SEMI International Standards
Standards Locale: Japan |
Committee: Silicon Wafer |
Place of Meeting: SEMI Japan office, Tokyo, Japan |
Date of Meeting: 09/29/2020 |
Meeting End Date: 09/29/2020 |
|
Recording SEMI Standards Staff: Mami Nakajo |
CER Posted to Web: 10/08/2020 |
Leadership Changes
WG/TF/SC/TC Name | Previous Leader | New Leader |
International Polished Wafers TF | Yasutoshi Takamori (Global Wafers Japan) stepped down for the co-chair. | Hirofumi Okano (Global Wafers Japan)
has been newly appointed |
Committee Structure Changes
None.
Ballot Results
None.
Ratification Ballot Results
None.
Activities Approved by the GCS between meetings of TC Chapter meeting
# | Type | SC/TF/WG | Details |
6680 | SNARF | International Advanced Wafer Geometry Task Force | Reapproval of M77-1015 Test Method for Determining Wafer Near-Edge Geometry Using Roll-Off Amount, ROA |
6680 | Ballot Submission | International Advanced Wafer Geometry Task Force | Reapproval of M77-1015 Test Method for Determining Wafer Near-Edge Geometry Using Roll-Off Amount, ROA |
Authorized Activities
None.
Authorized Ballots
None.
SNARF(s) Granted a One-Year Extension
# | TF | Title | Expiration Date |
5772 | Japan Test Method TF | SNARF for: Revision of MF391-0310: Test Methods for Minority Carrier Diffusion Length in Extrinsic Semiconductors by Measurement of Steady-state Surface photovoltage | 2021/04/18 |
5981 | Japan Test Method TF | SNARF for: NEW STANDARD: TEST METHOD FOR RECOMBINATION LIFETIME OF THE EPILAYER OF THE SILICON EPITAXIAL WAFER (p/p+, n/n+) BY THE SHORT WAVELENGTH EXCITAION MICROWAVE PHOTOCONDUCTIVE DECAY METHOD | 2021/04/18 |
SNARF(s) Cancelled
None.
Standard(s) to receive Inactive Status
Standard Designation | Title |
SEMI M80-0116 | Specification for Front-Opening Shipping Box Used to Transport and Ship 450 mm Wafers |
Special Announcements of the Committee (Workshops, Programs, etc.)
*The Silicon Wafer Japan TC Chapter conducted a simulation of an Official Virtual TC Chapter Meeting during New Business section of this meeting and confirmed the Silicon Wafer Japan TC Chapter chose to opt in the Official Virtual TC Chapter Meeting by voting.
* Ryuji Takeda (GlobalWafersJapan), was recommended as the third Co-Chair.
Addendum
After the committee, the co-chairs noticed forgetting to report the following activities approved by the GCS between meetings of the TC Chapter:
6681 | SNARF | Japan TC Chapter of Global Technical Committee | Reapproval of MF1451 Test Method for Measuring Sori on Silicon Wafers by Automated Noncontact Scanning |
6681 | Ballot Submission | Japan TC Chapter of Global Technical Committee | Reapproval of MF1451 Test Method for Measuring Sori on Silicon Wafers by Automated Noncontact Scanning |
Next Meeting
The next TC Chapter meeting will be held as follows.
Date: Friday, January 15
Time: 13:30-17 [JST]
Place: SEMI Japan office, Tokyo Japan
Copyright ©2024 Semiconductor Equipment and Materials International (SEMI®). All rights reserved.