SEMI International Standards
Standards Locale: North America |
Committee: 3DS-IC |
Place of Meeting: SEMI HQ, San Jose, Ca |
Date of Meeting: 04/05/2016 |
Meeting End Date: 04/05/2016 |
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Recording SEMI Standards Staff: Laura Nguyen |
CER Posted to Web: 04/15/2016 |
Leadership Changes
None.
Committee Structure Changes
None.
Ballot Results
Document # | Document Title | Committee Action | A&R Forms for Approved Ballots |
5713 | New Standard: Specification for Glass Base Material for Semiconductor Packaging | Failed, send back to TF for re-work and re-ballot | |
Ratification Ballot Results
None.
Activities Approved by the GCS between meetings of TC Chapter meeting
None.
Authorized Activities
None.
Authorized Ballots
# | When | SC/TF/WG | Details |
5713A | Cycle 5, 2016 | Bonded Wafer Stacks TF | New Standard: Specification for Glass Base Material for Semiconductor Packaging |
SNARF(s) Granted a One-Year Extension
None.
SNARF(s) Cancelled
None.
Standard(s) to receive Inactive Status
None.
Special Announcements of the Committee (Workshops, Programs, etc.)
None.
Next Meeting
The next meeting of the NA3DS-IC TC Chapter committee is scheduled for Tuesday, July 12, 2016 at the SEMICON West 2016 Standards Meetings in San Francisco, California.
For more information, please visit: http://www.semi.org/standards
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