SEMI International Standards
Standards Locale: Japan |
Committee: 3D Packaging and Integration |
Place of Meeting: SEMI Japan office, Tokyo |
Date of Meeting: 10/11/2019 |
Meeting End Date: 10/11/2019 |
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Recording SEMI Standards Staff: Chie Yanagisawa |
CER Posted to Web: 10/25/2019 |
Leadership Changes
WG/TF/SC/TC Name | Previous Leader | New Leader |
Encapsulation Characteristics for Wafer Level Package and Panel Level Packaging TF | Not applicable
*TF is newly formed. | Tsuriya Masahiro (iNEMI)
Arai Hidetoshi (Apic-Yamada) |
3DS IC Bonded Layer Inspection Metrology TF | Not applicable
*TF is newly formed. | Ono Shigeru (Hitachi Power Solutions)
Shimamoto Haruo (AIST) |
Committee Structure Changes
Previous WG/TF/SC Name | New WG/TF/SC Name or Status Change |
The TF is newly formed. | Encapsulation Characteristics for Wafer Level Package and Panel Level Packaging TF |
The TF is newly formed. | 3DS IC Bonded Layer Inspection Metrology TF |
Ballot Results
None.
Ratification Ballot Results
None.
Activities Approved by the GCS between meetings of TC Chapter meeting
None.
Authorized Activities
# | Type | SC/TF/WG | Details |
TBD | New SNARF | PLP Glass Carrier TF | New SNARF for New Standard: Specification for Glass Carrier Characteristics for Panel Level Packaging (PLP) Applications |
Authorized Ballots
# | When | TF | Details |
6497A | Cycle 1/2-2020 | JA 450mm Assembly and Test Die Preparation Task Force | Line Item Revision to SEMI G95-0314 "Mechanical Interface Specification for 450 mm Load Port for Tape Frame Cassettes in the Backend Process" with non-conforming title change to "Specification for Mechanical Features of 450 mm Load Port for Tape Frame Cassettes in The Backend Process" |
SNARF(s) Granted a One-Year Extension
None.
SNARF(s) Cancelled
None.
Standard(s) to receive Inactive Status
Standard Designation | Title |
SEMI G57-0302 (Reapproved 1015) | Guide for Standardization of Leadframe Terminology |
SEMI G75-0698 (Reapproved 0615) | Standard Test Method of the Properties of Leadframe Tape |
SEMI G81-0307 (Reapproved 0315) | Specification for Map Data Items |
Special Announcements of the Committee (Workshops, Programs, etc.)
Information on other upcoming meetings, programs, workshops, STEPs, and other events.
The following program hosted by the 3DP&I Japan TC Chapter to be held on December 11 during SEMICON Japan 2019.
PLP Technology Challenges - Panel Discussion - Difficult Challengers for RDL on Encapsulated Surface -
Next Meeting
The next TC Chapter meeting will be held as follows.
Friday, March 6, 2020
15:00-17:00
SEMI Japan office, Tokyo, Japan
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