SEMI International Standards
Standards Region: North America
Committee: 3D Packaging and Integration
Place of Meeting: SEMI Headquarters, Milpitas, California/USA
Date of Meeting: 11/07/2019
Recording SEMI Standards Staff: Laura Nguyen
CER Posted to Web: 11/21/2019


Leadership Changes
None.

Committee Structure Changes
None.

Ballot Results

Document #
Document Title
Committee Action
A&R Forms for Approved Ballots
6555Reapproval of SEMI 3D9-0914, Guide for Describing Materials Properties for a 300 mm 3DS-IC Wafer StackPassed, as balloted6555_Ballot Review.pdf6555_Ballot Review.pdf
6556Reapproval of SEMI 3D10-0814, Guide to Describing Materials Properties for Intermediate Wafers for Use in a 300 mm 3DS-IC Wafer StackPassed, as balloted6556_Ballot Review.pdf6556_Ballot Review.pdf
6557Reapproval of SEMI 3D11-1214, Terminology for Through Glass Via and Blind Via in Glass Geometrical MetrologyPassed, as balloted6557_Ballot Review.pdf6557_Ballot Review.pdf
6558Reapproval of SEMI 3D12-0315, Guide for Measuring Flatness and Shape of Low Stiffness WafersFailed[Ballot Results] Cycle 06-2019 3DP&I I&M_TFresponse.pdf[Ballot Results] Cycle 06-2019 3DP&I I&M_TFresponse.pdf
#1: Passed ballots and line items will be submitted to the ISC Audit & Review Subcommittee for procedural review.

#2: Failed ballots and line items were returned to the originating task forces for re-work and re-balloting or abandoning.



Activities Approved by the GCS between meetings of TC Chapter meeting

#
Type
SC/TF/WG
Details
6591SNARFPLP Panel TFRevision to SEMI 3D20-0719, Specification for Panel Substrate Characteristics for Panel Level Packaging (PLP) Applications
– TC Member Review took place between 09/27/2019-10/11/2019
– Approved by GCS on 10/22/2019


Authorized Activities
None.

Authorized Ballots
Listing of documents authorized by the Originating TC Chapter for Letter Ballot.
#
When
TF
Details
6591Cycle 1 or 2-2020PLP Panel TFRevision to SEMI 3D20-0719, Specification for Panel Substrate Characteristics for Panel Level Packaging (PLP) Applications



SNARF(s) Granted a One-Year Extension
None.

SNARF(s) Abolished

#
TF
Title
6558NA 3DP&I CommitteeReapproval of SEMI 3D12-0315, Guide for Measuring Flatness and Shape of Low Stiffness Wafers
– Reapproval ballot failed Committee review, issue LI SNARF to address negatives.


Standard(s) to receive Inactive Status
None.

Special Announcements of the Committee (Workshops, Programs, etc.)
None.

Next Meeting

The next meeting is scheduled in conjunction with the NA Standards Spring 2020 Meetings at SEMI Headquarters in Milpitas, California, March 30-April 2, 2020. For more information, please visit the Standards Calendar at http://www.semi.org/standards.

Tentative Schedule:

        Thursday, April 2
          11:00-12:00 Joint 3DP&I Bonded Wafer Stacks (TF) and 3DP&I Inspection and Metrology (TF)
          13:00-14:00 PLP Panel (TF)
          14:00-16:00 3DP&I (C)