SEMI International Standards
Standards Locale: Japan
Committee: Assembly & Packaging
Place of Meeting: SEMI Japan, Tokyo
Date of Meeting: 05/11/2015
Meeting End Date: 05/11/2015
Recording SEMI Standards Staff: Chie Yanagisawa
CER Posted to Web: 05/21/2015


Leadership Changes

Group
Previous Leader
New Leader
Japan TC Chapter of Assembly & PackagingYutaka Koma stepped down from co-chairNo one was newly appointed.


Committee Structure Changes
None.

Ballot Results
Passed ballots and line items will be submitted to the ISC Audit & Review Subcommittee for procedural review.
Failed ballots and line items were returned to the originating task forces for re-work and re-balloting.
Document #
Document Title
Committee Action
A&R Forms for Approved Ballots
5837Reapproval of SEMI G57-0302, Guide for Standardization of Leadframe TerminologyPassed as balloted5837_LetterBallotReviewSheet.pdf5837_LetterBallotReviewSheet.pdf
5838Revision to SEMI G52-90 (Reapproved 1104), Standard Test Method for Measurement of Ionic Contamination on Semiconductor Leadframes (Proposed) with title change to: Test Method for Measurement of Ionic Contamination on Semiconductor LeadframesPassed as balloted5838_LetterBallotReviewSheet.pdf5838_LetterBallotReviewSheet.pdf
5839Revision to SEMI G82-0301E (Reapproved 0706), Provisional Specification for 300 mm Load Port for Frame Cassettes in Backend Process with title change to: Specification for 300 mm Load Port for Frame Cassettes in Backend ProcessPassed as balloted5839_LetterBallotReviewSheet.pdf5839_LetterBallotReviewSheet.pdf


Ratification Ballot Results
None.

Activities Approved by the GCS between meetings of TC Chapter meeting
None.

Authorized Activities
Listing of all new TFOFs, SNARFs, and other activities approved by the committee.
#
Type
SC/TF/WG
Details
5878SNARFPackaging 5 Year Review TFLine Item Revision to SEMI G20-96: SPECIFICATION FOR LEAD FINISHES FOR PLASTIC PACKAGES
5879SNARFPackaging 5 Year Review TFLine Item Revision to SEMI G21-94: SPECIFICATION FOR PLATING INTEGRATED CIRCUIT LEADFRAMES
5880SNARFPackaging 5 Year Review TFLine Item Revision to SEMI G41-87: SPECIFICATION FOR DUAL STRIP SOIC LEADFRAME
5881SNARFPackaging 5 Year Review TFReapproval of SEMI G83-0912: SPECIFICATION FOR BAR CODE MARKING OF PRODUCT PACKAGES
Note: SNARFs and TFOFs are available for review on the SEMI Web site at:
http://downloads.semi.org/web/wstdsbal.nsf/TFOFSNARF


Authorized Ballots
Listing of documents approved by the committee for letter ballot.
#
When
SC/TF/WG
Details
5835Cycle 6/7Thin Chip Handling TFNew Standard: Specification for adhesive tray used for 3D-IC manufacturing and shipping
5836Cycle 6/7Thin Chip Handling TFNew Standard: Test Method for Adhesive Strength for Adhesive Tray Used for 3D-IC Manufacturing and Shipping
5878Cycle 6Packaging 5 Year Review TFLine Item Revision to SEMI G20-96: SPECIFICATION FOR LEAD FINISHES FOR PLASTIC PACKAGES
5879Cycle 6Packaging 5 Year Review TFLine Item Revision to SEMI G21-94: SPECIFICATION FOR PLATING INTEGRATED CIRCUIT LEADFRAMES
5880Cycle 6Packaging 5 Year Review TFLine Item Revision to SEMI G41-87: SPECIFICATION FOR DUAL STRIP SOIC LEADFRAME
5881Cycle 6Packaging 5 Year Review TFReapproval of SEMI G83-0912: SPECIFICATION FOR BAR CODE MARKING OF PRODUCT PACKAGES


SNARF(s) Granted a One-Year Extension
None.

SNARF(s) Cancelled
None.

Standard(s) to receive Inactive Status
None.

Special Announcements of the Committee (Workshops, Programs, etc.)
None.

Next Meeting
The next Japan TC Chapter meeting of Assembly & Packaging will be held as following.
Friday, October 16, 2015
15:00-17:00
SEMI Japan, Tokyo