SEMI International Standards
Standards Locale: North America |
Committee: 3DS-IC |
Place of Meeting: San Francisco Marriott Marquis |
Date of Meeting: 07/12/2016 |
Meeting End Date: 07/12/2016 |
|
Recording SEMI Standards Staff: Laura Nguyen |
CER Posted to Web: 07/19/2016 |
Leadership Changes
None.
Committee Structure Changes
None.
Ballot Results
Passed ballots and line items will be submitted to the ISC Audit & Review Subcommittee for procedural review.
Failed ballots and line items were returned to the originating task forces for re-work and re-balloting.
Document # | Document Title | Committee Action | A&R Forms for Approved Ballots |
5713A | New Standard: Specification for Glass Base Material for Semiconductor Packaging | Passed, Super Clean | 5713AProceduralReview.pdf |
Ratification Ballot Results
None.
Activities Approved by the GCS between meetings of TC Chapter meeting
None.
Authorized Activities
# | Type | SC/TF/WG | Details |
6075 | SNARF | Bonded Wafer Stack TF | New Standard: Guide for Describing Glass-Based Material for Use in 3DS-IC Process – SNARF to complete the two-week member review and approval by GCS |
6076 | SNARF | Bonded Wafer Stack TF | New Standard: Specification for Identification and Marking for Bonded Wafer Stacks – SNARF to complete the two-week member review and approval by GCS |
Authorized Ballots
None.
SNARF(s) Granted a One-Year Extension
None.
SNARF(s) Cancelled
None.
Standard(s) to receive Inactive Status
None.
Special Announcements of the Committee (Workshops, Programs, etc.)
None.
Next Meeting
The next meeting of the 3DS-IC NA TC Chapter committee is scheduled for Tuesday, November 8, 2016 at the NA Standards Fall 2016 Meetings at SEMI Headquarters.
For more information, please visit: http://www.semi.org/en/standards
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