SEMI International Standards
Standards Locale: Japan
Committee: Silicon Wafer
Place of Meeting: Tokyo Big Sight, Tokyo, Japan
Date of Meeting: 12/03/2014
Meeting End Date: 12/03/2014
Recording SEMI Standards Staff: Naoko Tejima
CER Posted to Web: 12/16/2014


Leadership Changes
None.

Committee Structure Changes
None.

Ballot Results

Document #
Document Title
Committee Action
A&R Forms for Approved Ballots
5736Line Item Revision to M41-1213 Specification of Silicon-on-Insulator (SOI) for Power Device/ICsPassed with editorial changesBallot_Review_for_5736.pdfBallot_Review_for_5736.pdf
5742Line Item Revision to M62-0514, Specifications for Silicon Epitaxial WafersPassedBallot_Review_for_5742.pdfBallot_Review_for_5742.pdf
5743Line Item Revision to SEMI M1-1014, Specifications for Polished Single Crystal Silicon WafersPassed with editorial changesBallot_Review_for_5743_3.pdfBallot_Review_for_5743_3.pdf
5771Revision to SEMI M80-0514, Mechanical Specification for Front-Opening Shipping Box used to Transport and Ship 450 mm Wafers with Title Change to Specification for Front-Opening Shipping Box used to Transport and Ship 450mm WaferFailedBallot_Review_for_5771.pdfBallot_Review_for_5771.pdf


Ratification Ballot Results
None.

Activities Approved by the GCS between meetings of TC Chapter meeting
None.

Authorized Activities

#
Type
SC/TF/WG
Details
--
SNARF
(Tentatively)
JA Test Method Task ForceLine Item Revision to SEMI Standard M085-1014: Guide for the Measurement of Trace Metal Contamination on Silicon Wafer Surface by Inductively Coupled Plasma Mass Spectrometry
5737
Revised SNARF
JA Test Method Task ForceRevision of SEMI MF1391-1107, Test Method for Substitutional Atomic Carbon Content of Silicon by Infrared Absorption


Authorized Ballots

#
When
SC/TF/WG
Details
5794
Cycle 3/4
International 450mm Wafers TFNew Standard: Specification Of Developmental 450mm Diameter Polished Single Crystal Notchless Silicon Wafers With Back Surface Fiducial Marks
5655
Cycle 3/4
International Polished Wafers TFLine Item Revision of SEMI M1-1013, Specifications for Polished Single Crystal Silicon Wafers, to update 450 mm wafers edge exclusion
5807
Cycle 2/3
International Advanced Wafer Geometry TFRevision for M77 -1110, with title change from “Practice for Determining Wafer Near-Edge Geometry Using Roll-Off Amount, ROA” to “Test Method for Determining Wafer Near-Edge Geometry Using Roll-Off Amount, ROA”
5746
Cycle 1/2
International Automated Advanced Surface Inspection TFLine Item Revision of SEMI ME1392-1109, Guide for Angle Resolved Optical Scatter Measurements on Specular or Diffuse Surfaces


SNARF(s) Granted a One-Year Extension
None.

SNARF(s) Cancelled
None.

Standard(s) to receive Inactive Status
None.

Special Announcements of the Committee (Workshops, Programs, etc.)
None.

Next Meeting
SEMI Japan Standards Spring 2015 Meetings
Friday, March 6, 2015, 13:30-17:30, SEMI Japan, Tokyo, Japan