SEMI International Standards
Standards Locale: Japan |
Committee: 3D Packaging and Integration |
Place of Meeting: Tokyo Big Sight / OVTCCM |
Date of Meeting: 12/14/2022 |
Meeting End Date: 12/14/2022 |
|
Recording SEMI Standards Staff: Mami Nakajo |
CER Posted to Web: 12/28/2022 |
Leadership Changes
None.
Committee Structure Changes
None.
Ballot Results
None.
Ratification Ballot Results
None.
Activities Approved by the GCS between meetings of TC Chapter meeting
None.
Authorized Activities
# | Type | SC/TF/WG | Details |
TBD | SNARF | 3D Packaging & Integration 5-Year Review TF | Reapproval of G89-0211 (Reapproved 0318) Specification for Leadframe Strip Size |
TBD | SNARF | 3D Packaging & Integration 5-Year Review TF | Reapproval of SEMI G71-0996 (Reapproved 0318): Specification for Barcode Marking of Intermediate Containers for Packaging Materials |
TBD | SNARF | 3D Packaging & Integration 5-Year Review TF | Reapproval of SEMI G69-0996 (Reapproved 0318): Test Method for Measurement of Adhesive Strength Between Leadframes and Molding Compounds |
TBD | SNARF | 3D Packaging & Integration 5-Year Review TF | Reapproval of SEMI G90-0811 (Reapproved 0318): Specification for 300 mm Wafer Coin-Stack Type Shipping Container Used for Test and Packaging Processes |
TBD | SNARF | 3D Packaging & Integration 5-Year Review TF | Reapproval of SEMI G66-96 (Reapproved 0318):Test Method for the Measurement of Water Absorption Characteristics for Semiconductor Plastic |
TBD | SNARF | 3D Packaging & Integration 5-Year Review TF | Reapproval of SEMI G23-0996 (Reapproved 0318): Test Method of Inductance for Internal Traces of Semiconductor Packages |
Authorized Ballots
# | When | SC/TF/WG | Details |
TBD | Cycle 2-2023 | 3D Packaging & Integration 5-Year Review TF | Reapproval of G89-0211 (Reapproved 0318) Specification for Leadframe Strip Size |
TBD | Cycle 2-2023 | 3D Packaging & Integration 5-Year Review TF | Reapproval of SEMI G71-0996 (Reapproved 0318): Specification for Barcode Marking of Intermediate Containers for Packaging Materials |
TBD | Cycle 2-2023 | 3D Packaging & Integration 5-Year Review TF | Reapproval of SEMI G69-0996 (Reapproved 0318): Test Method for Measurement of Adhesive Strength Between Leadframes and Molding Compounds |
TBD | Cycle 2-2023 | 3D Packaging & Integration 5-Year Review TF | Reapproval of SEMI G90-0811 (Reapproved 0318): Specification for 300 mm Wafer Coin-Stack Type Shipping Container Used for Test and Packaging Processes |
TBD | Cycle 2-2023 | 3D Packaging & Integration 5-Year Review TF | Reapproval of SEMI G66-96 (Reapproved 0318):Test Method for the Measurement of Water Absorption Characteristics for Semiconductor Plastic |
TBD | Cycle 2-2023 | 3D Packaging & Integration 5-Year Review TF | Reapproval of SEMI G23-0996 (Reapproved 0318): Test Method of Inductance for Internal Traces of Semiconductor Packages |
SNARF(s) Granted a One-Year Extension
None.
SNARF(s) Cancelled
None.
Standard(s) to receive Inactive Status
None.
Special Announcements of the Committee (Workshops, Programs, etc.)
None.
Next Meeting
The next meeting is scheduled for Wednesday, March 15,2022,13:30-15:30 [JST] @ OVTCCM
Copyright ©2024 Semiconductor Equipment and Materials International (SEMI®). All rights reserved.