SEMI International Standards
Standards Region: Japan
Committee: 3D Packaging and Integration
Place of Meeting: SEMI Japan office, Tokyo
Date of Meeting: 10/11/2019
Recording SEMI Standards Staff: Chie Yanagisawa
CER Posted to Web: 10/25/2019


Leadership Changes

WG/TF/SC/TC Name
Previous Leader
New Leader
Encapsulation Characteristics for Wafer Level Package and Panel Level Packaging TFNot applicable
*TF is newly formed.
Tsuriya Masahiro (iNEMI)
Arai Hidetoshi (Apic-Yamada)
3DS IC Bonded Layer Inspection Metrology TFNot applicable
*TF is newly formed.
Ono Shigeru (Hitachi Power Solutions)
Shimamoto Haruo (AIST)


Committee Structure Changes

Previous WG/TF/SC Name
New WG/TF/SC Name or Status Change
The TF is newly formed.Encapsulation Characteristics for Wafer Level Package and Panel Level Packaging TF
The TF is newly formed.3DS IC Bonded Layer Inspection Metrology TF


Ballot Results
None.


Activities Approved by the GCS between meetings of TC Chapter meeting
None.

Authorized Activities

#
Type
SC/TF/WG
Details
TBDNew SNARFPLP Glass Carrier TFNew SNARF for New Standard: Specification for Glass Carrier Characteristics for Panel Level Packaging (PLP) Applications


Authorized Ballots

#
When
TF
Details
6497ACycle 1/2-2020JA 450mm Assembly and Test Die Preparation Task ForceLine Item Revision to SEMI G95-0314 "Mechanical Interface Specification for 450 mm Load Port for Tape Frame Cassettes in the Backend Process" with non-conforming title change to "Specification for Mechanical Features of 450 mm Load Port for Tape Frame Cassettes in The Backend Process"



SNARF(s) Granted a One-Year Extension
None.

SNARF(s) Abolished
None.

Standard(s) to receive Inactive Status

Standard Designation
Title
SEMI G57-0302 (Reapproved 1015)Guide for Standardization of Leadframe Terminology
SEMI G75-0698 (Reapproved 0615)Standard Test Method of the Properties of Leadframe Tape
SEMI G81-0307 (Reapproved 0315)Specification for Map Data Items


Special Announcements of the Committee (Workshops, Programs, etc.)
Information on other upcoming meetings, programs, workshops, STEPs, and other events.

The following program hosted by the 3DP&I Japan TC Chapter to be held on December 11 during SEMICON Japan 2019.
PLP Technology Challenges - Panel Discussion - Difficult Challengers for RDL on Encapsulated Surface -

Next Meeting
The next TC Chapter meeting will be held as follows.
Friday, March 6, 2020
15:00-17:00
SEMI Japan office, Tokyo, Japan