SEMI International Standards
Standards Locale: Taiwan
Committee: 3D Packaging and Integration
Place of Meeting: SEMI Taiwan Office
Date of Meeting: 01/09/2018
Meeting End Date: 01/09/2018
Recording SEMI Standards Staff: Dean Chang
CER Posted to Web: 01/17/2018


Leadership Changes
None.

Committee Structure Changes
None.

Ballot Results

Document #
Document Title
Committee Action
A&R Forms for Approved Ballots
Doc 5800New Standard: Guide for Wafer Edge Trimming for 3DS-IC Process Passed with editorial changes Ballot report 5800 for A&R.pdfBallot report 5800 for A&R.pdf


Ratification Ballot Results
None.

Activities Approved by the GCS between meetings of TC Chapter meeting
None.

Authorized Activities
None.

Authorized Ballots
None.

SNARF(s) Granted a One-Year Extension
None.

SNARF(s) Cancelled
None.

Standard(s) to receive Inactive Status
None.

Special Announcements of the Committee (Workshops, Programs, etc.)
None.

Next Meeting
May 10, 2018; 14:30~16:00, SEMI Taiwan Office