Document # | Document Title | Committee Action | A&R Forms for Approved Ballots |
| 6148 | Line Item Revision to SEMI G18-96 (Reapproved 0811) “Standard for Integrated Circuit Leadframe Material Used in the Production of Etched Leadframes” with non-conforming title change to “Specification for Integrated Circuit Leadframe Material Used in the Production of Etched Leadframes” | - |  #6148_LineItemLetterBallotReviewSheet.pdf |
| Line Item 1 | Change nonconforming title | Passed as balloted
Superclean | - |
| Line Item 2 | Change section titles to meet the requirement which is specified section 3.2 of Procedure Manual | Passed as balloted
Superclean | - |
| 6149 | Line Item Revision to SEMI G38-0996 (Reapproved 0811) “Test Method for Still- and Forced-Air Junction-to-Ambient Thermal Resistance Measurements of Integrated Circuit Packages” | - |  #6149_LineItemLetterBallotReviewSheet.pdf |
| Line Item 1 | Change section titles to meet the requirement which is specified section 3.2 of Procedure Manual | Passed as balloted
Superclean | - |
| Line Item 2 | Add “Calculation” section title and get re-formatted to meet the requirement which is specified section 3.2 of Procedure Manual | Passed as balloted
Superclean | - |
| 6150 | Line Item Revision to SEMI G56-93 (Reapproved 0811) “Test Method for Measurement of Silver Plating Thickness” | - |  #6150_LineItemLetterBallotReviewSheet.pdf |
| Line Item 1 | Re-format some parts as to meet the requirement which is specified section 3.2 of Procedure Manual. | Passed as balloted
Superclean | - |
| 6151 | Line Item Revision to SEMI G65-96 (Reapproved 0811) “Test Method for Evaluation of Leadframe Materials Used for L-Leaded (Gull Wing Type) Packages” | - |  #6151_LineItemLetterBallotReviewSheet.pdf |
| Line Item 1 | Re-format some parts as to meet the requirement which is specified section 3.2 of Procedure Manual. | Passed as balloted
Superclean | - |
| 6153 | Reapproval of SEMI G90-0811: Specification for 300 mm Wafer Coin-Stack Type Shipping Container Used for Test and Packaging Processes | Passed as balloted
Superclean |  #6153_Reapproval_LetterBallotReviewSheet.pdf |
| 6155 | Line Item Revision to SEMI G62-95 (Reapproved 0811) “Test Method for Silver Plating Quality” | - |  #6155_LineItemLetterBallotReviewSheet.pdf |
| Line Item 1 | Re-format some parts as to meet the requirement which is specified section 3.2 of Procedure Manual. | Passed as balloted
Superclean | - |
| 6157 | Reapproval of SEMI G23-0996 (Reapproved 0811): Test Method of Inductance for Internal Traces of Semiconductor Packages | Passed as balloted
Superclean |  #6157_Reapproval_LetterBallotReviewSheet.pdf |
| 6158 | Reapproval of SEMI G42-0996 (Reapproved 0811): Specification for Thermal Test Board Standardization for Measuring Junction-to-Ambient Thermal Resistance of Semiconductor Packages | Passed as balloted
Superclean |  #6158_Reapproval_LetterBallotReviewSheet.pdf |
| 6159 | Reapproval of SEMI G59-94 (Reapproved 0811): Test Method for Measurement of Ionic Contamination on Leadframe Interleafing and the Contamination Transferred from the Interleafing to the Leadframes | Passed as balloted
Superclean |  #6159_Reapproval_LetterBallotReviewSheet.pdf |
| 6160 | Reapproval of SEMI G60-94 (Reapproved 0811): Test Method for the Measurement of Electrostatic Properties of Semiconductor Leadframe Interleafing Materials | Passed as balloted
Superclean |  #6160_Reapproval_LetterBallotReviewSheet.pdf |
