SEMI International Standards
Standards Locale: Japan |
Committee: Assembly & Packaging |
Place of Meeting: SEMI Japan, Tokyo |
Date of Meeting: 05/11/2015 |
Meeting End Date: 05/11/2015 |
|
Recording SEMI Standards Staff: Chie Yanagisawa |
CER Posted to Web: 05/21/2015 |
Leadership Changes
Group | Previous Leader | New Leader |
Japan TC Chapter of Assembly & Packaging | Yutaka Koma stepped down from co-chair | No one was newly appointed. |
Committee Structure Changes
None.
Ballot Results
Passed ballots and line items will be submitted to the ISC Audit & Review Subcommittee for procedural review.
Failed ballots and line items were returned to the originating task forces for re-work and re-balloting.
Document # | Document Title | Committee Action | A&R Forms for Approved Ballots |
5837 | Reapproval of SEMI G57-0302, Guide for Standardization of Leadframe Terminology | Passed as balloted | 5837_LetterBallotReviewSheet.pdf |
5838 | Revision to SEMI G52-90 (Reapproved 1104), Standard Test Method for Measurement of Ionic Contamination on Semiconductor Leadframes (Proposed) with title change to: Test Method for Measurement of Ionic Contamination on Semiconductor Leadframes | Passed as balloted | 5838_LetterBallotReviewSheet.pdf |
5839 | Revision to SEMI G82-0301E (Reapproved 0706), Provisional Specification for 300 mm Load Port for Frame Cassettes in Backend Process with title change to: Specification for 300 mm Load Port for Frame Cassettes in Backend Process | Passed as balloted | 5839_LetterBallotReviewSheet.pdf |
Ratification Ballot Results
None.
Activities Approved by the GCS between meetings of TC Chapter meeting
None.
Authorized Activities
Listing of all new TFOFs, SNARFs, and other activities approved by the committee.
# | Type | SC/TF/WG | Details |
5878 | SNARF | Packaging 5 Year Review TF | Line Item Revision to SEMI G20-96: SPECIFICATION FOR LEAD FINISHES FOR PLASTIC PACKAGES |
5879 | SNARF | Packaging 5 Year Review TF | Line Item Revision to SEMI G21-94: SPECIFICATION FOR PLATING INTEGRATED CIRCUIT LEADFRAMES |
5880 | SNARF | Packaging 5 Year Review TF | Line Item Revision to SEMI G41-87: SPECIFICATION FOR DUAL STRIP SOIC LEADFRAME |
5881 | SNARF | Packaging 5 Year Review TF | Reapproval of SEMI G83-0912: SPECIFICATION FOR BAR CODE MARKING OF PRODUCT PACKAGES |
Note: SNARFs and TFOFs are available for review on the SEMI Web site at:
http://downloads.semi.org/web/wstdsbal.nsf/TFOFSNARF
Authorized Ballots
Listing of documents approved by the committee for letter ballot.
# | When | SC/TF/WG | Details |
5835 | Cycle 6/7 | Thin Chip Handling TF | New Standard: Specification for adhesive tray used for 3D-IC manufacturing and shipping |
5836 | Cycle 6/7 | Thin Chip Handling TF | New Standard: Test Method for Adhesive Strength for Adhesive Tray Used for 3D-IC Manufacturing and Shipping |
5878 | Cycle 6 | Packaging 5 Year Review TF | Line Item Revision to SEMI G20-96: SPECIFICATION FOR LEAD FINISHES FOR PLASTIC PACKAGES |
5879 | Cycle 6 | Packaging 5 Year Review TF | Line Item Revision to SEMI G21-94: SPECIFICATION FOR PLATING INTEGRATED CIRCUIT LEADFRAMES |
5880 | Cycle 6 | Packaging 5 Year Review TF | Line Item Revision to SEMI G41-87: SPECIFICATION FOR DUAL STRIP SOIC LEADFRAME |
5881 | Cycle 6 | Packaging 5 Year Review TF | Reapproval of SEMI G83-0912: SPECIFICATION FOR BAR CODE MARKING OF PRODUCT PACKAGES |
SNARF(s) Granted a One-Year Extension
None.
SNARF(s) Cancelled
None.
Standard(s) to receive Inactive Status
None.
Special Announcements of the Committee (Workshops, Programs, etc.)
None.
Next Meeting
The next Japan TC Chapter meeting of Assembly & Packaging will be held as following.
Friday, October 16, 2015
15:00-17:00
SEMI Japan, Tokyo
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