# | Type | SC/TF/WG | Details |
5404 | SNARF | Int'l Test Methods TF | SNARF was modified
From:
Reapproval of SEMI MF657-0707E Test Method for Measuring Warp and Total Thickness Variation on Silicon Wafers by Noncontact Scanning
To:
Withdrawal of SEMI MF657-0707E Test Method for Measuring Warp and Total Thickness Variation on Silicon Wafers by Noncontact Scanning |
5604 | SNARF | Int'l Polished Wafer TF | SNARF was modified
From:
Revision to SEMI M1-0114, Specification for Polished Single Crystal Silicon Wafer (Re: Addition of Notchless 450 mm Wafers)
To:
Line Item Revision to SEMI M1-0114, Specification for Polished Single Crystal Silicon Wafer and SEMI M20-0110, Practice for Establishing a Wafer Coordinate System (Re: Addition of Notchless 450 mm Wafers) |
5313 | SNARF | Int'l Test Methods TF | SNARF was modified
From:
Line Item Revision of SEMI MF1535-0707 Test Method for Carrier Recombination Lifetime in Silicon Wafers by Noncontact Measurement of Photoconductivity Decay by Microwave Reflectance
To:
Revision of SEMI MF1535-0707 Test Method for Carrier Recombination Lifetime in Silicon Wafers by Noncontact Measurement of Photoconductivity Decay by Microwave Reflectance |
5701 | SNARF | Int'l Polished Wafer TF | Line Item Revision of SEMI M1-0114, Specifications for Polished Single Crystal Silicon Wafers, to correct references to test methods for measurement of front surface chemistry |
5702 | SNARF | Int'l Advanced Wafer Geometry TF | Line Item Revision to M68-1108, Practice for Determining Wafer Near-Edge Geometry from a Measured Height Data Array using a Curvature Metric, ZDD |
5703 | SNARF | Int'l Test Methods TF | New Standard: Guide for Carrier Recombination Lifetime Measurements in Electronic Grade Silicon |
5704 | SNARF | Int'l Advanced Wafer Geometry TF | Reapproval of SEMI M43-1109, Guide for Reporting Wafer Nanotopgraphy |
5705 | SNARF | Int'l Advanced Wafer Geometry TF | Reapproval of SEMI M67-1109, Practice for Determining Wafer Near-Edge Geometry from a Measured Thickness Data Array Using the ESFQR, ESFQD, and ESBIR Metrics |
5706 | SNARF | Int'l Advanced Wafer Geometry TF | Reapproval of SEMI M70-1109 Practice for Determining Wafer-Near-Edge Geometry Using Partial Wafer Site Flatness |
5707 | SNARF | Int'l Test Methods TF | Revision of SEMI M40-1109, Guide for Measurement of Roughness of Planar Surfaces on Silicon Wafers with title change to Guide for Measurement of Roughness of Planar Surfaces on Polished Wafers |
| | Int'l Test Methods TF | SEMI MF1723-1104, Practice for Evaluation of Polycrystalline Silicon Rods by Float-Zone Crystal Growth and Spectroscopy
Voted to be inactive |
| | Int'l Test Methods TF | SEMI MF1724-1104, Test Method for Measuring Surface Metal Contamination of Polycrystalline Silicon by Acid Extraction-Atomic Absorption Spectroscopy
Voted to be inactive |
| | Int'l Test Methods TF | SEMI MF1708-1104, Practice for Evaluation of Granular Polysilicon by Melter-Zoner Spectroscopies
Voted to be inactive |
# | When | SC/TF/WG | Details |
5604 | Cycle 4-14 | Int'l Polished Wafer TF | Line Item Revision to SEMI M1-0114, Specification for Polished Single Crystal Silicon Wafer and SEMI M20-0110, Practice for Establishing a Wafer Coordinate System (Re: Addition of Notchless 450 mm Wafers) |
5666 | Cycle 4-14 | Int'l Test Methods TF | Revision of SEMI MF928-314, Test Methods for Edge Contour of Circular Wafers and Rigid Disk Substrates |
5662 | Cycle 3-14 | Int'l Automated Advance Surface Inspection TF | Revision of SEMI M35-1107, Guide for Developing Specifications for Silicon Wafer Surface Features Detected by Automated Inspection |
5077 | Cycle 3-14 | Int'l Test Methods TF | Revision of SEMI M40-1109, Guide for Measurement of Roughness of Planar Surfaces on Silicon Wafers with title change to Guide for Measurement of Roughness of Planar Surfaces on Polished Wafers |
5539 | Cycle 3-14 | Int'l Advanced Wafer Geometry TF | Revision of SEMI MF1390-0707 (Reapproved 0512) With Title Change To: Test Method for Measuring Bow and Warp on Silicon Wafers by Automated NonContact Scanning |
5404 | Cycle 3-14 | Int'l Test Methods TF | Withdrawal of SEMI MF657-0707E Test Method for Measuring Warp and Total Thickness Variation on Silicon Wafers by Noncontact Scanning |