SEMI International Standards
Standards Locale: North America
Committee: 3D Packaging and Integration
Place of Meeting: SEMI Headquarters
Date of Meeting: 11/07/2017
Meeting End Date: 11/07/2017
Recording SEMI Standards Staff: Laura Nguyen
CER Posted to Web: 11/16/2017


Leadership Changes

WG/TF/SC/TC Name
Previous Leader
New Leader
Fan-Out Panel Level Packaging (FO-PLP) Panel TF (new)NoneCristina Chu (TEL)
Richard Allen (NIST)


Committee Structure Changes

Previous WG/TF/SC Name
New WG/TF/SC Name or Status Change
NoneFan-Out Panel Level Packaging (FO-PLP) Panel TF (new)


Ballot Results
None.

Ratification Ballot Results
None.

Activities Approved by the GCS between meetings of TC Chapter meeting
None.

Authorized Activities

#
Type
SC/TF/WG
Details
-
TFOFFO-PLP Panel TFFan-Out Panel Level Packaging (FO-PLP) Panel TF (new)
NOTE 1: SNARFs and TFOFs are available for review on the SEMI Web site at: http://downloads.semi.org/web/wstdsbal.nsf/TFOFSNARF


Authorized Ballots
None.

SNARF(s) Granted a One-Year Extension
None.

SNARF(s) Cancelled
None.

Standard(s) to receive Inactive Status
None.

Special Announcements of the Committee (Workshops, Programs, etc.)
The Fan-Out Panel Level Packaging (FO-PLP) Panel Task Force will have its first teleconference kick-off meeting at the dates below. Cristina Chu (TEL) and Richard Allen (NIST) will lead the task force, and we encourage you to participate in the activity.

Please email Laura Nguyen (lnguyen@semi.org) for Web teleconference information.

      • Tuesday, November 28, 11:00 AM EST (8:00 AM PST, 5:00 PM CET) to accommodate members in Europe
      • Wednesday, November 29, 7:00 PM EST (4:00 PM PST; Thursday, November 30, 8:00 AM China/Taiwan, 9:00 AM Tokyo) to accommodate members in Asia


Next Meeting
The next meeting of the 3D Packaging and Integration North America TC Chapter is scheduled for Tuesday, April 10, at the SEMI Standards North America Spring 2018 Meetings located at SEMI Headquarters in Milpitas, California.
For more information, please visit the Standards Calendar at http://www.semi.org/en/standards.

Tentative Schedule:
        Tuesday, April 10
          TBD 3DP&I Bonded Wafer Stacks (TF)
          13:00-14:00 3DP&I Inspection and Metrology (TF)
          14:00-15:00 FO-PLP Panel (TF)
          15:00-17:00 3DP&I (C)