SEMI International Standards
|Standards Region: North America|
|Committee: MEMS / NEMS|
|Place of Meeting: SEMI Headquarters, Milpitas, California/USA|
|Date of Meeting: 11/04/2019|
|Recording SEMI Standards Staff: Laura Nguyen|
|CER Posted to Web: 11/08/2019|
Committee Structure Changes
|MEMS/NEMS NA TC Chapter||Michelle Bourke (Lam Research)|
|MEMS Reliability Task Force (reactivated)||None||Allyson Hartzell (Veryst)|
Previous WG/TF/SC Name
New WG/TF/SC Name or Status Change
|None||MEMS Reliability Task Force (reactivated)|
#1: Passed ballots and line items will be submitted to the ISC Audit & Review Subcommittee for procedural review.
A&R Forms for Approved Ballots
|6018||New Standard: Specification for Silicon Substrates used in Fabrication of MEMS Devices||Passed, as balloted.||6018_Ballot Review_v2.pdf|
#2: Failed ballots and line items were returned to the originating task forces for re-work and re-balloting or abandoning.
Activities Approved by the GCS between meetings of TC Chapter meeting
Listing of documents authorized by the Originating TC Chapter for Letter Ballot.
SNARF(s) Granted a One-Year Extension
Standard(s) to receive Inactive Status
Special Announcements of the Committee (Workshops, Programs, etc.)
SEMI MSIG Manufacturing WG plan to meet during Flex/MSTC 2020, Feb 24-27
|MEMS Material Characterization TF||New Standard: Guide for Use of Test Patterns for Characterizing a Deep Reactive Ion Etching (DRIE) Process|
The next meeting is scheduled in conjunction with the NA Standards Spring 2020 Meetings at SEMI Headquarters in Milpitas, California, March 30-April 2, 2020. For more information, please visit the Standards Calendar at http://www.semi.org/standards.
Monday, March 30
TBD Microfluidics (TF)
10:00-12:00 MEMS / NEMS (C) and Joint MSIG, MEMS Substrate, and Material Characterization (TFs)
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