SEMI International Standards
| Standards Locale: North America |
| Committee: 3DS-IC |
| Place of Meeting: SEMI Headquarters in San Jose, California |
| Date of Meeting: 10/29/2013 |
| Meeting End Date: 10/29/2013 |
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| Recording SEMI Standards Staff: Paul Trio |
| CER Posted to Web: 11/04/2013 |
Leadership Changes
None.
Committee Structure Changes
None.
Ballot Results
Passed ballots and line items will be submitted to the ISC Audit & Review Subcommittee for procedural review.
Failed ballots and line items were returned to the originating task forces for re-work and re-balloting.
Document # | Document Title | Committee Action | A&R Forms for Approved Ballots |
5617 | Line Item Revisions to SEMI 3D5-0613, Guide for Metrology Techniques to be used in Measurement of Geometrical Parameters of Through-Silicon Vias (TSVs) in 3DS-IC Structures | |  |
Line Item 1 | Rewrite sections 6.1 and 6.2 for clarity | Passed as balloted. Superclean | |
Line Item 2 | Correct wording in Section 7.1 | Passed as balloted. Superclean | |
Line Item 3 | Correct wording in Section 7.4 | Passed as balloted. Superclean | |
Line Item 4 | Modify wording in Note 1 to clarify intent | Passed as balloted. Superclean | |
Line Item 5 | Correct wording in Section 9.1.1.1 | Passed as balloted. Superclean | |
Ratification Ballot Results
None.
Activities Approved by the GCS between meetings of TC Chapter meeting
None.
Authorized Activities
Listing of all new TFOFs, SNARFs, and other activities approved by the committee.
# | Type | SC/TF/WG | Details |
5506 | Revised SNARF | Inspection & Metrology TF | Changed from Test Method to Guide
New Standard: Guide for Measuring Warp, Bow and TTV on Silicon and Glass Wafers Mounted on Wire Grids by Automated Non-Contact Scanning using Laser Scanning Interferometry |
NOTE 1: The NA 3DS-IC Bonded Wafer Stacks Task Force plans to split SNARF # 5173, New Standard: Guide for Describing Materials Properties for a 300 mm 3DS-IC Wafer Stack, into smaller document development activities. Corresponding SNARFs will be submitted to the 3DS-IC Global Coordinating Subcommittee (GCS) for approval.
NOTE 2: SNARFs and TFOFs are available for review on the SEMI Web site at:
http://downloads.semi.org/web/wstdsbal.nsf/TFOFSNARF
Authorized Ballots
Listing of documents approved by the committee for letter ballot.
# | When | SC/TF/WG | Details |
5447 | Cycle 8, 2013
(or C1/C2- 2014) | Inspection & Metrology TF | New Standard: Terminology for Measured Geometrical Parameters of Through-Glass Vias (TGVs) in 3DS-IC Structures |
5616 | Cycle 8, 2013
(or C1/C2- 2014) | Inspection & Metrology TF | Revision to SEMI 3D4, Guide for Metrology for Measuring Thickness, Total Thickness Variation (TTV), Bow, Warp/Sori, and Flatness of Bonded Wafer Stacks |
NOTE 3: The NA 3DS-IC Bonded Wafer Stacks Task Force plans to split SNARF # 5173, New Standard: Guide for Describing Materials Properties for a 300 mm 3DS-IC Wafer Stack, into smaller document development activities. Corresponding ballot authorization requests will be submitted to the 3DS-IC GCS for approval.
SNARF(s) Granted a One-Year Extension
None.
SNARF(s) Cancelled
None.
Standard(s) to receive Inactive Status
None.
Special Announcements of the Committee (Workshops, Programs, etc.)
None
SEMI 3DS-IC Google Site
This site contains information on 3DS-IC task forces, recent meeting information, upcoming meeting schedule, and other pertinent information:
https://sites.google.com/a/semi.org/3dsic/
Next Meeting
North America Standards Spring 2014 Meetings
March 31 – April 3, 2014
SEMI Headquarters
3081 Zanker Road
San Jose, California 94103
U.S.A.
Tuesday, April 1
- Inspection & Metrology TF (8:00 AM to 10:00 AM, U.S. Pacific Time)
- Bonded Wafer Stacks TF (10:00 AM to 12:00 Noon)
- Thin Wafer Handling TF (1:00 PM to 3:00 PM)
- NA 3DS-IC Committee (3:00 PM to 5:00 PM)
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