SEMI International Standards
| Standards Locale: North America |
| Committee: 3DS-IC |
| Place of Meeting: SEMI Headquarters in San Jose, California |
| Date of Meeting: 04/01/2014 |
| Meeting End Date: 04/01/2014 |
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| Recording SEMI Standards Staff: Paul Trio |
| CER Posted to Web: 04/14/2014 |
Leadership Changes
Group | Previous Leader | New Leader |
| Inspection & Metrology Task Force | Yi-Shao Lai (ASE) stepped down as TF co-leader. | |
Committee Structure Changes
None.
Ballot Results
Passed ballots and line items will be submitted to the ISC Audit & Review Subcommittee for procedural review.
Failed ballots and line items were returned to the originating task forces for re-work and re-balloting.
Document # | Document Title | Committee Action | A&R Forms for Approved Ballots |
5173D | New Standard: Guide for Describing Silicon Wafers for Use in a 300 mm 3DS-IC Wafer Stack | Failed, to be reballoted |  |
5447 | New Standard: Terminology for Through Glass Via and Blind Via in Glass Geometrical Metrology | Failed, to be reballoted |  |
5693 | New Standard: Guide for Describing Silicon Wafers for Use as 300 mm Carrier Wafers in a 3DS-IC Temporary Bond-Debond (TBDB) Process | Passed as balloted |  |
5694 | New Standard: Guide for Describing Materials Properties for a 300 mm 3DS-IC Wafer Stacks | Passed with editorial changes |  |
5695 | New Standard: Guide to Describing Materials Properties for Intermediate Wafers for Use in a 300 mm 3DS-IC Wafer Stack | Passed with editorial changes |  |
Ratification Ballot Results
None.
Activities Approved by the GCS between meetings of TC Chapter meeting
None.
Authorized Activities
Listing of all new TFOFs, SNARFs, and other activities approved by the committee.
# | Type | SC/TF/WG | Details |
TBA | SNARF | Bonded Wafer Stack TF | New Standard: Specification of Glass Interposers |
TBA = to be announced
NOTE: SNARFs and TFOFs are available for review on the SEMI Web site at:
http://downloads.semi.org/web/wstdsbal.nsf/TFOFSNARF
Authorized Ballots
Listing of documents approved by the committee for letter ballot.
# | When | SC/TF/WG | Details |
5173E | Cycle 3, 2014
(or C4-14) | Bonded Wafer Stack TF | New Standard: Guide for Describing Silicon Wafers for Use in a 300 mm 3DS-IC Wafer Stack |
5447A | Cycle 3, 2014
(or C4-14) | Inspection & Metrology TF | New Standard: Terminology for Measured Geometrical Parameters of Through-Glass Vias (TGVs) in 3DS-IC Structures |
5506 | Cycle 3, 2014
(or C4-14) | Inspection & Metrology TF | New Standard: Guide for Measuring Warp, Bow and TTV on Silicon and Glass Wafers Mounted on Wire Grids by Automated Non-Contact Scanning using Laser Scanning Interferometry |
SNARF(s) Granted a One-Year Extension
None.
SNARF(s) Cancelled
None.
Standard(s) to receive Inactive Status
None.
Special Announcements of the Committee (Workshops, Programs, etc.)
None
SEMI 3DS-IC Google Site
This site contains information on 3DS-IC task forces, recent meeting information, upcoming meeting schedule, and other pertinent information:
https://sites.google.com/a/semi.org/3dsic/
Next Meeting
North America Standards Meetings at SEMICON West 2014
July 7-10, 2014
San Francisco Marriott Marquis Hotel
780 Mission Street
San Francisco, California 94103
U.S.A.
Tuesday, July 8
· Inspection & Metrology TF (8:00 AM to 10:00 AM, U.S. Pacific Time)
· Bonded Wafer Stacks TF (10:00 AM to 12:00 Noon)
· Thin Wafer Handling TF (1:00 PM to 3:00 PM)
· NA 3DS-IC Committee (3:00 PM to 5:00 PM)
For more information, please visit: http://www.semi.org/en/node/49446
For more information about SEMICON West 2014, please visit: http://www.semiconwest.org
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