SEMI International Standards
Standards Locale: North America
Committee: Physical Interfaces & Carriers
Place of Meeting: Intel (Robert Noyce Building) in Santa Clara, California
Date of Meeting: 04/01/2015
Meeting End Date: 04/01/2015
Recording SEMI Standards Staff: Michael Tran
CER Posted to Web: 04/08/2015


Leadership Changes
None.

Committee Structure Changes
None.

Ballot Results
None.

Ratification Ballot Results
None.

Activities Approved by the GCS between meetings of TC Chapter meeting
None.

Authorized Activities
Listing of all new TFOFs, SNARFs, and other activities approved by the TC Chapter:
#
Type
SC/TF/WG
Details
5867SNARFGlobal PIC Maintenance TFLine item revision to SEMI E21-94 (Reapproved 0309), Cluster Tool Module Interface: Mechanical Interface and Wafer Transport Standard

with title change to:

Specification for Cluster Tool Module Interface: Mechanical Interface and Wafer Transport
5868SNARFGlobal PIC Maintenance TFLine item revision to SEMI E22-0697 (Reapproved 0309), Cluster Tool Module Interface: Transport Module End Effector Exclusion Volume Standard

with title change to:

Specification for Cluster Tool Module Interface: Transport Module End Effector Exclusion Volume
5869SNARFGlobal PIC Maintenance TFLine Item Revision to SEMI E84-1109, Specification for Enhanced Carrier Handoff Parallel I/O Interface
----SNARFInternational Shipping Box 450 mm TFRevision to SEMI M80-0514, Mechanical Specification For Front-Opening Shipping Box Used to Transport and Ship 450 mm Wafers

with title change to:

Specification for Front-Opening Shipping Box Used to Transport and Ship 450 mm Wafers

(Pending PIC GCS approval)
Note: SNARFs and TFOFs are available for review on the SEMI Web site at:
http://downloads.semi.org/web/wstdsbal.nsf/TFOFSNARF


Authorized Ballots
Listing of documents approved by the committee for letter ballot.
#
When
SC/TF/WG
Details
5867Cycle 5, 2015Global PIC Maintenance TFLine item revision to SEMI E21-94 (Reapproved 0309), Cluster Tool Module Interface: Mechanical Interface and Wafer Transport Standard

with title change to:

Specification for Cluster Tool Module Interface: Mechanical Interface and Wafer Transport
5868Cycle 5, 2015Global PIC Maintenance TFLine item revision to SEMI E22-0697 (Reapproved 0309), Cluster Tool Module Interface: Transport Module End Effector Exclusion Volume Standard

with title change to:

Specification for Cluster Tool Module Interface: Transport Module End Effector Exclusion Volume
5869Cycle 5, 2015Global PIC Maintenance TFLine Item Revision to SEMI E84-1109, Specification for Enhanced Carrier Handoff Parallel I/O Interface
----Cycle 5, 2015International Shipping Box 450 mm TFRevision to SEMI M80-0514, Mechanical Specification For Front-Opening Shipping Box Used to Transport and Ship 450 mm Wafers

with title change to:

Specification for Front-Opening Shipping Box Used to Transport and Ship 450 mm Wafers

(Pending PIC GCS approval)


SNARF(s) Granted a One-Year Extension
None.

SNARF(s) Cancelled
None.

Standard(s) to receive Inactive Status
None.

Special Announcements of the Committee (Workshops, Programs, etc.)
SEMICON West 2015
July 14-16, 2015
Moscone Center, San Francisco
Register Today!


Next Meeting
The next N.A. Physical Interfaces & Carriers standards meetings are tentatively scheduled for July 14-15, 2015 at the San Francisco Marriott Marquis Hotel in San Francisco, California in conjunction with the NA Standards Meetings at SEMICON West 2015. Exact meeting date and details will be announced when finalized and available at the SEMI Standards Calendar of Events: http://www.semi.org/en/Standards/CalendarEvents

Tentative Schedule:


Tuesday, July 14*

· PIC Global Maintenance TF (10:00 AM – 12:00 PM)
· Joint Int’l 450 mm PIC TF / Int’l Process Module Physical Interface TF (1:00 PM – 3:00 PM)
· Int’l 450 mm Shipping Box TF (3:00 PM – 5:00 PM)

Wednesday, July 15*
· NA Physical Interfaces & Carriers TC Chapter (9:00 AM – 12:00 PM Noon)


*All times are in Pacific Time. Times and dates are subject to change without notice.