SEMI International Standards
|Standards Region: Japan|
|Committee: 3D Packaging and Integration|
|Place of Meeting: SEMI Japan office, Tokyo|
|Date of Meeting: 10/11/2019|
|Recording SEMI Standards Staff: Chie Yanagisawa|
|CER Posted to Web: 10/25/2019|
Committee Structure Changes
|Encapsulation Characteristics for Wafer Level Package and Panel Level Packaging TF||Not applicable|
*TF is newly formed.
|Tsuriya Masahiro (iNEMI)|
Arai Hidetoshi (Apic-Yamada)
|3DS IC Bonded Layer Inspection Metrology TF||Not applicable|
*TF is newly formed.
|Ono Shigeru (Hitachi Power Solutions)|
Shimamoto Haruo (AIST)
Activities Approved by the GCS between meetings of TC Chapter meeting
Previous WG/TF/SC Name
New WG/TF/SC Name or Status Change
|The TF is newly formed.||Encapsulation Characteristics for Wafer Level Package and Panel Level Packaging TF|
|The TF is newly formed.||3DS IC Bonded Layer Inspection Metrology TF|
|TBD||New SNARF||PLP Glass Carrier TF||New SNARF for New Standard: Specification for Glass Carrier Characteristics for Panel Level Packaging (PLP) Applications|
SNARF(s) Granted a One-Year Extension
Standard(s) to receive Inactive Status
|6497A||Cycle 1/2-2020||JA 450mm Assembly and Test Die Preparation Task Force||Line Item Revision to SEMI G95-0314 "Mechanical Interface Specification for 450 mm Load Port for Tape Frame Cassettes in the Backend Process" with non-conforming title change to "Specification for Mechanical Features of 450 mm Load Port for Tape Frame Cassettes in The Backend Process"|
Special Announcements of the Committee (Workshops, Programs, etc.)
Information on other upcoming meetings, programs, workshops, STEPs, and other events.
The following program hosted by the 3DP&I Japan TC Chapter to be held on December 11 during SEMICON Japan 2019.
PLP Technology Challenges - Panel Discussion - Difficult Challengers for RDL on Encapsulated Surface -
The next TC Chapter meeting will be held as follows.
Friday, March 6, 2020
SEMI Japan office, Tokyo, Japan
|SEMI G57-0302 (Reapproved 1015)||Guide for Standardization of Leadframe Terminology|
|SEMI G75-0698 (Reapproved 0615)||Standard Test Method of the Properties of Leadframe Tape|
|SEMI G81-0307 (Reapproved 0315)||Specification for Map Data Items|
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