recording SEMI Standards Staff: Chie Yanagisawa |
CER Posted to Web: 04/27/2018 |
Leadership Changes
WG/TF/SC/TC Name | Previous Leader | New Leader |
Fan-Out Panel Level Packaging (FO-PLP) Panel FOUP Task Force | TF is newly formed. | Shoji Komatsu / Acteon NEXT LLC |
Committee Structure Changes
Previous WG/TF/SC Name | New WG/TF/SC Name or Status Change |
TF is newly formed. | Fan-Out Panel Level Packaging (FO-PLP) Panel FOUP Task Force |
Ballot Results
None.
Ratification Ballot Results
None.
Activities Approved by the GCS between meetings of TC Chapter meeting
None.
Authorized Activities
None.
Authorized Ballots
None.
SNARF(s) Granted a One-Year Extension
None.
SNARF(s) Cancelled
None.
Standard(s) to receive Inactive Status
None.
Special Announcements of the Committee (Workshops, Programs, etc.)
None.
Next Meeting
The next PI&C Japan TC Chapter meeting will be held as follows.
Friday, July 20, 2018
14:00-17:00
SEMI Japan office
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