| 6161 | Reapproval of SEMI G66-96 (Reapproved 0811): Test Method for the Measurement of Water Absorption Characteristics for Semiconductor Plastic Molding Compounds | Passed as balloted |  #6161_LetterBallotReviewSheet.pdf |
| 6162 | Reapproval of SEMI G67-0996 (Reapproved 0811): Test Method for the Measurement of Particle Generation from Sheet Materials | Passed as balloted
Superclean |  #6162_Reapproval_LetterBallotReviewSheet.pdf |
| 6163 | Reapproval of SEMI G68-0996 (Reapproved 0811): Test Method for Junction-to-Case Thermal Resistance Measurements in Air Environment for Semiconductor Packages | Passed as balloted
Superclean |  #6163_Reapproval_LetterBallotReviewSheet.pdf |
| 6164 | Reapproval of SEMI G69-0996 (Reapproved 0811): Test Method for Measurement of Adhesive Strength Between Leadframes and Molding Compounds | Passed as balloted
Superclean |  #6164_Reapproval_LetterBallotReviewSheet.pdf |
| 6165 | Reapproval of SEMI G71-0996 (Reapproved 0811): Specification for Barcode Marking of Intermediate Containers for Packaging Materials | Passed as balloted |  #6165_LetterBallotReviewSheet.pdf |
| 6166 | Reapproval of SEMI G89-0211: Specification for Leadframe Strip Size | Passed as balloted
Superclean |  #6166_Reapproval_LetterBallotReviewSheet.pdf |
# | SC/TF/WG | Details |
| TBD | SEMI G4-0302 (Reapproved 0811) | Revision to SEMI G4-0302 (Reapproved 0811): Specification for Integrated Circuit Leadframe Materials Used in the Production of Stamped Leadframes |
| TBD | SEMI G11-88 (Reapproved 0811) | Revision to SEMI G11-88 (Reapproved 0811): “Recommended Practice for RAM Follower Gel Time and Spiral Flow of Thermal Setting Molding Compounds” with non-conforming title change to “Practice for RAM Follower Gel Time and Spiral Flow of Thermal Setting Molding Compounds” |
| TBD | SEMI G13-88 (Reapproved 0811) | Revision to SEMI G13-88 (Reapproved 0811): “Standard Test Method for Expansion Characteristics of Molding Compounds” with non-conforming title change to “Test Method for Expansion Characteristics of Molding Compounds” |
| TBD | SEMI G15-93 (Reapproved 0811) | Revision to SEMI G15-93 (Reapproved 0811): “Standard Test Method for Differential Scanning Calorimetry of Molding Compounds” with non-conforming title change to “Test Method for Differential Scanning Calorimetry of Molding Compounds” |
| TBD | SEMI G24-89 (Reapproved 0811) | Revision to SEMI G24-89 (Reapproved 0811): Test Method for Measuring the Lead-to-Lead and Loading Capacitance of Package Leads |
| TBD | SEMI G25-89 (Reapproved 0811) | Revision to SEMI G25-89 (Reapproved 0811): Test Method for Measuring the Resistance of Package Leads |
| TBD | SEMI G28-0997 (Reapproved 0811) | Revision to SEMI G28-0997 (Reapproved 0811): Specification for Leadframes for Plastic Molded S.O. Packages |
| TBD | SEMI G29-1296E (Reapproved 0811) | Line Item Revision to SEMI G29-1296E (Reapproved 0811): Test Method for Trace Contaminants in Molding Compounds |
| TBD | SEMI G43-87 (Reapproved 0811) | Revision to SEMI G43-87 (Reapproved 0811): Test Method for Junction-to-Case Thermal Resistance Measurements of Molded Plastic Packages |
| TBD | SEMI G51-90 (Reapproved 0811) | Revision to SEMI G51-90 (Reapproved 0811): Specification for Plastic Molded (Metric) Quad Flat Pack Leadframes |
| TBD | SEMI G55-93 (Reapproved 0811) | Revision to SEMI G55-93 (Reapproved 0811): Test Method for Measurement of Silver Plating Brightness |