Document # | Document Title | Committee Action | A&R Forms for Approved Ballots |
| #5664 | Line Items Revision to SEMI M59-0211, Terminology for Silicon Technology | See below |  |
| Line Item 1: Remove the definitions for 1/e lifetime (e) and primary mode lifetime (t1) from SEMI M59 and decrement paragraph numbers accordingly. | Passed as balloted |  |
| Line Item 2: Correct the definition for recombination lifetime as shown. | Passed as balloted | |
| #5687 | Line Item Revision of SEMI M60-1113, Test Method for Time Dependent Dielectric Breakdown Characteristics of Amorphous SiO2 Films for Silicon Wafer Evaluation
Line Item 1: Correct the sentence in Section 7 Summary of Method | Passed as balloted |  |
| #5607 | Line Items Revision of SEMI MF673-0305 (Reapproved 0611), Test Methods for Measuring Resistivity of Semiconductor Wafers or Sheet Resistance of Semiconductor Films with a Noncontact Eddy-Current Gauge | See below |  |
| Line Item 1: To change the citation in the standard to this document and correct the precision section so that it correctly reflects the results of the interlaboratory test. These changes are shown with turquoise highlight. | Passed as balloted | |
| Line Item 2: Several typographical errors were observed while reviewing the text. This line item of the ballot corrects these errors. These corrections are shown with bright green highlight. | Passed as balloted | |
| #5654 | Line Item Revision to SEMI M49-0613, Guide for Specifying Geometry Measurement Systems for Silicon Wafers for the 130 nm to 16 nm Technology Generations
Line Item 1 - Modify Table 4 in order to reflect the 450 mm diameter wafers, 1.5 mm Edge Exclusion specification, for 16 nm technology node as shown. | Passed as balloted |  |
| #4844C | New Standard: Guide for the Measurement of Trace Metal Contamination on Silicon Wafer Surface by Inductively Coupled Plasma Mass Spectrometry | Passed as balloted |  |
| #5404 | Withdrawal of SEMI MF657-0707E, Test Method for Measuring Warp and Total Thickness Variation on Silicon Wafers by Noncontact Scanning | Passed as balloted |  |
| #5539 | Revision to SEMI MF1390-0707 (Reapproved 0512) With Title Change To: Test Method for Measuring Bow and Warp on Silicon Wafers by Automated NonContact Scanning | Passed as balloted |  |
| #5662 | Revision of SEMI M35-1107, Guide for Developing Specifications for Silicon Wafer Surface Features Detected by Automated Inspection | Passed with editorial change |  |
| #5707 | Revision of SEMI M40-1109, With Title Change To: Guide for Measurement of Roughness of Planar Surfaces on Polished Wafers | Passed with editorial changes |  |
| #5604 | Line Item Revision to SEMI M1-0414, Specification for Polished Single Crystal Silicon Wafer and SEMI M20-0110, Practice for Establishing a Wafer Coordinate System
Line Item 1 - Revise both SEMI M1 and SEMI M20 to add a notchless category of 450 mm diameter wafers | Postponed until next earliest TC Chapter meeting |   |
| #5701 | Line Item Revision of SEMI M1-0414, Specifications for Polished Single Crystal Silicon Wafers (Subj: To correct references to test methods for measurement of front surface chemistry)
Line Item 1 - Modify §3, Table 1, Table R1-1, and R3-8.1 of SEMI M1, as needed, to remove reference to SEMI M33 and SEMI E45 and add reference to ISO 14706 and ISO 17731 in order to update and correct references to the test methods for surface chemistry | Passed as balloted |  |
| #5666 | Revision of SEMI MF928-0314, Test Methods for Edge Contour of Circular Semiconductor Wafers and Rigid Disk Substrates | Passed as balloted |  |
# | Type | SC/TF/WG | Details |
| 5403 | SNARF | Int'l Test Methods TF | SNARF was revised
From:
Reapproval of SEMI MF534-0707 Test Method for Bow of Silicon Wafers
To:
Withdrawal of SEMI MF534-0707 Test Method for Bow of Silicon Wafers |
| 5742 | SNARF | Int'l Epi Wafer TF | Line Item Revision to M62-0414 Specifications For Silicon Epitaxial Wafers |
| 5743 | SNARF | Int'l Polished Wafer TF | Line Item Revision to SEMI M1-0414, Specification for Polished Single Crystal Silicon Wafer (to remove classification 1.15 wafers) |
| 5744 | SNARF | Int'l Advance Wafer Geometry TF | Line Item Revision to SEMI M49-0613 - Guide for Specifying Geometry Measurement Systems for Silicon Wafers for the 130 nm to 16 nm Technology Generations (Re: to clarify and better define exclusion windows) |
| 5745 | SNARF | Int'l Advance Wafer Geometry TF | New Standard: Guide for Wafer Dimensional Metrology Based on Areal Image Acquisition Technology |
| 5746 | SNARF | Int'l Automated Advance Surface Inspection TF | Reapproval of SEMI ME1392-1109, Guide for Angle Resolved Optical Scatter Measurements on Specular or Diffuse Surfaces |