SEMI International Standards
Standards Locale: North America
Committee: 3DS-IC
Place of Meeting: SEMI HQ, San Jose, Ca
Date of Meeting: 04/05/2016
Meeting End Date: 04/05/2016
Recording SEMI Standards Staff: Laura Nguyen
CER Posted to Web: 04/15/2016


Leadership Changes
None.

Committee Structure Changes
None.

Ballot Results

Document #
Document Title
Committee Action
A&R Forms for Approved Ballots
5713
New Standard: Specification for Glass Base Material for Semiconductor PackagingFailed, send back to TF for re-work and re-ballot


Ratification Ballot Results
None.

Activities Approved by the GCS between meetings of TC Chapter meeting
None.

Authorized Activities
None.

Authorized Ballots

#
When
SC/TF/WG
Details
5713ACycle 5, 2016Bonded Wafer Stacks TFNew Standard: Specification for Glass Base Material for Semiconductor Packaging


SNARF(s) Granted a One-Year Extension
None.

SNARF(s) Cancelled
None.

Standard(s) to receive Inactive Status
None.

Special Announcements of the Committee (Workshops, Programs, etc.)
None.

Next Meeting
The next meeting of the NA3DS-IC TC Chapter committee is scheduled for Tuesday, July 12, 2016 at the SEMICON West 2016 Standards Meetings in San Francisco, California.
For more information, please visit: http://www.semi.org/standards