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SEMI International Standards
Standards Locale: North America
Committee: MEMS / NEMS
Place of Meeting: Marriott Marquis Hotel, San Francisco, California/USA
Date of Meeting: 07/13/2017
Meeting End Date: 07/13/2017
Recording SEMI Standards Staff: Laura Nguyen
CER Posted to Web: 07/24/2017


Leadership Changes
None.

Committee Structure Changes
None.

Ballot Results

Document #
Document Title
Committee Action
A&R Forms for Approved Ballots
5267New Standard, Specification for Microfluidic Port and Pitch DimensionsFailed, returned to the TF for rework and reballot
6176Reapproval of SEMI MS1-0307 (Reapproved 0812), Guide to Specifying Wafer-Wafer Bonding Alignment TargetPassed, as balloted6176ProceduralReview.pdf6176ProceduralReview.pdf
6177Reapproval of SEMI MS10-0912, Test Method to Measure Fluid Permeation Through MEMS Packaging MaterialsPassed, as balloted6177ProceduralReview.pdf6177ProceduralReview.pdf
NOTE 1: Passed ballots and line items will be submitted to the ISC Audit & Review Subcommittee for procedural review.

NOTE 2: Failed ballots and line items were returned to the originating task forces for re-work and re-balloting or abandoning.


Ratification Ballot Results
None.

Activities Approved by the GCS between meetings of TC Chapter meeting
None.

Authorized Activities
None.

Authorized Ballots

#
When
TF
Details
5267ACycle 6 or 7, 2017MEMS MicrofluidicsNew Standard, Specification for Microfluidic Port and Pitch Dimensions


SNARF(s) Granted a One-Year Extension
None..

SNARF(s) Cancelled
None.

Standard(s) to receive Inactive Status
None.

Special Announcements of the Committee (Workshops, Programs, etc.)
None.

Next Meeting

The next meeting of the MEMS/NEMS North America TC Chapter is scheduled for Monday, November 6, at the SEMI Standards North America Fall 2017 Meetings located at SEMI Headquarters in Milpitas, California.
For more information, please visit the Standards Calendar at
http://www.semi.org/en/standards.

Tentative Schedule:

        Monday, November 6
            13:00-13:30 Microfluidics (TF)
            13:30-15:30 Joint MSIG, MEMS Substrate, and Material Characterization (TFs)
            15:30-17:00 MEMS / NEMS (C)












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