SEMI International Standards
Standards Locale: Japan
Committee: Silicon Wafer
Place of Meeting: SEMI Japan office, Tokyo, Japan
Date of Meeting: 09/29/2020
Meeting End Date: 09/29/2020
Recording SEMI Standards Staff: Mami Nakajo
CER Posted to Web: 10/08/2020


Leadership Changes

WG/TF/SC/TC Name
Previous Leader
New Leader
International Polished Wafers TFYasutoshi Takamori (Global Wafers Japan) stepped down for the co-chair.Hirofumi Okano (Global Wafers Japan)
has been newly appointed


Committee Structure Changes
None.

Ballot Results
None.

Ratification Ballot Results
None.

Activities Approved by the GCS between meetings of TC Chapter meeting

#
Type
SC/TF/WG
Details
6680SNARFInternational Advanced Wafer Geometry Task ForceReapproval of M77-1015 Test Method for Determining Wafer Near-Edge Geometry Using Roll-Off Amount, ROA
6680Ballot SubmissionInternational Advanced Wafer Geometry Task ForceReapproval of M77-1015 Test Method for Determining Wafer Near-Edge Geometry Using Roll-Off Amount, ROA


Authorized Activities
None.

Authorized Ballots
None.

SNARF(s) Granted a One-Year Extension

#
TF
Title
Expiration Date
5772Japan Test Method TFSNARF for: Revision of MF391-0310: Test Methods for Minority Carrier Diffusion Length in Extrinsic Semiconductors by Measurement of Steady-state Surface photovoltage 2021/04/18
5981Japan Test Method TFSNARF for: NEW STANDARD: TEST METHOD FOR RECOMBINATION LIFETIME OF THE EPILAYER OF THE SILICON EPITAXIAL WAFER (p/p+, n/n+) BY THE SHORT WAVELENGTH EXCITAION MICROWAVE PHOTOCONDUCTIVE DECAY METHOD 2021/04/18


SNARF(s) Cancelled
None.

Standard(s) to receive Inactive Status

Standard Designation
Title
SEMI M80-0116Specification for Front-Opening Shipping Box Used to Transport and Ship 450 mm Wafers


Special Announcements of the Committee (Workshops, Programs, etc.)
*The Silicon Wafer Japan TC Chapter conducted a simulation of an Official Virtual TC Chapter Meeting during New Business section of this meeting and confirmed the Silicon Wafer Japan TC Chapter chose to opt in the Official Virtual TC Chapter Meeting by voting.

* Ryuji Takeda (GlobalWafersJapan), was recommended as the third Co-Chair.

Addendum

After the committee, the co-chairs noticed forgetting to report the following activities approved by the GCS between meetings of the TC Chapter:

6681SNARFJapan TC Chapter of Global Technical CommitteeReapproval of MF1451 Test Method for Measuring Sori on Silicon Wafers by Automated Noncontact Scanning
6681Ballot SubmissionJapan TC Chapter of Global Technical CommitteeReapproval of MF1451 Test Method for Measuring Sori on Silicon Wafers by Automated Noncontact Scanning


Next Meeting
The next TC Chapter meeting will be held as follows.
Date: Friday, January 15
Time: 13:30-17 [JST]
Place: SEMI Japan office, Tokyo Japan