SEMI International Standards
Committee Structure Changes
|Standards Region: North America|
|Committee: 3D Packaging and Integration|
|Place of Meeting: SEMI Headquarters, Milpitas, California/USA|
|Date of Meeting: 11/07/2019|
|Recording SEMI Standards Staff: Laura Nguyen|
|CER Posted to Web: 11/21/2019|
#1: Passed ballots and line items will be submitted to the ISC Audit & Review Subcommittee for procedural review.
A&R Forms for Approved Ballots
|6555||Reapproval of SEMI 3D9-0914, Guide for Describing Materials Properties for a 300 mm 3DS-IC Wafer Stack||Passed, as balloted||6555_Ballot Review.pdf|
|6556||Reapproval of SEMI 3D10-0814, Guide to Describing Materials Properties for Intermediate Wafers for Use in a 300 mm 3DS-IC Wafer Stack||Passed, as balloted||6556_Ballot Review.pdf|
|6557||Reapproval of SEMI 3D11-1214, Terminology for Through Glass Via and Blind Via in Glass Geometrical Metrology||Passed, as balloted||6557_Ballot Review.pdf|
|6558||Reapproval of SEMI 3D12-0315, Guide for Measuring Flatness and Shape of Low Stiffness Wafers||Failed||[Ballot Results] Cycle 06-2019 3DP&I I&M_TFresponse.pdf|
#2: Failed ballots and line items were returned to the originating task forces for re-work and re-balloting or abandoning.
Activities Approved by the GCS between meetings of TC Chapter meeting
Listing of documents authorized by the Originating TC Chapter for Letter Ballot.
|6591||SNARF||PLP Panel TF||Revision to SEMI 3D20-0719, Specification for Panel Substrate Characteristics for Panel Level Packaging (PLP) Applications|
– TC Member Review took place between 09/27/2019-10/11/2019
– Approved by GCS on 10/22/2019
SNARF(s) Granted a One-Year Extension
|6591||Cycle 1 or 2-2020||PLP Panel TF||Revision to SEMI 3D20-0719, Specification for Panel Substrate Characteristics for Panel Level Packaging (PLP) Applications|
Standard(s) to receive Inactive Status
Special Announcements of the Committee (Workshops, Programs, etc.)
|6558||NA 3DP&I Committee||Reapproval of SEMI 3D12-0315, Guide for Measuring Flatness and Shape of Low Stiffness Wafers|
– Reapproval ballot failed Committee review, issue LI SNARF to address negatives.
The next meeting is scheduled in conjunction with the NA Standards Spring 2020 Meetings at SEMI Headquarters in Milpitas, California, March 30-April 2, 2020. For more information, please visit the Standards Calendar at http://www.semi.org/standards.
Thursday, April 2
11:00-12:00 Joint 3DP&I Bonded Wafer Stacks (TF) and 3DP&I Inspection and Metrology (TF)
13:00-14:00 PLP Panel (TF)
14:00-16:00 3DP&I (C)
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