SEMI International Standards
Standards Region: North America
Committee: Metrics
Place of Meeting: SEMI HQ, Milpitas, CA
Date of Meeting: 11/06/2019
Recording SEMI Standards Staff: Inna Skvortsova
CER Posted to Web: 11/15/2019


Leadership Changes

WG/TF/SC/TC Name
Previous Leader
New Leader
RF Measurement Task Force
n/a
Supika Mashiro (TEL)


Committee Structure Changes

Previous WG/TF/SC Name
New WG/TF/SC Name or Status Change
Manufacturing Ownership Diversity (MOD) TFDisbanded.


Ballot Results

Document #
Document Title
Committee Action
A&R Forms for Approved Ballots
R6472
New Standard: Test Method for Measuring Surface Metal Contamination Through ICP-MS of Critical Chamber Components Used in Semiconductor Wafer Processing
Passed
6569
Reapproval to SEMI E165-0813: Guide for a Comprehensive Equipment Training System When Dedicated Training Equipment is Not Available
Failed
6568
Reapproval to SEMI E150-0314: Guide for Equipment Training Best Practices
Failed
6567
Reapproval to SEMI E149-0314: Guide for Equipment Supplier-Provided Documentation for the Acquisition and Use of Manufacturing Equipment
Failed



Activities Approved by the GCS between meetings of TC Chapter meeting

#
Type
SC/TF/WG
Details
6578SNARFE-RAMP TFRevision to SEMI E10-0814E: Specification for Definition and Measurement of Equipment Reliability, Availability, and Maintainability (RAM) and Utilization
Approved by GCS 08/26/2019
6579SNARFE-RAMP TFRevision to SEMI E79-0814E: Specification for Definition and Measurement of Equipment Productivity
Approved by GCS 08/26/2019


Authorized Activities

#
Type
SC/TF/WG
Details
6599SNARFCCC TFLine Item Revision to SEMI E1XX (The Standard to be published based on Doc. R6472): Test Method for Measuring Surface Metal Contamination Through ICP-MS of Critical Chamber Components Used in Semiconductor Wafer Processing.


Authorized Ballots

#
When
TF
Details
6578Cycle 1-2020E-RAMP TFRevision to SEMI E10-0814E: Specification for Definition and Measurement of Equipment Reliability, Availability, and Maintainability (RAM) and Utilization
6579Cycle 1-2020E-RAMP TFRevision to SEMI E79-0814E: Specification for Definition and Measurement of Equipment Productivity
6599Cycle 1-2020CCC TFLine Item Revision to SEMI E1XX (The Standard to be published based on Doc. R6472): Test Method for Measuring Surface Metal Contamination Through ICP-MS of Critical Chamber Components Used in Semiconductor Wafer Processing.



SNARF(s) Granted a One-Year Extension
None.

SNARF(s) Abolished

#
TF
Title
6466Eq RAMPLine-Item Revision to SEMI E10-0814E: Specification for Definition and Measurement of Equipment Reliability, Availability, and Maintainability (RAM) and Utilization
Abolished due to the scope change
6469Eq RAMPLine-Item Revision to SEMI E79-0814E: Specification for Definition and Measurement of Equipment Productivity
Abolished due to the scope change


Standard(s) to receive Inactive Status

Standard Designation
Title
SEMI E165-0813Guide for a Comprehensive Equipment Training System When Dedicated Training Equipment is not Available
SEMI E150-0314Guide for Equipment Training Best Practices
SEMI E149-0314Guide for Equipment Supplier-Provided Documentation for the Acquisition and Use of Manufacturing Equipment


Special Announcements of the Committee (Workshops, Programs, etc.)
None.

Next Meeting

Next Meeting – Standards Spring 2020, SEMI HQ, CA

Tuesday, March 31, 2020

        EMC TF (11:00 – 12:00)

        ESD/ESC TF (13:00 – 14:30)

        RF Measurements TF (14:30-16:30)

Wednesday, April 1, 2020
        Equipment RAMP Metrics TF (09:00 – 11:00)

        Critical Chamber Components (CCC) Test Methods TF (12:30 – 13:30)

        Metrics NA TC Chapter (15:30 – 18:00)