SEMI International Standards
Standards Region: North America
Committee: MEMS / NEMS
Place of Meeting: SEMI Headquarters, Milpitas, California/USA
Date of Meeting: 11/04/2019
Recording SEMI Standards Staff: Laura Nguyen
CER Posted to Web: 11/08/2019


Leadership Changes

WG/TF/SC/TC Name
Previous Leader
New Leader
MEMS/NEMS NA TC ChapterMichelle Bourke (Lam Research)
MEMS Reliability Task Force (reactivated)NoneAllyson Hartzell (Veryst)


Committee Structure Changes

Previous WG/TF/SC Name
New WG/TF/SC Name or Status Change
NoneMEMS Reliability Task Force (reactivated)


Ballot Results

Document #
Document Title
Committee Action
A&R Forms for Approved Ballots
6018New Standard: Specification for Silicon Substrates used in Fabrication of MEMS DevicesPassed, as balloted.6018_Ballot Review_v2.pdf6018_Ballot Review_v2.pdf
#1: Passed ballots and line items will be submitted to the ISC Audit & Review Subcommittee for procedural review.

#2: Failed ballots and line items were returned to the originating task forces for re-work and re-balloting or abandoning.



Activities Approved by the GCS between meetings of TC Chapter meeting
None.

Authorized Activities
None.

Authorized Ballots
Listing of documents authorized by the Originating TC Chapter for Letter Ballot.
#
When
TF
Details
6007Cycle
2-2020
MEMS Material Characterization TFNew Standard: Guide for Use of Test Patterns for Characterizing a Deep Reactive Ion Etching (DRIE) Process



SNARF(s) Granted a One-Year Extension
None.

SNARF(s) Abolished
None.

Standard(s) to receive Inactive Status
None.

Special Announcements of the Committee (Workshops, Programs, etc.)
SEMI MSIG Manufacturing WG plan to meet during Flex/MSTC 2020, Feb 24-27

Next Meeting

The next meeting is scheduled in conjunction with the NA Standards Spring 2020 Meetings at SEMI Headquarters in Milpitas, California, March 30-April 2, 2020. For more information, please visit the Standards Calendar at http://www.semi.org/standards.

Tentative Schedule:

Monday, March 30

        TBD Microfluidics (TF)
        10:00-12:00 MEMS / NEMS (C) and Joint MSIG, MEMS Substrate, and Material Characterization (TFs)