SEMI International Standards
Standards Locale: Japan
Committee: 3D Packaging and Integration
Place of Meeting: SEMI Japan office, Tokyo, Japan
Date of Meeting: 02/05/2018
Meeting End Date: 02/05/2018
Recording SEMI Standards Staff: Chie Yanagisawa
CER Posted to Web: 02/18/2018


Leadership Changes
None.

Committee Structure Changes
None.

Ballot Results
None.

Ratification Ballot Results
None.

Activities Approved by the GCS between meetings of TC Chapter meeting
None.

Authorized Activities
Listing of all revised or new SNARF(s) approved by the Originating TC Chapter.
#
SC/TF/WG
Details
3D Packaging & Integration 5 Year Review Task ForceThe name of the task force, the charter, and the scope are revised due to the integration of the two global technical committees.
TBD3D Packaging & Integration 5 Year Review Task ForceLine Item Revision to SEMI G64-96 (Reapproved 0811) “Specification for Full-Plated Integrated Circuit Leadframes (Au, Ag, Cu, Ni, Pd/Ni, Pd)”
TBD3D Packaging & Integration 5 Year Review Task ForceReapproval of SEMI G94-0113: Specification for Coin-Stack Type Tape Frame Shipping Container for 300 mm Wafer
Note 1: SNARFs and TFOFs are available for review on the SEMI Web site at:

http://downloads.semi.org/web/wstdsbal.nsf/TFOFSNARF

Authorized Ballots
None.

SNARF(s) Granted a One-Year Extension
None.

SNARF(s) Cancelled
None.

Standard(s) to receive Inactive Status

Standard Designation
Title
SEMI G72-0997 (Reapproved 0811)Specification for Ball Grid Array Design Library
SEMI G79-0200 (Reapproved 0512)Specification for Overall Digital Timing Accuracy
SEMI G80-0200 (Reapproved 0612)Test Method for the Analysis of Overall Digital Timing Accuracy for Automated Test Equipment
SEMI G91-0513Standard Test Data Format (STDF) Memory Fail Datalog


Special Announcements of the Committee (Workshops, Programs, etc.)
None.

Next Meeting
The next 3D Packaging and Integration Japan TC Chapter meeting will be held as follows.
Monday, May 21, 2018
13:30-16:30
SEMI Japan office