SEMI International Standards
Standards Locale: North America
Committee: 3DS-IC
Place of Meeting: San Francisco Marriott Marquis
Date of Meeting: 07/12/2016
Meeting End Date: 07/12/2016
Recording SEMI Standards Staff: Laura Nguyen
CER Posted to Web: 07/19/2016


Leadership Changes
None.

Committee Structure Changes
None.

Ballot Results
Passed ballots and line items will be submitted to the ISC Audit & Review Subcommittee for procedural review.
Failed ballots and line items were returned to the originating task forces for re-work and re-balloting.
Document #
Document Title
Committee Action
A&R Forms for Approved Ballots
5713ANew Standard: Specification for Glass Base Material for Semiconductor PackagingPassed, Super Clean5713AProceduralReview.pdf5713AProceduralReview.pdf


Ratification Ballot Results
None.

Activities Approved by the GCS between meetings of TC Chapter meeting
None.

Authorized Activities

#
Type
SC/TF/WG
Details
6075SNARFBonded Wafer Stack TFNew Standard: Guide for Describing Glass-Based Material for Use in 3DS-IC Process – SNARF to complete the two-week member review and approval by GCS
6076SNARFBonded Wafer Stack TFNew Standard: Specification for Identification and Marking for Bonded Wafer Stacks – SNARF to complete the two-week member review and approval by GCS


Authorized Ballots
None.

SNARF(s) Granted a One-Year Extension
None.

SNARF(s) Cancelled
None.

Standard(s) to receive Inactive Status
None.

Special Announcements of the Committee (Workshops, Programs, etc.)
None.

Next Meeting
The next meeting of the 3DS-IC NA TC Chapter committee is scheduled for Tuesday, November 8, 2016 at the NA Standards Fall 2016 Meetings at SEMI Headquarters.
For more information, please visit: http://www.semi.org/en/standards