SEMI International Standards
Standards Locale: Japan
Committee: 3D Packaging and Integration
Place of Meeting: Tokyo Big Sight / OVTCCM
Date of Meeting: 12/14/2022
Meeting End Date: 12/14/2022
Recording SEMI Standards Staff: Mami Nakajo
CER Posted to Web: 12/28/2022


Leadership Changes
None.

Committee Structure Changes
None.

Ballot Results
None.

Ratification Ballot Results
None.

Activities Approved by the GCS between meetings of TC Chapter meeting
None.

Authorized Activities

#
Type
SC/TF/WG
Details
TBDSNARF3D Packaging & Integration 5-Year Review TFReapproval of G89-0211 (Reapproved 0318) Specification for Leadframe Strip Size
TBDSNARF3D Packaging & Integration 5-Year Review TFReapproval of SEMI G71-0996 (Reapproved 0318): Specification for Barcode Marking of Intermediate Containers for Packaging Materials
TBDSNARF3D Packaging & Integration 5-Year Review TFReapproval of SEMI G69-0996 (Reapproved 0318): Test Method for Measurement of Adhesive Strength Between Leadframes and Molding Compounds
TBDSNARF3D Packaging & Integration 5-Year Review TFReapproval of SEMI G90-0811 (Reapproved 0318): Specification for 300 mm Wafer Coin-Stack Type Shipping Container Used for Test and Packaging Processes
TBDSNARF3D Packaging & Integration 5-Year Review TFReapproval of SEMI G66-96 (Reapproved 0318):Test Method for the Measurement of Water Absorption Characteristics for Semiconductor Plastic
TBDSNARF3D Packaging & Integration 5-Year Review TFReapproval of SEMI G23-0996 (Reapproved 0318): Test Method of Inductance for Internal Traces of Semiconductor Packages


Authorized Ballots

#
When
SC/TF/WG
Details
TBDCycle 2-20233D Packaging & Integration 5-Year Review TFReapproval of G89-0211 (Reapproved 0318) Specification for Leadframe Strip Size
TBDCycle 2-20233D Packaging & Integration 5-Year Review TFReapproval of SEMI G71-0996 (Reapproved 0318): Specification for Barcode Marking of Intermediate Containers for Packaging Materials
TBDCycle 2-20233D Packaging & Integration 5-Year Review TFReapproval of SEMI G69-0996 (Reapproved 0318): Test Method for Measurement of Adhesive Strength Between Leadframes and Molding Compounds
TBDCycle 2-20233D Packaging & Integration 5-Year Review TFReapproval of SEMI G90-0811 (Reapproved 0318): Specification for 300 mm Wafer Coin-Stack Type Shipping Container Used for Test and Packaging Processes
TBDCycle 2-20233D Packaging & Integration 5-Year Review TFReapproval of SEMI G66-96 (Reapproved 0318):Test Method for the Measurement of Water Absorption Characteristics for Semiconductor Plastic
TBDCycle 2-20233D Packaging & Integration 5-Year Review TFReapproval of SEMI G23-0996 (Reapproved 0318): Test Method of Inductance for Internal Traces of Semiconductor Packages


SNARF(s) Granted a One-Year Extension
None.

SNARF(s) Cancelled
None.

Standard(s) to receive Inactive Status
None.

Special Announcements of the Committee (Workshops, Programs, etc.)
None.

Next Meeting

The next meeting is scheduled for Wednesday, March 15,2022,13:30-15:30 [JST] @ OVTCCM